1. LSST Camera Detector Status

2. Sensor development on the schedule critical path
High QE to 1000nm
Thick silicon - 100µm thick and BB AR coating
PSF << 0.7” (0.2”)
High resistivity substrate (> 5 kohm∙cm)
Small pixel size (0.2” = 10 µm)
Fast f/1.2 focal ratio
Sensor flatness < 5µm p-v
Package with piston, tip, tilt adj. to ~1µm
Wide FOV
~ 3200 cm2 focal plane
> 189 Science-sensor mosaic
High throughput
> 90% fill factor
4-side buttable package, sub-mm gaps
Fast readout (1 s)
Segmented sensors - ~3200 total output ports
150 I/O connections per sensor
Low read noise
< ~ 5 rms electrons
R&D Program
Funding secured by Keck Foundation to keep development moving.
Three phase development - Study phase sensor evaluation begun at BNL
Prototype phase: Contracts with two vendors signed

3. Multi-port 4K x 4K = 16M Pixel CCD
Detail of one edge
Detail of output port
July 7, 2008
SLAC Annual Program Review
J. Geary, “LSST Strawman CCD Design”, Dec. 2004

4. Sensor development plan
Technology study
understand and model device characteristics
engage qualified vendors
address the most pressing technical challenges early
establish test lab at BNL
Prototype
multivendor competition
fabricate sensor meeting all LSST specifications
demonstrate yield and quality control
ramp up test capability within LSST collaborating institutions
Production
manufacture, test, and deliver 200+ science-grade sensors
24-month production period
single- or dual-source
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
Modeling and trade studies
Technology Study
3 Vendors
Prototypes
2 Vendors
DOE MIE Funding
Sensor procurement starts
July 7, 2008

5. BNL and sensor group are providing leadship
for schedule driven sensor development
Request for proposals for prototype science CCDs
issued Feb. 2008
contract award June/July 2008
5 high-resistivity, thick CCDs from study program have been extensively characterized
design models validated
behavior of dark current, quantum efficiency, and point spread function vs. thickness, temperature, and electric field
flatness and surface morphology
antireflection coating
CCD controllers for 4 new test labs under construction
UC Davis, SLAC, Paris, Purdue
allows full-speed testing of segmented sensors
Components for CCD/electronics chain testing in assembly
-50V
X-ray images
-10V