1. Pb-Free Design/Implementation Guide - Overview
TBD
8-81D Team
June 5, 2018
11/13/2018
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2. Agenda Who Are We? In the Beginning Content Overview
Vision
Approach
Content Overview
Content Highlights
Status of the Guide
Questions
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3. Average of ten (10) persons per meeting
Who Are We?
Close to fifty (50) different participants (globally)
Government/military organizations
Academic and non-profit organizations
Private companies (aerospace, defense, suppliers)
Close to fifty (50) team telecons since we began in 2015
Average of ten (10) persons per meeting
11/13/2018
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4. Pb In the Beginning….. Vision Approach
Bob Gregory (Rolls Royce NA, retired) generated a strawman list “Pb-free things that keep me up at night..”
Approach
Provide a collection of guidelines dealing solely with Pb-free
Not a comprehensive electronics design guide
A “delta” guide, i.e. differences between Pb-free and SnPb
Implementation aspect added in May 2017 Pb
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5. Content Overview
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6. Content Overview
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7. Content Overview From Section 2.1 of the Guide
Guide intent is to address ‘delta’ differences between SnPb and Pb-free solder technologies
Any redundant information may be result of completion or context
“Delta” differences categorized as:
Typically poorer wetting ability
Differences in appearance and inspection criteria
Typically higher melting temperature
Potential tighter process window for repair/rework
Increased potential of tin whiskers
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8. Content Highlights Comprehensive basic technical knowledge section
Pb-free Solder, Pb-free Interconnections, and Tin Whiskers
Risks
Mitigations
References/Resources
Relationships of Pb-free with PWBs
Plating/Finishing issues
Conductive Filament Formation
Pb-free crack in interconnection (Courtesy of DfR Solutions)
Tin Whiskers (Courtesy of NASA)
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9. Content Highlights cont’d
Comprehensive basic technical knowledge section cont’d
Product Qualification
Relationship with Manufacturing Processes
Soldering
Supply Chain Control
Obsolescence Management
Configuration Management
Some Pb-free soldering anomalies (from L to R): fracture, projection, fillet lift (from IPC-A-610, Courtesy of IPC)
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10. Content Highlights cont’d
Implementation (Design Strategies)
Product Design Risk Management (e.g. underfills)
Customer Risk Management
Design Process Flow
Align with basic product development process – highlight incorporation of Pb-free concerns/mitigations
From Proposal stage through Product Support
Reference for underfill graphic:
Underfill as an example of ruggedization (from IPC)
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11. Content Highlights cont’d
User Friendliness – Design/Implementation Summaries at End of Each Technical Section (Examples)
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12. Guide is released ! INTRODUCING: IPC/PERM-2901
Status of the Guide
Guide is released ! INTRODUCING: IPC/PERM-2901
11/13/2018
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13. THANK YOU ! To the entire team, THANK YOU Job well done 11/13/2018
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