1. OCP NIC 3.0 Discussion - Presentation to Server WG / IC
Rev 12 1/23/2018 By OCP NIC subgroup

2. Snapshot of milestones :

3. OCP NIC 3.0 form factor
#14 (out of 14) concepts is agreed by all stake holders
Thermal / Mechanical
Flexible heatsink height definition
Eliminated the complex, and discrete stacking height tradeoff
Better thermal performance for both ASIC facing up and added width
Friendly on EMI design and servicing
For baseboard not able to make cut out, it may design in the RA connector to take same OCP NIC 3.0
SI potential / form factor stability
In general edge card connector has more potential compare to Mezz style
Target to accommodate 32Gbps NRZ for connector candidate
Leverage and collaborate with SFF-TA-1002 for connector standardization
Hot service potential

4. OCP NIC 3.0 form factor - Mounting Variants
Straddle Mount Small/Large
Right Angle (RA) Small/Large

5. Specification package
To be updated on 1/24
To be updated on 1/24
To be updated on 1/24
Specification 0v70
Plan to include on 1/24
Mechanical 2D drawings (key screenshots included in specification pdf)
Thermal simulation models
Thermal testing fixture 3D model
Plan to continue work on the specification to improve details and cover more scope such as SI guideline when data is available.

6. OCP Principles Efficiency Scale Openness Impact
Spec requires and defines temperature reporting interface, and make recommendation to temperature reporting accuracy. This allows system design to have higher thermal efficiency without over cooling components.
Scale
OCP NIC 3.0 form factor optimizes serviceability for scaling out deployment
The specification defines management interface in detail to allow component and system management at scale
Openness
OCP NIC 3.0 form factor defined in community setting with open collaboration
A group of 11x companies contributed to the specification package generation, including document editing, interface definition, mechanical design and modeling, thermal modeling and simulation, management interface definition, etc.
Impact
Fulfill industry’s need of a common low profile NIC form factor to support existing and emerging use cases of network interconnect.
Reduce the complexity of system and NIC product planning, with compatible solutions.

7. Background OCP Mezz v0.5 defined ~4-5 years ago: 10G Ethernet 2x SFP
X8 PCIe Gen3
I2C sideband
OCP Mezz v2.0 defined ~1-2 years ago:
10/25/40/50/100G Ethernet
Up to 4x SFP28, 2x QSFP28, 4x RJ45
X16 PCIe Gen3
NCSI Sideband

8. Status of Mezz 2.0
Examples of adopters of OCP Mezz NIC form factor:
Broadcom
Chelsio
Intel
Mellanox
Qlogic
Quanta
Silicom
Wiwynn
Zaius (Rackspace/Google)
In general, the community is seeing healthy adoption on both the NIC side and system side
Host side connection has path to Gen4 16Gbps
board/08mm-board-to-board-signal/bergstak-plus-08mm-pcie-4-mezzanine.html
Receiving many inquiries for implementation detail
Receiving feedback for “pain points”