1. North America HB-LED Committee (High-Brightness Light-Emitting Diode)
Liaison Report
April 2011

2. Outline Leadership Organization Chart Overview of Task Forces
Highlights from Recent Meetings
Feb 23, 2011 Meeting
In conjunction with Strategies in Light
Mar 31, 2011 Meeting
In conjunction with the NA Standards Spring 2011 Meetings
Upcoming Meeting Schedule
April 2011
NA HB-LED Committee

3. Leadership Committee Co-chairs Iain Black (Philips Lumileds)
Bill Quinn (Veeco)
Chris Moore (Semilab)
April 2011
NA HB-LED Committee

4. Current Committee Structure
North America HB-LED Committee
Iain Black (Philips Lumileds) Bill Quinn (Veeco) Chris Moore (Semilab)
HB-LED Wafer TF
Sunil Phatak (Rubicon)
HB-LED Factory Automation Interface TF
Daniel Babbs (Brooks) Jeff Felipe (Entegris)
HB-LED Assembly TF
Paul Reid (Kulicke & Soffa)
April 2011
NA HB-LED Committee

5. Participating Companies
AIS Automation
Aixtron
AkzoNobel Chemicals
Amkor
Brooks Automation
Cimetrix
Crossing Automation
Diamond Mat’ls Tech
Dow Corning
Entegris
EV Group
GSI Group
GT Solar
Heraeus
Hitachi High-Tech
iNEMI
Kulicke & Soffa
LayTec
Meyer Burger AG
Miraial
MKS Instruments
Namiki Precision
NeST
Novellus
OSRAM
Oxford Instruments
PEER Group
Philips Lumileds
Rubicon
Rudolph Tech
Semilab
Seoul Semicon
Shin-Etsu Polymer
Silian
Sinfonia Technology
SUMCO
SUSS Microtec
TOK America
TSMC
TXC (LED Div)
Umicore
Veeco
April 2011
NA HB-LED Committee

6. Task Force Overview HB-LED Wafer TF Charter:
Define physical geometry of wafers used in HB-LED manufacturing starting with 150 mm diameter sapphire wafers
Identified the following priorities
Wafer Fiducial (notch vs flat)
Wafer ID mark and location
Center Point Thickness/TTV, Warp, Bow, and other “flatness” parameters
Bulk Characteristic Issues
April 2011
NA HB-LED Committee

7. Task Force Overview HB-LED Equipment Automation Interfaces TF Charter
Define physical interfaces of substrate carriers as well as process and metrology tools of wafer/substrate carriers used in HB-LED manufacturing
Discussions
Developing a common vision for the future HB-LED factory
How each of the factory elements would interface together
Including software communications as well as process carriers and transport carriers in the TF scope
Identifying which existing standards can be reused and only focus on the areas which are unique to LED
Deciding on terminology for each of the carrier types which exist within an HB-LED factory
April 2011
NA HB-LED Committee

8. Task Force Overview HB-LED Assembly TF
Goal: To identify opportunities where the establishment of standards would:
Lower costs of assembly
Improve inter-operability among assembly steps or processes
Increase potential for multi-sourcing assembly equipment, materials, or services
Improve efficiency of assembly / packaging
Increase yields and/or predictability and repeatability of assembly process steps
Discussions
LED wire bonding challenges
Material handling variations, vision, wire loops
Brainstorming/seeking inputs on “standards-ripe” topics
April 2011
NA HB-LED Committee

9. TF Meetings at Strategies in Light February 23, 2011
Meeting Schedule
Wednesday, February 23
HB-LED Wafer TF (1:00 PM to 2:00 PM)
HB-LED Equipment Automation TF (2:00 PM to 3:00 PM)
HB-LED Assembly TF (3:30 PM to 4:30 PM, Pacific)
Santa Clara Convention Center in Santa Clara, California
Attendance
30 in person (+ 5 people on the phone)
Companies represented (partial list):
OSRAM, Philips Lumileds, GT Solar, Silian, Aixtron, Veeco, LayTec, AIS Automation, Amkor, Brooks, Entegris, Novellus , Kulicke & Soffa, EV Group, GSI, iNEMI, NeST, Oxford Instruments, PEER Group, Semilab, SUSS MicroTec, TOK
April 2011
NA HB-LED Committee 9

10. TF Meetings at Strategies in Light February 23, 2011
HB-LED Wafer TF
ID Mark
Wafer: flat, notch
Location: backside, wafer edge
Dimensions
Message Content
Wafer edge profile/template
Survey on HB-LED 150 mm diameter sapphire wafer characteristics
Reviewed responses to date
Improvements
Finalized and deployed in early March (broader distribution), review results at NA Spring meetings
Preliminary discussion on format/structure of SEMI draft spec
April 2011
NA HB-LED Committee

11. TF Meetings at Strategies in Light February 23, 2011
HB-LED Equipment Automation Interfaces TF
Presentations
Aixtron, “Ideas to Improve HB-LED Manufacturing by Higher Automation Level”
OSRAM, “Considerations for standardizing basic requirements in fab automation”
LayTec, “Special requirements to communication standards with respect to in-situ data”
Leveraging existing SEMI Standards (e.g., SECS/GEM, Interface A), identifying gaps
To establish agreement on types of carriers used as well as terminology
To draft list of terminology then circulate for input
April 2011
NA HB-LED Committee

