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Date: Place: Geneva, Switzerland

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1 Date: 2018-02-07 Place: Geneva, Switzerland
May 2015 doc.: IEEE /0496r1 January 2018 IEEE Multi Gbit/s Optical Wireless Communication Joint Workshop with ITU-T Q18/SG15 Date: Place: Geneva, Switzerland Authors: Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

2 May 2015 doc.: IEEE /0496r1 January 2018 Abstract This presentation contains an overview of recent work in the IEEE task group TG13 “Multi Gbit/s Optical Wireless Communication” for the joint workshop with the ITU-T Q18 SG15 G.vlc project. Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

3 Table of Content Introduction to 802.15.13 group
May 2015 doc.: IEEE /0496r1 January 2018 Table of Content Introduction to group History of OWC in Motivation, Use-cases and Technologies TG13 Scope Structure of TG13 draft D2 based on the r1 with major changes Introduction into PHYs and MAC targeted in TG13 Timeline in TG13 Questions from G.vlc to TG13 Questions from TG13 to G.vlc Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

4 May 2015 doc.: IEEE /0496r1 January 2018 History of OWC in IEEE Non-directed, P2MP using white light Device classes: Infrastructure, Mobile, Vehicle 3 PHYs kb/s (PHY1) MB/s (PHY2), using OOK and VPPM 12-96 MB/s using Color Shift Keying (CSK, PHY3) Only low speed modes were ever implemented Standardization was dominated by one big company Few products so far from within Korea In other parts of the world it is considered as a failure Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

5 May 2015 doc.: IEEE /0496r1 January 2018 History of OWC in IEEE r1 originally intended as revision only including OCC, but wide scope Li-Fi people joined in 2015 when task group was established Optical Camera Communications (OCC) Using cameras in handsets or specific cameras in cars Low-speed communications with angular resolution (via pixels) Allows high-density scenarios (e.g. traffic jam) Needs only broadcast topology, various new PHY modes Localization is also possible using data base but out of scope r1 today D2 is passed through WG letter ballot w/o Li-Fi r1 = OCC Li-Fi is considered in new task group TG13 Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

6 May 2015 doc.: IEEE /0496r1 January 2018 History of OWC in IEEE Established in March 2016 in Dajeon (Korea) Dedicated PHYs and MAC for Li-Fi Reasons for split from OCC OCC and Li-Fi in r1 became intractable Two sub-committees in one room, no interaction OCC just requires simplest MAC (broadcast topology) Li-Fi requires more complex MAC (coordinated topology) New MAC needs a new standard  new task group TG13 Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

7 Motivation of TG13 Many new world records for high data rates
May 2015 doc.: IEEE /0496r1 January 2018 Motivation of TG13 Many new world records for high data rates Up to 10 Gb/s short range using RGBY LEDs Several 100 Mb/s single-color in wide beams (few meters) New technologies, not included in Discrete multi-tone (DMT, also denoted as DC-OFDM) Closed-loop rate adaptation Multiple-input multiple-output (MIMO) Wavelength-division multiplexing (WDM) Mobility support between Li-Fi cells Mobility support between Li-Fi and RF Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

8 Use Cases January 2018 Indoor, Office, Home Data center, Industrial,
May 2015 doc.: IEEE /0496r1 January 2018 Use Cases Indoor, Office, Home Data center, Industrial, Secure Wireless Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

9 Use Cases Vehicular Communications
May 2015 doc.: IEEE /0496r1 January 2018 Use Cases Vehicular Communications Wireless Backhaul, e.g. for small radio cells, video surveillance, LAN bridging Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

10 May 2015 doc.: IEEE /0496r1 January 2018 Technologies Limited bandwidth of LED (10-20 MHz, with advanced drivers up to 200 MHz) Indoor lighting is bright  high SNR High spectral efficiency + high bandwidth enable Gbit/s data rates DC-OFDM as enabler with reasonable complexity Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

