1. DAEDUCK Micro via PCB 8 12 9

2. Build Up Status of DAEDUCK8 12 9

3. New Factory for Build-Up Boards (Daeduck Bisuness Unit #2)
Inspection
PSR
RCC Press
Image /Etching
Cu Plating
AOI
Laser drill
Gold Plating

4. Mass Production Schedule8 12 9

5. Laser Micro Via Process Flow
Inner Layer
RCC Lamination
by Hot Press
Dry Film
Lamination
Window Image
Developing
Window Etching
Stripping Dry Film
Laser Drilling
Desmear
(Hall Cleaning)
Copper Plating 3 3 6

6. - Manufacturing Flow (Conventional PCB)8 12 9

7. - Manufacturing Flow (Type-A)8 12 9

8. - Manufacturing Flow (Type-B)8 12 9

9. - Manufacturing Flow (TYPE-C)8 12 9

10. Daeduck Bluld-Up Board Types (6Layer)1 4 1

11. Daeduck Bluld-Up Board Types (8Layer)1 4 1

12. Detailed Design Rule Laser Micro Via Hole Design Rule
Schematic Diagram of LVH C B A A C B B A C D C B A
1-2 LVH
2-3 LVH
1-3 LVH
1-2-3 LVH 1 4 1

13. Mechanical Hole Design RuleB C
IVH
PTH
Line Width/Space Design Rule OW OS IW IS 1 4 1

14. Daeduck Laser Drilling
1st shot
2nd shot
3rd shot
Cross-section of
Φ120㎛ Laser Via
mobile phone peaces per month 8 13 9

15. Laser Via Hole Reliability Data
1. Thermal Cycle Test
1) Specification
Thermal Cycle Test : IPC TM , NPS
Condition : -55℃/15min ℃/15min
Machine : BOTSCH VI7012 S2 / 2chambers / transfer time less than 10sec.
Evaluation : Resistance change less than 10%
2) Result
Resistance
change (%)
cycle
- Resistance change less than 3% : OK 8 13 9

16. - No Open&Short After Hot Oil Dip
2. Hot Oil Dip Test ( Micro Via Reliability )
Bare Board Tester
1) Specification
Good Boards
Daeduck Spec.
Evaluation : Have to stand 5times of Hot Oil Dip
Purpose : Laser Via Hole Reliability
(Cracked laser via holes result in OPEN’s)
Cool water
quenching
200℃ PEG 1min.
5 times
2) Method
Step 1 : Prepare PCB’s that passed BBT
Step 2 : Dip in 200℃ PEG for 1min.
Step 3 : Cool water quenching
Step 4 : Repeat Stpe2-3 four times. (total 5times)
Step 5 : Water rinse
Step 6 : Re-BBT (Bare Board Test)
Re - Bare Board Tester
Test Flow
3) Result
- No Open&Short After Hot Oil Dip
Laser Via
after
Hot Oil Dip
* Used Oil : Poly Ethylene Glycol (PEG) 8 13 9

17. TECHNOLOGY ROADMAP of DAEDUCK
Categories: a.Normal product; b.Build up product with microvia; c.Substrate for package