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Reliability Analysis of the Aeroflex ViaLink™ FPGA

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Presentation on theme: "Reliability Analysis of the Aeroflex ViaLink™ FPGA"— Presentation transcript:

1 Reliability Analysis of the Aeroflex ViaLink™ FPGA
MAPLD International Conference September 8, 2005 Session D: Reliability Ronald Lake Aeroflex Colorado Springs MAPLD2005 / Submission 222

2 Agenda Background New Approach Current Status
Aeroflex begins QML-Q / QML-V Qualification of RadHard Eclipse FPGA Original approach followed MIL-PRF standards Approach outlined in previously published papers Then the world changed (Industry Tiger Team, Aerospace Corp., NASA GSFC, etc.) New Approach November 2004: Aeroflex received “Aerospace Requirements for FPGAs in Space” Aeroflex adopts enhanced MIL-PRF QML Qualification with Aerospace Corporation guidelines Un-programmed burn-in Operating life test (HTOL / LTOL) Current Status Aeroflex completes QML-Q / QML-V qualification: August 2005 Standard Microcircuit Drawing (SMD) #:5962R04229 Aeroflex announces QML results: September 2005 (MAPLD) Aeroflex ships first Rad-Assured QML materials: September 2005 MAPLD2005 / Submission 222

3 QML Qualification Compliance Matrix
Aeroflex vs. Aerospace Corp. Guidance MAPLD2005 / Submission 222

4 Aerospace Evaluation Structural Evaluation Task Completion
Using focused ion beam techniques Output – 3 dimension model (colorized) Follow-on evaluations Effect on adjacent ViaLinks Lot to Lot variation Via Links vs Programming Spatial Wafer Evaluation (center to edge) Lot to Lot variations Failed ViaLink (if possible) 3Q2005 Elemental Structural Programmed Un-Programmed Task 4Q2005 1, 3 and 5 pulse programmed ViaLinks (bi-directional) Uni-Directionally Programmed ViaLink Unprogrammed ViaLink Completion Sample Type/Description MAPLD2005 / Submission 222

5 Un-programmed ViaLink Cross Section
Figure removed until Proprietary issues are resolve. This was a late arriving paper and I apologize for this, I was too nice and will fix that for MAPLD rk MAPLD2005 / Submission 222

6 Reliability Design for ViaLink Operating Life
Goal: Create worst case design for ViaLink stress Adhere to NASA OLD guidelines for reliability test vehicles for fuse based FPGAs Design Use all FPGA logic, memory and I/O resources Use all wiring types, with associated ViaLinks Force high fan-out structures for flip flops and logic Maximize current density through ViaLinks Manually fix placement to force use of long wires and worst case ViaLinks Use dedicated and global clocks for synchronous logic Synchronize reset to insure initialization conditions Create long combinatorial and synchronous chains for AC delay measurements MAPLD2005 / Submission 222

7 Life Test Environment for RadHard Eclipse
Goal: Subject RadHard Eclipse to real world environment during life test to stress ViaLinks Life test conditions Do not de-couple or terminate I/O signals Allow voltage spikes on inputs Allow noise on I/O and within wiring array of ViaLinks Evaluate multiple power sequencing conditions Use extended times in stress chambers Closely monitor power supplies MAPLD2005 / Submission 222

8 Test Environment for Characterization
Goal: Create repeatable and accurate test environment for measurement of RadHard Eclipse ViaLink characteristics Test Conditions Use Teradyne Tiger tester for accurate measurements of quiescent current and propagation delay Test all temperature conditions: -55ºC, 25ºC and 125ºC Test all voltage conditions: 2.3V core and 3.0V I/O; 2.5V core and 3.3V I/O; V core and 3.6V I/O Use control units to verify test environment does not change between stress read points Review all test results prior to next stress, comparing worst case deltas to means MAPLD2005 / Submission 222

9 Un-programmed burn-in
Applied to 100% of un-programmed units passing manufacturing stress Standard step in Aeroflex QML manufacturing flow 240 hrs of 125°C burn-in at maximum operating conditions (Vcc=2.7V, Vccio=3.6V) FPGAs dynamically stimulated during burn-in After burn-in devices tested for quiescent current (Icc, Iccio) and un-programmed electrical test (3 temperature, min/typ/max voltage) Percent defective allowable (PDA) <5% MAPLD2005 / Submission 222

10 Operating Life AC Deltas
LTOL: 77 test units + 3 control No ViaLink failures at 1000 Hrs stress <3% change in propagation delay HTOL: 77 test units + 3 control <10% change in propagation delay Delay deltas calculated for all voltage & temperature combinations Reliability Design Feature Details Clock Synchronous Scan Chains 560 bit fast data quadrant Two 360 bit Chains - high fan-out (16), fast data dedicated Two 225 bit Chain - high fan-out (16), fast data global SRAM 3072x18 Register File 64x8 Registered I/O Buffers Combinatorial Chains NAND w/ fanout 16 251 bit NAND w/ placement, 251 bit NAND, autoplace MAPLD2005 / Submission 222

11 Co60 AC Deltas Delta’s calculated at room temperature for all voltage combinations <5% change in delay at 100 krad(Si) <15% change in delay at 300 krad(Si) Irradiated at 1 rad(Si)/sec Propagation delays stay within simulation limits Reliability Design Feature Details Clock Synchronous Scan Chains 560 bit fast data quadrant Two 360 bit Chains - high fan-out (16), fast data dedicated Two 225 bit Chain - high fan-out (16), fast data global SRAM 3072x18 Register File 64x8 Registered I/O Buffers Combinatorial Chains NAND w/ fanout 16 251 bit NAND w/ placement, 251 bit NAND, autoplace MAPLD2005 / Submission 222

12 Radiation Testing Single Event Effects Total Ionizing Dose Dose Rate
MAPLD2005 / Submission 222

13 Timing Characterization
QuickLogic Timing Release Flow Oscillator Design (34 types) Initial Data Collection Timing Generation Re-Simulate Oscillator Designs Silicon Vs Simulation Spde Release Pre Release Data Aeroflex Aeroflex QuickLogic Aeroflex Aeroflex QuickLogic Verification Loop Current Status Aeroflex speed grade -5 primitive library provides >10% guard band vs. silicon for combinatorial and most synchronous delays Margins maintained for material after TID of 300krads (Si) Some exceptions exist due to Aeroflex removal of charge pump on FPGA Delay library undergoing updates for 4Q2005 release MAPLD2005 / Submission 222

14 Summary Aeroflex Colorado Springs has embraced the Aerospace Corporation’s guidelines to enhance the QML qualification flow Burn-in analysis demonstrates <3 % defective after 3 temperature testing (QML lot acceptance PDA<5%) Worst case conditions used for ViaLink™ operating life test LTOL delay analysis demonstrates <3 % change in propagation delay after 1000 Hrs of stress HTOL delay analysis demonstrates <10% change in propagation delay after 1000 Hrs of stress TID delay analysis demonstrates <5% change in propagation delay at 100krad and <12% change at 300krad ViaLink structural and elemental analysis underway with Aerospace Corporation RadHard Eclipse FPGA qualified as Rad-Assured QML Q/V MAPLD2005 / Submission 222

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