1. Solid State Engineering
Instructor：Prof. F. H. Wang

2. Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang
Schedule
Lectures ：
Friday 09:10-12:00 EE202)
Office Hours:
Wednesday 09:10-12:00 EE706)
Friday 13:30-17:30 EE706)
2018/11/14
Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

3. Relation to Other Courses
Electronics (電子學)
Solid State Devices (固態電子元件)
Semiconductor Devices and Physics(半導體元件物理)
Material/Thin-film Analysis (材料/薄膜分析)
Advanced VLSI Technology (超大型積體電路尖端製造技術)
2018/11/14
Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

4. Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang
Reading Materials
Primary Text:
Hong Xiao, “Introduction to Semiconductor Manufacturing Technology”, Prentice Hall, 2001, ISBN (歐亞書局)
Course Reader:
Lecture notes
2018/11/14
Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

5. Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang
Reading Materials
Reference Texts:
Fundamental:
M. Quick and J. Serda, “Semiconductor Manufacturing Technology”, Prentice Hall, 2001
Peter Van Zant, “Microchip Fabrication” McGraw Hill, 5e. 2004
Advanced:
C.Y. Chang & S.M. Sze, “ULSI Technology”, McGraw Hill, 1996.
Stanley Wolf, “ Silicon Processing for the VLSI Era ” Lattice Press
2018/11/14
Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

6. Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang
Grading
Homework (3 times) – 30%
Midterm Exam. – 30%
Final Exam – 40%
Attendance – +/-6%
100％
2018/11/14
Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

7. Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang
Exam. Schedule
Midterm Exam. – 95/11/17
Final Exam. – 96/1/12
2018/11/14
Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

8. Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang
Contents (I)
Unit I: Hot (or energetic) Processes
Diffusion
Thermal Oxidation
Ion Implantation
Rapid Thermal Processing
2018/11/14
Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

9. Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang
Contents (II)
Unit II: Pattern Transfer
Optical Lithography
Photoresists
Etching
2018/11/14
Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

10. Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang
Contents (III)
Unit III: Thin Films
Physical Deposition: Evaporation and Sputtering (chapter 12)
Chemical Vapor Deposition (chapter 13)
2018/11/14
Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang

11. Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang
Contents (VI)
Unit IV: Process Integration
Device Isolation, Contacts, and Metallization
CMOS Technologies
IC manufacturing
2018/11/14
Adv. VLSI Tech. / NCHU EE / Prof. F.H.Wang