1. Dilbert

2. Dilbert

5. Engr 1202 ECE Grading Spreadsheet

6. Materials
Conductive materials – valence band overlaps the conduction band
Non conductive materials – valence band is separated from conduction band and electrons can not easily get to the conduction band
Semiconductor materials – conduction band is close to valence band and electrons can easily jump from the valence band to the conduction band with an energy source

7. Silicon
Silicon is an element
Silicon is the first or second most abundant element on the earth
Sand is a form of silicon
Silicon is know as a semiconductor because under certain conditions it can conduct electricity (electrons)
Silicon is the most widely used material for today’s microelectronics
Silicon was not the first semiconductor material used, germanium was first.

8. Raw silicon is melted and grown into a single crystal ingot
Silicon ingot being grown
Completed silicon ingot

9. Once the ingot is complete, wafers are sawn from the ingot and the top side is polished to a mirror finish

10. Group 4

11. Silicon
From the periodic chart you can see that silicon is a group 4 element
Group 4 elements have 4 electrons in their outer most electron shell
Germanium is also a group 4 element

12. Why is silicon an excellent microelectronics material?
It is very abundant
It can be grown into a single orientation crystal
It can be made electrically active easily
It can be made to conduct electrons with a small applied potential
It has a naturally forming oxide that acts as an insulating and diffusion barrier

14. Two dimensional schematic of three dimensional crystal

15. Group 3 Elements

16. P type doping – Positive, electron short, also called a hole

17. Group 5 elements

18. N-type doping – N is negative, electron rich

19. Combing n-type silicon and p-type silicon gives a pn junction

20. The future
Silicon will continue to play a dominant role but other semiconductor materials will play an increasing role
III-V semiconductor materials made from group III and group V elements are now common ( GaAs, InP, AlN )
II-VI semiconductor materials are being investigated for special applications
SiC, “diamond like carbon”, and SiGe are also of interest

21. Clean Room Labs Start this week
Lectures will only be on Monday until further notice
You will meet in the Cameron clean room at your Team designated time
Do not miss a Clean Room lab
If you do miss a clean room lab, you can attend another team’s time to get caught up
Clean Room Labs Start this week

22. CAMERON Hall
Craver Road

23. Main Entrance The clean room is just at the top of the stairs

24. Side entrance – Second Floor The clean room is just inside these doors

25. Assignment Consider the options for your project:
Cellular phone antenna (watch size)
Bluetooth and Wi-Fi antenna
RFID antenna
Determine which option you would like to use based on future potential

26. Second floor rear entrance to Cameron The clean room is in the opposite corner from this entrance, on the same floor

27. Main viewing window into the clean room
Door to clean room is here

28. Enter the clean room gowning area – The TA will let you in
Door to the clean room

29. Remove coats, hats, back packs, etc
Remove coats, hats, back packs, etc. and prepare to put on the clean room garments

30. Following the TA’s instructions – put on the clean room garments

31. Sign in sheet is located on wire table inside the garment change room Be sure to sign in – credit for attending the clean room sessions are taken from the sign in sheet

32. Locate and understand how to use the safety apparatus

33. Each team will receive a wafer box and 8 100mm silicon wafers
Special tweezers are used to handle silicon wafers

34. Engr 1202 ECE Lab Micro Planar Antenna Traveler

35. The project Your team is interested in forming a technology company
Your idea is to create miniature antenna that can be used in wireless electronic devices
You will pick an application, design an antenna for the application, fabricate the antenna in the microelectronics clean room, analyze the design, and determine market and economic viability

36. Homework Assignment HW 8
Meet as a team
Select a team leader
Use the form listed for Assignment #6
Record members in attendance and time of meeting
Decide on application, Cellular, Bluetooth/Wi-Fi, RFID or GPS
Team leader to me with the time of meeting, team members in attendance, and your team’s choice of application
Preliminary choice - can be changed later