1. Japan PI&C Committee Liaison Report
NA Spring Standards Meetings, 2012
San Jose, California

2. <Region> <Committee>
Outline
Leadership
Organization Chart
Meeting Information
Ballot Results/Upcoming Ballots
New TFOF/SNARF
TF reports
STEP
<Month> <Year>
<Region> <Committee>

3. <Region> <Committee>
Leadership
Committee Co-chairs
Shoji Komatsu (Acteon)
Tsuyoshi Nagashima (Miraial)
Tsutomu Okabe (TDK)
Technical Architect
Takao Nojima(Intel)
<Month> <Year>
<Region> <Committee>

4. Current Japan PI&C Committee Structure
Physical Interfaces & Carriers Committee
C: Shoji Komatsu / Acteon
C: Tsuyoshi Nagashima / Miraial
C: Tsutomu Okabe / TDK
TA: Takao Nojima / Intel
Global PI&C Standards
Maintenance TF
JA: Shoji Komatsu / Acteon NA: Larry Hartsough/ UA Associates
Int’l PI&C 450mm TF
JA: Shoji Komatsu / Acteon
NA: Mutaz Haddadin/Intel
Int’l Reticle SMIF Pod and LP Interoperability TF
L: Astrid Gettel (GLOBALFOUNDRIES)
L: Tom Kielbaso (Entegris)
L: Koji Oyama (Dainichi Shoji)
JA Shipping Box TF
(under Japan Si Wafer Committee)
Yasuhiro Shimizu/ Consultant
Shoji Komatasu/ Acteon
International 450mm Shipping Box TF
(under Japan Si Wafer Committee)
Yasuhiro Shimizu/ Consultant
Tom Quinn/ Intel
Int’l Process Module Physical Interface (IPPI) TF
L: Supika Mashiro (TEL)
L: Richard Oechsner (Fraunhofer)
<Month> <Year>
<Region> <Committee>

5. <Region> <Committee>
Meeting Information
Last meeting
9 December, 2011
In conjunction with SEMICON Japan 2011, Chiba, Japan
Next meeting
13 April, 2012
SEMI Japan, Tokyo, Japan
<Month> <Year>
<Region> <Committee>

6. Recently Published Documents
AUX , Overview Guide to SEMI Standard for 450 mm
<Month> <Year>
<Region> <Committee>

7. Ballot Result/ Upcoming Ballot
Doc. 5205, Revision to SEMI E , Mechanical Interface Specification for 450 mm Load Port
was developed by 450 mm IPIC TF
was passed with editorial changes at the previous Japan PI&C Committee last December 2011.
will be published soon.
Upcoming Ballots – Cycle1, 2012
Doc. 5363, Removal of SEMI E , Specification for Electrical Interface, Japan Only
is adjudicated at the NA PIC Committee in the NA Spring meetings 2012.
Doc. 5364, Revision to SEMI E , Mechanical Interface Specification for 450 mm Front-Opening Shipping Box Load Port
<Month> <Year>
<Region> <Committee>

8. <Region> <Committee>
New TFOF/SNARF
New TFOF
None
New SNARF
Doc. 5363, Removal of SEMI E , Specification for Electrical Interface, Japan Only
Originated by the Global PIC Maintenance TF
Doc. 5364, Revision to SEMI E , Mechanical Interface Specification for 450 mm Front-Opening Shipping Box Load Port
Originated by the 450 mm IPIC TF
<Month> <Year>
<Region> <Committee>

9. <Region> <Committee>
450mm IPIC Task Force
Leader
Shoji Komatsu (Acteon)
Current activity
Doc. 5364, Revision to SEMI E , Mechanical Interface Specification for 450 mm Front-Opening Shipping Box Load Port
Developed and balloted in Cycle1, 2012.
<Month> <Year>
<Region> <Committee>

10. Global PIC Standards Maintenance Task Force (JA Side)
Leader
Shoji Komatsu (Acteon)
Current activity
Doc. 5363, Removal of SEMI E , Specification for Electrical Interface, Japan Only
Developed and balloted in Cycle1, 2012.
<Month> <Year>
<Region> <Committee>

11. Int’l Reticle SMIF Pod and LP Interoperability TF
Leader
Koji Oyama (Dainichi Shoji)
Current activity
Continuing revision activity of E111, E112, E19, and E19.4
Doc. 5261, Revisions to SEMI E111, Mechanical Specification for a 150 mm Reticle SMIF Pod (RSP150) Used to Transport and Store a 6 Inch Reticle SEMI E112, Mechanical Specification for a 150 mm Multiple Reticle SMIF Pod (MRSP150) Used to Transport and Store Multiple 6 Inch Reticles SEMI 19, Standard Mechanical Interface (SMIF) SEMI E19.4, 200 mm Standard Mechanical Interface (SMIF) Improving RSP sensing on RSP load ports
<Month> <Year>
<Region> <Committee>

12. International Process Module Physical Interface (IPPI) TF
Leader
Supika Mashiro (TEL)
Current activity
The TF carried out a survey for “450mm Process Module Physical Interface”.
The results of the survey was reported at the TF meeting during NA Spring meeting 2012.
<Month> <Year>
PIC Liaison Report - September 2011
<Region> <Committee> 12

13. <Region> <Committee>
SEMI Standards Technical Education Program (STEP) on 450 mm Wafer at SEMICON Japan 2011
Date: 9 December, 2011
Time: 13:00-16:45
Location: Int’l Conference Hall, Makuhari Messe, Chiba, Japan
Supported by Japan PI&C committee, Japan Silicon Wafer Committee and Japan Packaging Committee
Agenda:
13:00- Opening Remarks/ Shoji Komatsu, Acteon Corporation
13:05- The 450mm Transition: Consortium Status, Strategy, and Plans/ Mike Goldstein, SEMATECH
13:30- Overall Concepts of 450mm SEMI Standards/ Shoji Komatsu, Acteon Corporation
13:45- Basics of SEMI Standards(G88) on 450mm Packaging Process/ Sumio Masuchi, DISCO CORPARATION
14: mm Silicon Wafers Status Update/ Mike Goldstein, Intel Corporation
14:40- Explanations for 450 FOUP (E158) and MAC (E159), 450 FOSB (M80)/ Tsuyoshi Nagashima, Mirial Co., Ltd.
15:25- Explanations for 450 FOUP/ FOSB Load Port(E154)/ Tsutomu Okabe, TDK Corporation
16: mm PM Physical Interface Standard Activity/ Supika Mashiro, TOKYO ELECTRON LTD.
16:30- Q&A
16:45- Closing Remarks/ Makoto Yamamoto, Muratec Automation Co., Ltd.
More than 80 participants.
<Month> <Year>
<Region> <Committee>

14. Regional Staff Contact Information
Name
Hiro’fumi Kanno
Phone
Office Address
Kudan-minami, Chiyoda-ku, Tokyo Japan
Committees
In charge
Japan PIC Committee
<Month> <Year>
<Region> <Committee>