1. UCSB Testing Status Anthony Affolder
(for the UCSB module testing group)
Current testing infrastructure
Test results
Module test equipment needs
Module Testing Meeting March 7, 2003
UCSB Testing Status-Anthony Affolder

2. Current UCSB Testing Setup
3 ARC Controller + 5 new ARC FE
1 Hybrid testing (2 Hybrid clamshells)
2 Module testing (Module clamshell)
LED system
DEPP HV supply
1 DAQ system
Module Burn-in (Vienna Box)
See P. Gartung’s talk
Status of testing equipment kept up to date at hep.ucsb.edu/cms/cmsUCSB.html
Hybrid Clamshell
ARC crate
DEPP
ARC Controller
Module Clamshell
LED Controller
Module Testing Meeting March 7, 2003
UCSB Testing Status-Anthony Affolder

3. UCSB Recent Infrastructure Projects
Hybrid holding plates
Matches hybrid thermal cycling test stand
Can bond and test with low noise in same holder
Burn-in low voltage distribution crate
LED indicators and fuse protection
Crowbar
HV protection circuit
12 each for FNAL/UCSB
Module cold plate
Attaches to current module holder
Hybrid Clamshell
Module Clamshell
Module Testing Meeting March 7, 2003
UCSB Testing Status-Anthony Affolder

4. UCSB Testing Status-Anthony Affolder
Testing Facilities
Clean room adjacent to production area
Room layout finished
Currently in high bay with intentionally same layout
Clean room will be finished in April
High Bay (Ground floor)
Rod assembly/burn-in
Convenient access to loading dock
Module Testing Meeting March 7, 2003
UCSB Testing Status-Anthony Affolder

5. UCSB Testing Status-Anthony Affolder
Test Results (1)
5 hybrids tested on arrival
All good, but fail current requirement given in the Procedures for Module Testing
Digitization effects cause variations larger than ±20%
Hybrid noise requirements should be changed
Ni within 50% of average
0.3 < Ni < 1.5
Removes chance of chips with uniformly low/high noise from passing requirements
See hep.ucsb.edu/cms/cmsUCSB.html for more complete description
Module Testing Meeting March 7, 2003
UCSB Testing Status-Anthony Affolder

6. UCSB Testing Status-Anthony Affolder
Test Results (2)
4 hybrids have had APV bonded to pitch adapters
All channels are good
Hybrid clamshells enable testing without large pickup effects at chip edges
Hybrid isolated with plate and lid grounded
Same requirements can be made for hybrids with or w/o PA bonded
Module Testing Meeting March 7, 2003
UCSB Testing Status-Anthony Affolder

7. UCSB Testing Status-Anthony Affolder
Gain Measurements (1)
Multi-point gain added to ARCS 6.0 beta software
Thanks to the Aachen group
Tests are very quick and have advantages over pulse shape measurements
More uniform
More stable
Gain linearities
Gain variations
Strongly suggest that test be all to all M800 production. Will be included TOB testing
Make requirements on gain slope, offset and fit c2
Module Testing Meeting March 7, 2003
UCSB Testing Status-Anthony Affolder

8. UCSB Testing Status-Anthony Affolder
Gain Measurements (2)
2 of 24 chips so far have no response with low injection values
Only occurs in peak mode inverter on
Caused by initialization defaults in ARCS tests
VPSP set too low
Thanks to T. Franke and M. Raymond for help
VPSP setting will be modified in new release
Removes all seen irregularities
Module Testing Meeting March 7, 2003
UCSB Testing Status-Anthony Affolder

9. Current Estimated Testing Through-put
Hybrid Arrival Testing
24 Hybrids per day
Matches peak production (+ contingency)
Requires dedicated tech
Module Basic Test
2 ARC LED stands but only 1 hybrid-to-utri version D
XX Modules per day
Module Burn-in (Vienna Box)
See P. Gartung’s talk for details
Lack of hybrid-to-utri adapters limits testing through-put to 1
While burn-in test underway, no module testing possible
Module Characterization test will be done at beginning/end of test cycles
ARC After Burn-in Test
Not clear how much ARC testing necessary after burn-in
Depends on grounding/pickup issues
LED is minimal test
Time estimates do not include database entry.
After finishing test equipment acquisition/integration,
database will be first priority.
Module Testing Meeting March 7, 2003
UCSB Testing Status-Anthony Affolder

10. UCSB Testing Status-Anthony Affolder
Current Testing Needs
Module Burn-in
Will not begin large scale production without module burn-in capability
Recent shipment to US meets most hardware needs
Thanks to all involved
Second Vienna cold box scheduled to arrive in early April
hybrid-to-utri adapters and the Torino interlock box biggest needs
See P. Gartung’s talk
Module Testing
IV scan, database input
Hybrid Characterization
Database input
Hybrid thermal cycling box
Lack hardware/software
Tests will be performed by A. Honma’s group for M800
Will aid in manufacturing of test stand
Rods
Begin to assemble necessary infrastructure for rod assembly/ burn-in
Xrod software package already compiled and running
Module Testing Meeting March 7, 2003
UCSB Testing Status-Anthony Affolder