1. SEMICONDUCTOR TECHNOLOGY -CMOS-
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2018/11/22
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2. What is semiconductor and LSIs
Huge number of transistors can be integrated in a small Si chip.
The size of the chip is roughly the size of nails.
Currently, 10M transistors can be integrated.
1000 times integration comparing to 20 yrs ago.
The cost of the chip is roughly same.
All electronic equipments are powered by LSIs.
PCs, Cellular phones, 3D graphics, Internet.
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3. System Arch 2007 (Fire Tom Wada)
PC mother board
Large Scale Integration
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4. System Arch 2007 (Fire Tom Wada)
SONY PLAYSTATION 2 MAINBOARD
Rendering LSI
Graphics LSI
High Speed Memory
Direct RDRAM
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5. Mobile Phone Mainboard
Memory, Logic, Analog
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6. System Arch 2007 (Fire Tom Wada)
Key device is LSI
INTEL Pentium III module
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7. This is a packaged LSI -Pentium III 300MHz Cache LSI-
20 mm
15 mm
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8. Si chip is molded in the package.
2 million transistor Chip is connected to the pins thru wires.
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9. System Arch 2007 (Fire Tom Wada)
6 inches Si wafer
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10. System Arch 2007 (Fire Tom Wada)
8 inches Si wafer
Hundreds of Chips on
a Si Wafer
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11. Several hundreds of chips are fabricated on a wafer simultaneously.
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12. Chip photo - Motion Estimation Chip for HDTV camera -
9.1 mm
Your small finger’s nail size.
200M transistors.
8.6 mm
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13. Scanning Electron Microscope photo - Cross-section of the LSI -
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0.5 micron

14. System Arch 2007 (Fire Tom Wada)
Structure Of CMOS LSI
Isolation
PN-Isolation, Local oxidation
Si Substrate
Bulk, epitaxial , SOI
Well Structure
N-type well in P-type Substrate
Latch Up
PNP Bipolar Transistor and NPN Bipolar Transistor
Fabrication Process Technology
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15. Cross-section of the LSI
Metal wiring
Poly-silicon
Poly-silicon N+ N+ P+ P+
P-type MOS transistor
N-type MOS transistor
N-type well
P-type Si substrate
Si wafer
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16. Advanced Process Development
Multi-level Metalization Module
（BEP)
65nm
Transistor module
（FEP)
Lithography(VUV, EPL)
Mask
Fine Cu interconnect
SiGe/Metal gate
Low κ
interdielectric
High κ
Gate insulator
CMPplanarization
Low Resistance Ultra shallow junction
Low Resistance
Contact with
High Aspect ratio
Low stress Shallow Trench Isolation
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17. LSI integration trend - Moore’s law -
10B
DVD-RAM
Digital HDTV receiver
DVD player
DVD recorder 1B
DVD-ROM
100M
10M
The number of transistors are increasing by 58% per year.
- Moore’s Law -
Number of transistors on a chip
Wide-TV, PHS phone 1M
100K
0.8
0.5
0.3
0.18
0.13
10K
CHANNEL LENGTH (MICRON)
Source: SEMATEC 1K
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System Arch (Fire Tom Wada) 89 91 93 95 97 99 01 03 05 07 09

18. Communications and Consumer Products Drive Semiconductor
45%
Cellular Phones
Digital Camera
40%
Set-Top Box
DVD Player
35%
Internet Game Consoles
Smart Cards/Kiosks
30%
Application Market Growth
Smart Appliance-Phone
Advanced Desktop PC and Workstation
25%
CAGR % ( )
Multimedia PC
Automotive Applications/GPS
20%
Portable Computing
Switching
& LAN
1st Generation
15%
Video
Camera
HDTV
2nd Generation
3rd Generation
10%
Car Radio
Color TV 5%
Semiconductor Industry 0% 0% 5%
10%
15%
20%
25%
30%
35%
40%
45%
50%
55%
SC Content (As % of Equipment Cost)
Sources: Applied Materials Corporate Marketing estimates, Dataquest
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19. Fabrication Process Issues
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20. System Arch 2007 (Fire Tom Wada)
Ultra Clean Room
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21. System Arch 2007 (Fire Tom Wada)
Basic LSI process
Layer Deposition
SEM photo of Logic LSIs M1 M2 M3 M4 M5 M6 M7
lithography
etching
cleaning
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22. System Arch 2007 (Fire Tom Wada)
Light Source
Lens A
Mask
Lens
Si Wafer
A A A A A A A A A A A A A A
A A A A A A A A A A A
Stage Y X
Projection
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23. System Arch 2007 (Fire Tom Wada)
Packaging & Test
Wafer Test
Remove Process defect Chips
Wafer
Testing
Functional Test，DC Test
Pre Test
Final Test I
scribing
Functional Test，DC/AC Test
Chips
Burn-In
Mounting
Ex.)Vcc:7V，Temp.:125℃, 24～42hrs
Assembly Flow
Bonding
Final Test II
Shipping Test
Functional Test(at Speed)，DC/AC Test
Enclosing
Sample
marking
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24. Large Scale Integration
NMOS , PMOS and Wiring
All Logic Function can be made
Memory Element Can be made
Billions of Transistors and wiring make LSI!
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25. System Arch 2007 (Fire Tom Wada)
CMOS NOT (Inverter)
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26. System Arch 2007 (Fire Tom Wada)
CMOS NAND と NOR A B f 1 A B f 1
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27. System Arch 2007 (Fire Tom Wada)
Classification Of LSI
Logic LSI: Micro Processor, Digital Signal Processor (DSP), FPGA
Memory LSI: RAM (DRAM, SRAM), ROM (Flash Memory)
Analog LSI: ADC, DAC, Filter, Amplifier
Micro Processor (PC’s central processing Unit)
Perform Digital computation according to the program in Memory
Integration in 7000 times in 25 years, (Moor’s Law)
Clock Speed : 700 times in 25 years
Memory LSI:　
Dynamic Random Access Memory: Main memory for Computer, 4-times density in 4 years
Static Random Access Memory : work memory for mobile equipments
Flash Memory : Nonvolatile memory , Digital Camera Storage
Analog LSI:
Used for interface, high speed RF interface, Analog to Digital Conversion, Digital to Analog Conversion
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28. Analog to Digital Conversion
Sample the analog wave
Convert to Digital format in Binary
Same as f(t) to An
Continuous time
Discrete time
ADC LSI
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29. System Arch 2007 (Fire Tom Wada)
Chip photo
SoC
Flash Memory
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