11 Technologies Superposition of LOS and NLOS, due to diffuse reflections
May 2015 doc.: IEEE /0496r1 January 2018 Technologies Superposition of LOS and NLOS, due to diffuse reflections Depends on K-factor (ratio between LOS and diffused light) K-factor is not always high Ripple and fades In mobile scenarios, any K can happen at any time  Closed-loop adaptive transmission Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

12 Technologies User is served by multiple luminaries
May 2015 doc.: IEEE /0496r1 January 2018 Technologies User is served by multiple luminaries Overlapping Li-Fi cells need horizontal handover + interference management Non-overlapping Li-Fi cells need vertical handover to Wi-Fi  mobility support for users in larger areas Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

13 May 2015 doc.: IEEE /0496r1 January 2018 TG13 Scope This standard defines a Physical (PHY) and Media Access Control (MAC) layer using light wavelengths from 10,000 nm to 190 nm in optically transparent media for optical wireless communications. The standard is capable of delivering data rates up to 10 Gbit/s at distances in the range of 200 meters unrestricted line of sight. It is designed for point-to-point and point-to-multi point communications in both non-coordinated and coordinated topologies. For coordinated topologies with more than one peer coordinator there will be a master coordinator. The standard includes adaptation to varying channel conditions and maintaining connectivity while moving within the range of a single coordinator or moving between coordinators. Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

14 Structure of TG13 D2 Draft history
May 2015 doc.: IEEE /0496r1 January 2018 Structure of TG13 D2 Draft history TG13 work is legacy of work on and r1 Draft for r1 = OCC + Li-Fi 2 new Li-Fi PHYs 3 new PHYs for OCC New MAC layer procedures for both, OCC and Li-Fi Initial Draft for = r1 w/o OCC and w/o PHYs I and III Further simplification and consolidation Simplification of existing MAC procedures Consolidation of new PHYs and MAC layer to support Li-Fi Slide 14 Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

15 Physical Layers in TG13 Low-bandwidth OFDM PHY (LB PHY)
May 2015 doc.: IEEE /0496r1 January 2018 Physical Layers in TG13 Low-bandwidth OFDM PHY (LB PHY) Low bandwidth (5…20 MHz), high spectral efficiency (64-QAM): <100 Mbit/s Targeting low-energy transmission  battery-driven mobile devices Derived from n and tailored to allow DMT (real-valued waveform) High-bandwidth OFDM PHY Shannon’s theorem C=B*log2(1+SNR) Spectral Efficiency LB OFDM PHY Pulsed Modulation PHY Bandwidth Slide 15 Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

16 Physical Layers in TG13 High-bandwidth OFDM PHY (HB PHY)
May 2015 doc.: IEEE /0496r1 January 2018 Physical Layers in TG13 High-bandwidth OFDM PHY (HB PHY) High bandwidth (25…1.000 MHz), high spectral efficiency (10 bps/Hz): <10 Gbit/s Derived from G.hn (2015) by scaling bandwidth up to 1 GHz Support for distributed MIMO has been added Pulsed Modulation PHY (PM PHY) New design based on own ideas in TG13 High bandwidth (3-200 MHz), low spectral efficiency (PAM-16): < 100 Mbit/s Increased bandwidth and lower SNR  more power-efficient than LB OFDM PHY RS channel code, PAM, 8B10B Line Code/Hadamard-Coded Modulation (HCM) Variable MCSs through PAM and #of codes used in HCM Support for distributed MIMO Slide 16 Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

17 Physical Layers in TG13 Where to use what PHY?
May 2015 doc.: IEEE /0496r1 January 2018 Physical Layers in TG13 Where to use what PHY? LB PHY: use low-cost optical frontends and easily achieve moderate data rates PM PHY: use advanced optical frontends and achieve low-to-moderate data rates (uplink) HB PHY: use advanced optical frontends and achieve moderate-to-high data rates (downlink) LB PHY is mainly intended for current mass market applications (standard MBB) HB PHY is useful for eMBB, as it is scalable from moderate up to very high data rates PM PHY is also useful for mMTC, as it is scalable from moderate down to low data rates All PHYs are useful for URLLC, as they provide distributed MIMO support Slide 17 Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

