1. Hamburg Bonding Report
Georg Steinbrück
Hamburg University
CMS Meeting June 2004
Report from Hamburg
Pull tests stats
Loop heights
ARC tests
G. Steinbrück
June 2004

2. Bonding in Hamburg
Hamburg was recently officially certified for bonding
Sent 3 modules to CERN for inspection
Have bonded 37 Modules in Hamburg so far
8 R1N 13 R1S 16 R3
20 more modules HV bonded
Throughput impacted by
Need to support sensors under HV bonds by inserting capton tape
Pull tests: Basically increases bonding time x2
HV and Sensor Bonding in two steps
G. Steinbrück
June 2004

3. Experience
Initially had a lot of trouble with the HV bonds and outer sensor bonds since sensor not well supported in this area
Went through some trouble building a good bonding jig
Had glueing scheme for frame adjusted: Glue spots carbon-capton and capton-sensor were NOT aligned, now alignedResults look much better, but additional support still needed
Some PA‘s were not glued parallel, making bonding hard
We gave feedback to gantries, problems known/solved
G. Steinbrück
June 2004

4. Module 30200020029287 One recent example of a glueing problem
G. Steinbrück
June 2004

5. Pull Test Results PA test Area
R1N
R1S R3
Based on 30 modules.
G. Steinbrück
June 2004

6. Pull Test Results 50th wire PA-Sensor
R1S
R1N R3
Based on 30 modules.
G. Steinbrück
June 2004

7. Loop heights PA test bonds PA-sensor bonds 280 mus ~30 deg 1mm 30 deg
Sorry, no pictures...
G. Steinbrück
June 2004

8. ARC tests
ARCS 7.0 with TIB one sensor cuts (except for noise cuts For R1)
Xml files with Xflag 4.2
G. Steinbrück
June 2004

9. ARC tests: Cuts Correct R1 cuts by difference in noise means
G. Steinbrück
June 2004

10. Statistics details… 37 Modules bonded in HH, 30 tested 32019
22 grade A, 4 grade C
no new pinholes found
7 faulty modules
3/131 fail initial ARC fast test
32019
Sent out w/o full test
bent hybrid bonds, in bond center for repairNot fully tested
root file?
G. Steinbrück
June 2004

11. Fault stats Ring 3
G. Steinbrück
June 2004

12. Fault stats Ring 1
G. Steinbrück
June 2004

13. IV curves R1 and R3
Module already had high current before PA-Sensor bonding. Graded AF (IMOD>5xISen)
G. Steinbrück
June 2004

14. Test Results on the Web
Thanks to Marko Dragicevic (Wien) for supplying the scripts!
G. Steinbrück
June 2004

15. Web
G. Steinbrück
June 2004

16. Summary Bonded and tested 37 modules +20 modules HV bonded
Bonding rates are increasing
Quality of gluing of modules is critical and has improved
Pull test results look goode
ARC tests + uploading to db routine now
4 grade C modules
G. Steinbrück
June 2004

17. Backup
G. Steinbrück
June 2004

18. Module 30200020032011 Bad APV Cosmic run Two events in a cosmic run
Difference max and min PH in ARC LED test
G. Steinbrück
June 2004

19. Module (R1S) 38
Difference max and min PH in ARC LED test
Mean pedestal versus pipeline for bad APV
G. Steinbrück
June 2004

20. Module 30200020032019 Difference max and min PH in ARC LED test
Mean pedestal versus pipeline for bad APV
G. Steinbrück
June 2004

21. Module 38
G. Steinbrück
June 2004

22. ARC testing in Hamburg 30 Modules bonded and tested
22 grade A, 4 grade C
no new pinholes found
7 faulty modules
3/131 fail initial ARC fast test
30 Modules bonded and tested
Using ARCS 7.0 and Xflag 4.2
Keeping up with database
G. Steinbrück
June 2004

23. Bonding in Hamburg R1N R1S R3 30 Modules bonded
initial issues with HV bonds/glue resolved
G. Steinbrück
June 2004

24. Currents before and after Sensor Bonding
G. Steinbrück
June 2004