1. ESL - Equivalent Series Inductance ‘L’
ESL & Capacitors
ESL - Equivalent Series Inductance ‘L’
Ideal capacitor
Real world capacitor
Insulation Resistance ‘IR’
DC leakage current
Energy loss
Parameter
Guide
Parasitic Inductance (ESL)
 Lower is better
Parasitic Resistance (ESR)
Insulation Resistance (IR)
 Higher is better
ESL
ESL impacts the speed of the capacitor response in transferring energy to the load
ESR
Limits current rating
Impacts ripple voltage
Energy loss
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2. NMC-R Series Reverse Geometry Low ESL Ceramic Chip Capacitors - MLCCs
SPEC:
Reduces ESL up to 60%!
Decoupling and noise suppression in high-speed circuits
Improved response time in power circuits
Reduce the number of decoupling components used
Reduce PCB size - costs and component placement costs!
0204, 0306, 0508, 0612 case sizes
TCC: (Operating Temp) X7R (-55C to +125C) & X5R (-55C to +85C)
Capacitance Range 0.01uF (10nF) to 1.0uF
Rated Voltage Range: 6.3V to 50V
Eight Low ESL MLCCs used
In microprocessor decoupling
Reverse geometry low ESL (Equivalent Series ‘L’ Inductance) MLCCs are ideal for use as high speed decoupling capacitors, mounted in close proximity or adjacent to microprocessors to minimize and suppress high frequency noise. Low inductance (low ESL) surface mount ceramic capacitors are connected directly to the power supply pins of the IC. Short traces or vias are required for this connection to minimize additional series inductance (ESL). Typically a combined network of low ESL MLCC and SMT electrolytic capacitors are used to provide low impedance over wide frequency range, with the larger electrolytic capacitors acting as charge reservoirs, buffering voltage during load stepping transient currents, and low ESL MLCCs covering high frequency noise suppression
 Please contact NIC for evaluation samples and to review your requirements
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3. Reverse Geometry Low ESL Ceramic Chip Capacitors - MLCCs
Equivalent Series Inductance (L)
NMC-R Series Performance Advantage
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4. Reverse Geometry Low ESL Ceramic Chip Capacitors - MLCCs
Equivalent Series Inductance (L)
ESL ≤ 0.20nH
NMC-R Series Performance Advantage
Increased Fos
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5. Reverse Geometry Low ESL Ceramic Chip Capacitors - MLCCs
NMC-R Series Performance
Equivalent Series Inductance (L)
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6. NMC-R Series Reverse Geometry Low ESL Ceramic Chip Capacitors - MLCCs
TCCs
X7R
X5R
Case Sizes
and
Capacitance values
SPEC:
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7. NMC-R Series Reverse Geometry Low ESL Ceramic Chip Capacitors - MLCCs
Examples
Example P/Ns
NMC-R0306X7R104K10TRPF = 0306 size, 0.1uF, 10V, in X7R TCC
NMC-R0508X7R105K10TRPF = 0508 size, 1.0uF, 10V, in X7R TCC
NMC-R0612X7R104K50TRPF = 0612 size, 0.1uF, 50V, in X7R TCC
SPEC:
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8. 105 Part Numbers in NMC-R series
Reverse Geometry Low ESL Ceramic Chip Capacitors - MLCCs
NMC-R Series
Reverse Geometry Low ESL Ceramic Chip Capacitors – MLCCs
105 Part Numbers in NMC-R series
SPEC:
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9. NMC-R Series Reverse Geometry Low ESL Ceramic Chip Capacitors - MLCCs
NMC-R series of low inductance MLCCs (low ESL MLCCs) are ideal for use in decoupling and bypassing applications for a wide range of electronic equipment including:
Micro-processor Decoupling
Powering LSI
Point of Load Regulators
Voltage Regulators
DC-DC Converters
Datacom Networking Equipment
Servers
Routers
Embedded Computing
Point of Sale
Graphics & Displays
Test and Instrumentation
Cross Reference: Reverse Geometry Low ESL MLCCs
Competitor
Series - PNs
AVX
0204_C, 0306_C, 0508_C, 0612_C
0204_D, 0306_D, 0508_D, 0612_D
MURATA
LLL15_, LLL18_, LLL21_, LLL31_
SAMSUNG
CL01, CL21, CLL5, CLL6
TAIYO YUDEN
JWK105, JWK107, JWK212, JWK316
TDK
C0510, C0816, C1220, C1632
SPEC:
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