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Monolithically Coupled Photo Diode - HBT or a Photo - HBT : A Modeled Comparison
BENNY SHEINMAN, DAN RITTER MICROELECTRONIC RESEARCH CENTER ELECTRICAL ENGINEERING DEPARTMENT TECHNION – ISRAEL INSTITUTE OF TECHNOLOGY
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Workshop outline Introduction.
Phototransistor electrical configurations. General bandwidth / efficiency limitations in a photo-detector. Additional limitation in a top illuminated PIN diode / phototransistor. Electrical modeling of the top illuminated PIN diode / phototransistor.
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Phototransistor structure
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Photo-diode, HBT structure
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Photo-diode and HBT or PhotoHBT ?
HBT+photodiode same layers different layers Transistor performance Compromised: 1. Miller effect 2. Collector transit time Compromised 1. Collector transit time Optimal Responsivity Maximal Optical window Small ? Large ? Large Technology Standard Difficult
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Phototransistor configuration
Common Base Hole current flows to ground no current gain
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Phototransistor configuration
Common Collector High current gain Low output resistance limits performance.
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Phototransistor configuration
Common Emitter High current gain. Bandwidth limited by Miller effect:
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Miller Effect Integrated PIN HBT Phototransistor
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Cascode Configuration
Performance comparable to that of a PIN + HBT ?
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Current Density [KA/cm Current Density [KA/cm
Kirk effect 50 100 150 200 250 Current Density [KA/cm 2 ] Frequency [GHz] 650nm Collector F t max 50 100 150 200 250 300 Current Density [KA/cm 2 ] Frequency [GHz] 150nm Collector F max t
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Kirk effect (cont.) Associated time constant for a 1*10 emitter
and a 10 diameter optical window:
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Photodetectors bandwidth limitations
Carrier transit time: RC of detector capacitance and amplifier input resistance: M. Agethen et al. IPRM 2002
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Photodetectors quantum efficiency
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Only transit time limits performance
Ideal Amplifier Only transit time limits performance
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Base-collector junction in a phototransistor
GaInAs active layers: Base layer highly resistive -
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A top illuminated PIN as a notch filter
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Additional RC filter bandwidth limitation in a top illuminated PIN diode / phototransistor.
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RC network in a PIN detector
dr r Physical structure Electrical equivalent circuit Io1 R1 C1 Io2 R2 C2 Io3 R3 C3 IoN RN CN I1 I2 I3 I4
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Spot size radius =12.5
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Spot size radius =12.5
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Spot size radius =12.5
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Spot size radius =12.5
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Spot size radius =6
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Spot size radius =6
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Top illuminated photo-transistor option 1
Optical window Emitter Contact To base Base Metal Base Mesa
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Top illuminated photo-transistor option 2
Optical window Emitter Base Metal Base Mesa Contact To base
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Spot size radius =12.5 2 12.5 Internal contact
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Model of top illuminated detector
Solution of current equations is difficult: - distributed photocurrent Photodiode capacitance / area Yet for a known capacitance value, a single pole fit gives good results 48 0.2pF
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High efficiency phototransistors
Cover optical window with conducting transparent ITO (Indium Tin Oxide) layer. Place internal and external contact to the diode: Backside illumination.
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Overcoming the limitations
Incorporating novel structures in photo-transistors: Wave guide photodetectors Distributed phototransistors Resonant-cavity-enhanced photodetector. Uni-traveling-carrier photodiode.
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Conclusions In the cascode configuration, photo-HBT have comparable performance to PIN detector + HBT processed from the same layers. PIN detector + HBT processed from different layers will have superior performance. The highly resistive base layer produces an internal filter in the top illuminated PIN detector. The influence of the filter should be included in the model of the detector.
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