1. UCSB Testing Status Anthony Affolder
(for the UCSB module testing group)
Current testing infrastructure
Test results
Module test equipment needs
Software Needs
Current testing through-put
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

2. Testing Facilities Readiness
Clean room adjacent to production area
Room layout finished
Currently in high bay with intentionally same layout
Missing only hybrid thermal cycling test
Clean room will be finished in April
Storage cabinet with dry air flow in place for testing phase
Long term module storage cabinets under construction at KSU
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

3. UCSB Recent Infrastructure Projects
Hybrid holding plates
Matches hybrid thermal cycling test stand
Can bond and test with low noise in same holder
Burn-in low voltage distribution crate
LED indicators and fuse protection
Crowbar
HV protection circuit
12 each for FNAL/UCSB
Module cold plate
Attaches to current module holder
Hybrid clamshell
Module clamshell
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

4. Hybrid Visual Inspection
Once FNAL indicated lift off problem, closely visually inspected our 5 hybrids
Found 1 wire bond lift off
Bonds have redundancy so no failure seen
Removed broken bond to eliminate chance of short
Will closely monitor for lift off/ wire breaks throughout production process
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

5. UCSB Status-Anthony Affolder
Current UCSB ARC Setup
3 ARC Controller + 5 new ARC FE + 1 old ARC FE
1 Hybrid testing (2 Hybrid clamshells)
2 Module testing (Module clamshell)
2 LED systems
DEPP HV supply
Missing hybrid-to-utri adapters to fully use capacity
Hybrid Clamshell
ARC crate
DEPP
ARC Controller
Module Clamshell
LED Controller
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

6. ARC Hybrid Test Results (1)
5 hybrids tested on arrival
All good, but fail current requirement given in the Procedures for Module Testing
Pedestal test reproducible, but noise measured very sensitive to digitization effects
Measured noise varying the pedestal by changing VPSP value
Digitization effects cause variations larger than ±20%
Hybrid noise requirements should be changed
Ni within 50% of average
0.3 < Ni < 1.5
Removes chance of chips with uniformly low/high noise from passing requirements
See hep.ucsb.edu/cms/cmsUCSB.html for more complete description
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

7. ARC Hybrid Test Results (2)
4 hybrids have had APV bonded to pitch adapters
All channels are good
Hybrid clamshells enable testing without large pickup effects at chip edges
Hybrid isolated with base plate and lid grounded
Same requirements can be made for hybrids with or w/o PA bonded
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

8. ARC Gain Measurements (1)
Multi-point gain added to ARCS 6.0 beta software
Thanks to the Aachen group
Tests are very quick and have advantages over pulse shape measurements
More uniform
More stable
Gain linearities
Gain variations
Strongly suggest that test be added to all M800 production. Will be included TOB testing
Make requirements on gain slope, offset and fit c2
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

9. ARC Gain Measurements (2)
2 of 24 chips so far have no response with low injection values
Only occurs in peak mode inverter on
Caused by initialization defaults in ARCS tests
VPSP set too low
Thanks to T. Franke and M. Raymond for help
VPSP setting will be modified in new release
Removes all seen irregularities
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

10. ARC Module Test Results (1)
1 Prototype Module Tested
1 Production Module Tested
Module testing in UCSB clamshell decreases common-mode noise to the point where location of opens become detectable by their noise levels
PA-sensor
Sensor-sensor
Pinholes act as if saturated
High current channels can have higher noise (Bad IStrip
Slight noise increase on chip edges
Two neighboring channels have high noise only in peak inverter on
PEAK ON
Unknown Problem
Bad CAC
Bad Istrip
Sensor-sensor open
PA-sensor open
Pinhole
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

11. ARC Module Test Results (2)
PEAK ON
LED pinhole test
Bonded one inherent pinhole on purpose
Test acted as expected
120 mA needed to unsaturate pre-amp
Not clear if maximum current (400 mA) supplied sufficient to find “high current” pinholes
Pinhole
Unknown Problem
PA-sensor open
Sensor-sensor open
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

12. ARC Module Test Results (3)
PEAK ON
Pinhole
PA-sensor open
Unknown Problem
Bad CAC
Bad Istrip
Sensor-sensor open
Gain test
Pinhole clear by lack of gain
Opens clear by higher gain
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

13. ARC Test X-calibrations
Minimal X-calibration has been performed
Same faulty channels found at FNAL/UCSB on prototype model
CERN FHIT/UCSB ARC test compared
Pedestals very similar
Noise is slightly higher than CERN FHIT measurement
Not understood if it is FHIT/ARC difference, a software difference, an environmental difference, or a digitization effect
Once model production begins, plan to exchange modules with FNAL for X-calibration
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

14. UCSB Status-Anthony Affolder
ARCS Database
No entries yet put into official database
Waiting for ARCS interface for database upload and database definition to stablize
All testing results have been made available to silicon community on local website
hep.ucsb.edu/people/affolder/module_test_UCSB.html
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

15. UCSB Status-Anthony Affolder
DAQ status
1 full DAQ stand available at UCSB
Planned only for Vienna box tests with modules
Limited number of tests performed
See P. Gartung’s talk
Focus on bringing up hardware/software for Vienna box
Xdaq, LT, and Xrod software all compiled and run
Still working to understand controls/output
No LED stand planned for DAQ
No database work done as of yet
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

16. UCSB Status-Anthony Affolder
Vienna Box Status
Vienna Box recently arrived at UCSB
No modification necessary to use with TOB module carrier plates
Full compliment of plates currently in machine shop
LV distribution ready
Just received HV controllers (both the A128HS and A1303)
Integrating as fast as possible
Demonstrated each slot works with hybrids
Thermal cycled box between –25 to 30° C with chiller
Need hardware to test more than one channel at a time
See P. Gartung’s talk for more details
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

17. Current Hardware Needs
ARC Needs
1 DEPP
1 LED system
Will be picked up this week
Torino Interlock Box
In-route
3 Electrometers
2 in-route
Flat cable-Lemo adapter
Under construction at UCSB
13 hybrid-to-utri ver. D
1 in-route
Used for both ARC module and burn-in test
Limiting factor in testing through-put
Hybrid thermal cycling box
Lack hardware/software
Tests will be performed by A. Honma’s group for M800
We are aiding in the manufacturing of test stand
DAQ components
8 VUTRI
10 in-route
9 PAACB
6 in-route
1 TPO
1 in-route
1 CCU
2 PAACB to TPO interface
Needed for backplane pulsing
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

18. Current Testing Software Needs
Hybrid Characterization
Database input
Module Testing
IV scan, backplane pulsing test, database input
Module Burn-in
Rods
Beginning to assemble necessary infrastructure for rod assembly/ burn-in
Xrod and LT software package already compiled and running
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder

19. Current Estimated Testing Through-put
Hybrid Arrival Testing
24 hybrids per day
Matches peak production (+ contingency)
Requires dedicated tech
Module Basic Test
2 ARC LED stands but only 1 hybrid-to-utri version D
12 modules per day
Module Burn-in (Vienna Box)
See P. Gartung’s talk for details
Lack of hybrid-to-utri adapters limits testing through-put to 1
While burn-in test underway, no module testing possible
Module characterization test will be done at beginning/end of test cycles
ARC After Burn-in Test
Not clear how much ARC testing necessary after burn-in
Depends on grounding/pickup issues
LED is minimal test
Time estimates do not include database entry.
After finishing test equipment acquisition/integration,
database will be first priority.
L3 Testing Meeting March 7, 2003
UCSB Status-Anthony Affolder