18 MAC Layer in TG13 Topologies P2P Star Broadcast Coordinated (new)
May 2015 doc.: IEEE /0496r1 January 2018 MAC Layer in TG13 Topologies P2P Star Broadcast Coordinated (new) Consensus to support coordinated topology by means of distributed MIMO in the PHY Needs new tools in each PHY Explicit MIMO pilots for channel sounding Implicit MIMO pilots for data transport Corresponding frame types Slide 18 Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

19 MAC Layer in TG13 General trend is to simplify old MAC
May 2015 doc.: IEEE /0496r1 January 2018 MAC Layer in TG13 General trend is to simplify old MAC procedures from Advanced network functionalities Relaying Heterogeneous RF&OWC No consensus on relaying yet Consensus to support heterogenous RF&OWC at master coordinator Slide 19 Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

20 Timeline in TG13 January 2018 March 2017 (Vancouver)
May 2015 doc.: IEEE /0496r1 January 2018 Timeline in TG13 March 2017 (Vancouver) - PAR and CSD for TG13 got approved, new contributions discussed April 2017 Additional comments against 15.7m submission May 2017 (Daejeon ) - Comments resolution against D1 of TG7r1 June 2017 Generate D0 of TG13 Comment submission July 2017 (Berlin) Commen resolution Decision on LC in  MAC Ad-hoc meeting in Berlin after Plenary August 2017 Comment submission against D0 September 2017 (Kona) Finalize comment resolution against D0 October 2017 Generate D1 of TG13 November 2017 (Orlando) General discussion about PHY and MAC, Work on text December 2017 - Comment submission against D1 until 1st January 2018 January 2018 (Irvine) Comment resolution against D1 PM PHY proposals February 2018 Generate D2 of TG13 Working on OFDM PHY proposals Volker Jungnickel (Fraunhofer HHI) Slide 20 Edward Au (Marvell Semiconductor)

21 Timeline in TG13 January 2018 March 2018 (Rosemont)
May 2015 doc.: IEEE /0496r1 January 2018 Timeline in TG13 March 2018 (Rosemont) Resolution of first comments against D2 Further Discussion on PM PHY April 2018 Submit further comments against D2 Submissions for OFDM PHY May 2018 (Warsaw) Finalize comment resolution against D2 Presentations for OFDM PHY June 2018 Create D3 July 2018 Resolve first comments against D3 Discussion on OFDM PHY August 2018 Comment submission against D3 September 2018 Comment resolution against D3 Final changes to PHY and MAC Technical Freeze of TG13 Spec October 2018 Create D4 Submit D4 to WG letter ballot November 2018 Resolve WG LB comments December 2018 Release D5 Submit to SB January 2019 SB Comment Resolution Start submission to RevCom February 2019 Get on the telco agenda Get the standard published Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

22 May 2015 doc.: IEEE /0496r1 January 2018 Further information Recent contributions in Li-Fi in TG7r1 (until March 2017) More recent contributions on Li-Fi in TG13 Access to TG13 draft specification requires voting rights in or presence at IEEE 802 meetings Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

23 Questions from G.vlc to TG13
May 2015 doc.: IEEE /0496r1 January 2018 Questions from G.vlc to TG13 Q: … A: … Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

24 Questions from TG13 to G.vlc
May 2015 doc.: IEEE /0496r1 January 2018 Questions from TG13 to G.vlc Q: What PHYs are being used in G.vlc? A: … Q: How to resolve coexistence betw. PHYs from G.vlc and ? Q: Under what conditions G.hn PHY could be integrated into MAC? Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)

25 Thank you! January 2018 May 2015 doc.: IEEE 802.11-15/0496r1
Volker Jungnickel (Fraunhofer HHI) Edward Au (Marvell Semiconductor)


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