1. Conditions and procedures of Japan research

2. Reminder of Japan research in phase2
To consider conditions of world round robin test, Japan will conduct repeatability and reproducibility confirmation test in advance.
Different organizations inside Japan will conduct thermal propagation test according to current draft, using same sample and same initiation method (Nail).
Thermal propagation test draft
Institutes A B
Sample X ←
Initiation method
Nail
Number 1 2
Institute A
Institute B
Confirm reproducibility
Confirm repeatability

3. Reminder of Japan research in phase2
It is possible to confirm which parameter have repeatability and reproducibility.
Based on these results, we would like to discuss conditions and criteria of world round robin test.
Sample 1 2 3
Institute A B
Thermal runaway of initiation cell occurs/ not occurs
Voltage drop of initiation cell
Temperature of pack
Pressure of pack
Thermal propagation occurs/ not occurs
Thermal propagation velocity :

4. Conditions of Japan research Procedures of Japan research
Outline
Conditions of Japan research
Procedures of Japan research
Note
Tests at site B have already been conducted. Pictures in this material were taken in the test.

5. Conditions Condition Reason Nail Material Alloy tool steel Steel
Current condition
(Phase1 Part1)
Nail
Material
Alloy tool steel
Steel
Same as current condition.
Diameter
3mm
More than 3mm
Within current condition.
Angle
60° °
Speed
0.1mm/sec
mm/sec
Insertion depth
½ of cell height -
Because of test equipment spec
Temperature
Depends on test place
25±2°C
Institute B doesn’t have air conditioner in test booth.
Position of target cell
See page 6
Surrounded by other cells. Thermal propagation is likely to happen.
Insertion point of cell
See page 7
To surely cause internal short circuit.
Voltage detection points
See page 8
To detect thermal runaway of trigger cell and surrounding cells.
Thermocouple points
See page 9 ↑
Pressure point
See page 10

6. Conditions Position of target cell:
This cell is surrounded by other cells. Thermal propagation is likely to happen.
Module2 8 7 6 5
Cell 1 4 5 8 9 12
Module1 2 3 4 2 3 6 7 10 11
Target cell
（Cell5 in Module2）

7. （About 5.5mm from center of vent ）
Conditions
Insertion point of cell
There are 4 electrodes inside cell. To surely cause internal short circuit, we select this point.
Nail
Module2
Cell 1
About 5.5mm 4 5 8 9 12
About 5.5mm A A 2 ３ ６ ７ 10 11
Insert point
（About 5.5mm from center of vent ）
Electrode
Section A-A

8. Conditions Voltage detection points
To detect thermal runaway of target cell and surrounding cells.
Module2 8 7 6 5
Cell 1 4 5 8 9 12
Target cell
（Cell5 in Module2）
Module1 2 3 4 2 3 6 7 10 11
Measurement Point
Remark V1
Voltage of module 1 V3
Voltage of module 3 V4
Voltage of module 4 V5
Voltage of module 5 V6
Voltage of module 6 V7
Voltage of module 7 V8
Voltage of module 8
Measurement Point
Remark
V2 1-3
Voltage of cell 1-3 inside module2
V2 4
Voltage of cell 4 inside module2
V2 5
Voltage of cell 5 inside module2
V2 6-7
Voltage of cell 6-7 inside module2
V2 8
Voltage of cell 8 inside module2
V2 9-12
Voltage of cell 9-12 inside module2

9. Conditions Thermocouple points
To detect thermal runaway of target cell and surrounding cells.
Module2
T2 4 8 7 6 5
Cell 1
T2 5 T8 T7 T6 T5 4 5 8 9 12
T2 8
Target cell
（Cell5 in Module2）
Module1 2 3 4 T1 T3 T4 2 3 6 7 10 11
T2 6
Measurement Point
Remark T1
Temp of module 1 T3
Temp of module 3 T4
Temp of module 4 T5
Temp of module 5 T6
Temp of module 6 T7
Temp of module 7 T8
Temp of module 8
Measurement Point
Remark
T2 4
Temp of cell 4 inside module2
T2 5
Temp of cell 5 inside module2
T2 6
Temp of cell 6 inside module2
T2 8
Temp of cell 8 inside module2

10. Conditions
Pressure sensor point
As shown below.
Pressure sensor

11. Procedures REESS preparation Test preparation No Procedure 1
Remove REESS from vehicle. 2
Remove upper case from REESS. 3
Remove plastic cover for insulation from REESS. 4
Make a hole in upper case (See Page 13) and plastic cover to pass nail. 5
Set thermocouples and voltage detection lines to REESS. 6
Set pressure sensor to upper case. 7
Set plastic cover to REESS. 8
Set upper case to REESS. 9
Charge REESS and adjust SOC.
Test preparation No
Procedure 1
Set a nail test equipment in the test booth without nail. 2
Set REESS to the nail test equipment. 3
Adjust position of REESS and nail to pass it through the hole. 4
Set nail to the nail test equipment.

12. Procedures Test No Remark 1
Start measurement temperature, voltage and pressure. 2
Start to move nail until 1/2 of cell height.
→ Internal short circuit / Thermal runaway 3
Observation 4
Stop measurement. 5
Wait until thermal event settles. 6
Remove upper case and plastic cover. 7
Observe REESS after test. 8
Discharge or deactivate REESS. 9
Waste REESS.

13. Procedures
Hole in upper case
As shown below.
Hole for nail
Φ5mm