1. Flat Air Moving Device TEAM MEMBERS ADVISORS Bruk Yimesgen
Karmand Rasheed
Ben Furst
Alexander Aseyev
Dr. Faryar Etesami
Jered Wikander

2. Mission Statement
Design and build an air movement device that meets or exceeds the criteria specified. In particular, the device will have a thickness no greater than 3mm and be able to provide air flow characteristics that are standard in current fan technology used in the cooling of electronics.

3. Background
INTEL
Semi conductor x86microprocessor

4. Electronics Size Performance Heat generation * Air moving device
Fan Technology
“Mighty Mini Fan” (8mm x 8mm x 3mm)

6. Customers External Intel Buyers and consumer’s of Intel’s products
Accounting
Purchasing
Manufacturing
Maintenance
Quality Control/Quality Assurance
Legal

7. Customers
Internal
Intel’s Mobile Platform Research and development Division
PSU’s capstone faculty director Dr. Faryar Etesami
Flat air moving device capstone team

8. Product Design Specification

9. Product Design Specification

10. Product Design Specification

11. House of Quality

12. Risk Assessment Failure to meet air flow requirements
Inability to complete fabrication of prototype due to needed parts being unavailable
Mechanical failure of device due to component breaking
Research and understand design possibilities
Ensure availability of parts before construction begins
Ensure a replicate is easily available

13. Conclusion
Design and prototype an air moving device that provides air flow comparable to currently available devices and has a maximum thickness of 3 mm. Project will focus on developing a prototype that will meet the inflexible requirements and achieves or exceeds the flexible targets.

14. Questions?
Flat Air Moving Device