1. Neil Goldsman and Akin Akturk
CPU Power
Neil Goldsman and Akin Akturk

2. Task I: Coupled Modeling of Time-Dependent Full-Chip IC and Quantum Non-Isothermal Device Operation
Pentium III
Pentium III Temperature

3. Motivation : Objective :
As devices get smaller on-chip thermal effects become increasingly important.
Predictions indicate that chip temperatures will increase exponentially beyond acceptable values.
Thus modeling of full-chip heating is essential for the design of fail-safe architectures in both 2D and 3D.
Objective :
Develop heating models for 2D and 3D IC’s.
Predict circuit and chip performance variations due to chip heating.
Test the model and develop temperature sensors by fabricating specially
designed chips.

4. Functional Blocks in Pentium III
% Area % Power
0 Bus Interface Unit
1 Clock
2 L1 Data Cache
3 Memory Order Buffer
4 Execute
5 L2 Data Cache
6 Register Alias Table
7 Issue
8 Fetch
9 Decode
Source:

5. Thermal Network Containing Millions of Nodes
MOSFET devices and their thermal connections
KCL-type lumped thermal network
Pentium has 40 million nodes
Thermal Network Containing Millions of Nodes

6. Schrödinger Eqn.
Poisson Eqn.
Electron Current Continuity Eqn.
Hole Current Continuity Eqn.
Heat flow Eqn.
Device Equations

7. Integrated Circuit Heat Flow Equation

8. Coupled Flowchart
Flowchart

9. MOSFET IV Curves for T=300K and 400K; VGS=0.4, 0.7, 1.0V
Temperature profile in the channel of a MOSFET; Far left and right corners are source and drain sides, respectively. Far side is parallel to gate terminal.
Device Simulations

10. Chip Simulations & Cooling with Thermal Contacts
Maximum chip temperature for different
device counts with constant power density.
Temperature profile for a 0.5cm IC with uniform
device activity throughout the chip: Temperature
Isotherms range from 300K at the chip edges to
360K inside chip.
Maximum chip temperature as a function of uniformly distributed thermal contacts.
Thermal contacts cool chip

11. Calculated Temperature Profile for Pentium III
Calculated Pentium III Temperature Profile with non-uniform device activity throughout the chip but with uniform device activity within each functional block:
Temperature Isotherms range from 300K at the chip edges to 340K inside the clock.
Clock and L2 Cache are the hottest and coolest regions, respectively.