12. TF Meetings at Strategies in Light February 23, 2011
HB-LED Assembly TF
Reviewed Assembly TF charter and scope
Agreement on definitions and terminology
Review of LED assembly
Scope within LED manufacturing (vs semiconductor)
Wire bonding challenges
Standardization challenges (variations, IP, etc.)
Develop and deploy survey to collect inputs on areas that can be standardized
April 2011
NA HB-LED Committee

13. HB-LED Standards Spring 2011 Meetings March 31, 2011
Wafer TF
Reviewed wafer survey results received thus far
Key discussions
Wafer ID mark locations (top, bottom, edge)
Edge chamfer spec
Orientation fiducials
Equipment Automation TF
Automation software presentations
Equipment Data Acquisition (EDA) overview & benefits
SECS/GEM – EDA Comparison
SEMI Standards needs for automated MOCVD tools
Physical interfaces discussion
Identified components and critical features
Assembly TF
Reviewed proposed HB-LED assembly improvements questionnaire
HB-LED Technical Committee
Considerations for HB-LED/EHS Standards Development
Presentation proposal for Test & Measurements Task Force
April 2011
NA HB-LED Committee

14. Calendar for HB-LED Next meetings
Task Force meetings leading up to SEMICON West 2011
Conducted via teleconference/web meeting
Please contact Paul Trio for latest schedule
SEMICON West 2011 (July 11-14)
Thursday, July 14 (proposed)
Wafer TF (8:00 AM to 10:00 AM)
Equipment Automation TF (10:00 AM to 2:00 PM)
Assembly TF (2:00 PM to 3:00 PM)
HB-LED Committee (3:30 PM to 4:30 PM)
San Francisco Marriott Marquis Hotel
Across from Moscone Convention Center
April 2011
NA HB-LED Committee 14

15. Call for Industry Participation
HB-LED Wafer Survey
150 mm diameter sapphire wafers for HB-LED device fabrication
Inputs on HB-LED Assembly
Biggest cost drivers of LED assembly / packaging
Assembly step or process that is inherently costly or inefficient
Possible problem spots in: fixturing | materials | handling systems | dimensions (die, package, footprint, length) | optical or vision systems | compliance with specs
April 2011
NA HB-LED Committee

16. Thank You!
For more information or participate in any NA HB-LED activities, please contact Paul Trio at SEMI
April 2011
NA HB-LED Committee

17. Backup
April 2011
NA HB-LED Committee

18. Timeline
HB-LED Steering Committee Agreement to form HB-LED Standards Committee
Agreed – Sept 23, 2010
NARSC Endorsement of Petition
Completed – Oct 15, 2010
ISC Approval of Petition
Completed – Nov 4, 2010
First NA HB-LED Standards Committee Meeting
Completed – Nov 11, 2010 (in San Jose)
April 2011
NA HB-LED Committee

19. Scope for Global and NA HB-LED Committee
To include liaisons and synergies with other SEMI technical committees for the development of HB-LED-related standards.
The HB-LED standards committee scope is limited to exploring and developing standards that pertain to common criteria, guidelines, methods for control and comparison of HB-LED-related materials, carriers and automation systems. It will seek to support the international need for increasing HB-LED product / process yield and reducing related HB-LED costs per Lumen.
In addition to the above, the committee will also facilitate any industry initiatives towards product standardization needs.
April 2011
NA HB-LED Committee

20. NA HB-LED Committee Kick-off Meeting Nov 11 in conjunction with NA Standards Fall 2010 Mtgs
Attendance
18 people in person (+15 people on the phone)
Companies represented include:
Aixtron, AMAT, Brooks Automation, Cimetrix, Entegris, Kulicke & Soffa, Oxford Instruments, Philips, Semilab, SUMCO, Veeco
Four TFs proposed
Wafers, Carriers, Assembly, Automation
Approved formation of the HB-LED Wafer Task Force
April 2011
NA HB-LED Committee

21. Task Force Overview HB-LED Wafer TF (cont’d)
First TF meeting held January 10 and identified the following priorities:
Wafer Fiducial (notch vs flat)
Wafer ID Mark
Center Point Thickness/TTV, Warp, Bow, and other “flatness” parameters
Bulk Characteristic Issues
Second TF meeting held January 28
Technical discussion on preliminary values for 150 mm sapphire wafers for use in HB-LED device fabrication
Diameter tolerance, center point thickness, TTV, bow & warp, orientation fiducial, ID mark, surface finish, edge profile, edge finish
TF developing a survey covering these topics, to be deployed in early March for input
April 2011
NA HB-LED Committee

22. Task Force Updates HB-LED Equipment Automation Interfaces TF
Formerly Carrier TF and Automation TF
Motivations for combining
HB-LED Factory Requirements still developing
The carrier is one component of the factory automation system
But, it is the interface to multiple other components
Load port, storage, lot ID, etc
A combined TF will benefit from having all suppliers participate in the discussion of these interfaces and their inter-dependencies.
As the basic requirements unfold sub-groups will be formed for focused discussion on each component of the factory automation.
April 2011
NA HB-LED Committee

23. Task Force Updates HB-LED Assembly TF (cont’d)
First TF meeting held February 3
Reviewed Assembly Task Force TFOF
Agreement on definitions and terminology
Quick review of LED "Assembly"
to spur some thoughts from those not in assembly
A touch of LED wire bonding challenges
Material handling variations, vision, wire loops
Suggestions for next meeting
Brainstorming/collecting inputs on directions to take
Looking for lowest hanging fruit to standardize
April 2011
NA HB-LED Committee