Download presentation
Presentation is loading. Please wait.
Published byΕκάτη Βενιζέλος Modified over 6 years ago
1
Subject Name: Embedded system Design Subject Code: 10EC74
Prepared By: Aswini N , M N Praphul & Navya Vipin (TE) Department: ECE Date: 10/11/14 11/14/2018
2
UNIT 3 11/14/2018
3
Dynamic RAM Overview, Chip Organization A Memory Interface in Detail
TOPICS COVERED Classifying Memory Memory Interface ROM Overview Static RAM Overview Dynamic RAM Overview, Chip Organization A Memory Interface in Detail SRAM Design, DRAM Design DRAM Memory Interface The Memory Map, Memory Subsystem Architecture Basic Concepts of Caching Designing a Cache System, Dynamic Memory Allocation 11/14/2018
4
MEMORY MANAGEMENT In larger embedded applications there is a need of external memory apart from onboard memory. The memory subsystem is the place within an embedded system where instructions and data are stored. In embedded applications memory management is concerned with:- Static and dynamic allocation of memory. Avoiding dangerous allocation and minimizing/reducing overhead. Avoid deadlock situations. 11/14/2018
5
Internal Memory Types Memory Type Category Erasure Write Mechanism
Volatility Random-access memory (RAM) Read-write memory Electrically, byte-level Electrically Volatile Read-only memory (ROM) Read-only memory Not possible Masks Nonvolatile Programmable ROM (PROM) Erasable PROM (EPROM) Read-mostly memory UV light, chip-level Electrically Erasable PROM (EEPROM) Flash memory Electrically, block-level
6
MEMORY CLASSIFICATION
Two general categories of memory RAM- Random Access Memory ROM- Read Only Memory 11/14/2018
7
MEMORY CLASSIFICATION
RAM SRAM DRAM ROM PROM EPROM EEPROM 11/14/2018
8
MEMORY TYPES RAM- Random access memory DRAM- Dynamic RAM
Any location in memory is visible for immediate access. Read and Write operation are comparable. Organized as bits, bytes or words. DRAM- Dynamic RAM Dynamic random-access memory (DRAM) is a type of random-access memory that stores each bit of data in a separate capacitor within an integrated circuit. The capacitor can be either charged or discharged. 11/14/2018
9
MEMORY TYPES SRAM- Static RAM
The stored charge will be leaked if it is not repeatedly refreshed. Used for larger memory systems. I/O is asynchronous wrt external clocks. SRAM- Static RAM Complex memory cell design Uses latch mechanism. No need of Refreshment. Used for higher speed memory systems since faster than DRAM. I/O is synchronous. 11/14/2018
10
MEMORY TYPES- SRAM 11/14/2018
11
MEMORY TYPES ROM- Read only Memory PROM- Programmable ROM
ROM can only be read. Read operation is faster than Programming the ROM(writing). Organized as bits, bytes or words. PROM- Programmable ROM The device can be programmed one time using a programming device. EPROM- Erasable PROM ROM can be re programmed by erasing the program by keeping the device under uv light for specific time. 11/14/2018
12
MEMORY TYPES EEPROM- Electrically Erasable PROM FLASH Memory
Here for program is erased electrically via a programming device. FLASH Memory Flash memory was developed from EEPROM. The advantage is that it can be reprogrammed in situ ( No need to remove the device from the circuit.) 11/14/2018
13
A GENERAL MEMORY INTERFACE
Array as a simple Memory Model Index 1234 1 3456 2 FACE 3 DEAD 4 EAD3 5 BADDE 6 FEAD 7 7654 Data 11/14/2018
14
A General Memory Interface
Memory Interface diagram showing Address, Data and Control Lines. 11/14/2018
15
Terminologies used in memory
11/14/2018
16
ROM Architecture Along with Address and Data lines, ROM requires a chip select. 11/14/2018
17
ROM Read Operation 11/14/2018
18
Memory Mapping 11/14/2018
19
SRAM Design- An Example
System Specification- SRAM System that can store 4K X 16 bit words. Assumption 8 Address lines and 8 Data Lines available. Requirement- For 4KX 16 bit memory we need 12 Address lines and 16 data lines. Additional Requirements- Chip select (CS) and Output Enable (OE). 11/14/2018
20
11/14/2018
21
SRAM Write 11/14/2018
22
SRAM Read 11/14/2018
23
DRAM DESIGN/MEMORY INTERFACE
Assumption- 4M word memory chip organized as 4K rows and 1K columns. One row refreshed at a time and refreshment management done outside the chip. Need of 12 row address bits and 10 column address bits. Utilize a two phase clocking scheme derived from 50MHz source. 11/14/2018
24
DRAM DESIGN/MEMORY INTERFACE
Refresh Interval Timer Refresh Interval 128 256 9 bit Binary counter 25MHz Refresh active 11/14/2018
25
Memory Subsystem Architecture
11/14/2018
26
Concept of Caching CPU cache is a cache used by the central processing unit (CPU) of a computer to reduce the average time to access data from the main memory. The cache is a smaller, faster memory which stores copies of the data from frequently used main memory locations. Most CPUs have different independent caches, including instruction and data caches, where the data cache is usually organized as a hierarchy of more cache levels (L1, L2 etc.) 11/14/2018
27
Concept of Caching 11/14/2018
28
Cache Systems –Direct Mapping
Each location in RAM has one specific place in cache where the data will be held. 11/14/2018
29
11/14/2018
30
Associative Cache mapping
11/14/2018
31
Memory Allocation Static Memory Allocation – Initially we will be alloting a specific memory. The program knows the actual data location. Dynamic Memory Allocation- Memory is assigned during run time. 11/14/2018
Similar presentations
© 2025 SlidePlayer.com. Inc.
All rights reserved.