1. Silicon Wafer Japan TC Chapter Liaison Report
For NA Silicon Wafer TC Chapter Meeting
In conjunction with NA Spring Standards Meetings

2. Leadership Committee Co-chairs Leadership Changes
Naoyuki J. Kawai/ Independent
Tetsuya Nakai/ SUMCO
Leadership Changes
None 2

3. TC Chapter Organization
Japan Silicon Wafer
Naoyuki Kawai (Independent)
Tetsuya Nakai (SUMCO)
Int’l Test Method TF
Ryuji Takeda (GlobalWafers Japan)
Int’l AWG TF
Satoshi Akiyama (Raytex Optima)
Japan Test Method TF
Ryuji Takeda (GlobalWafers Japan)
Tsuyoshi Otsuki (Shin-Etsu Handotai)
Mikako Omata (SCAS)
Int’l Polished Wafers TF
Yasuhiro Takamori (Global Wafer Japan)
JWG TF
Satoshi Akiyama (Raytex Optima)
Masanori Yoshise (Freelance)
Int’l Epitaxial Wafers TF
Naohisa Toda (Shinetsu Handotai)
Surface Metal Chemical
Analysis WG
Ryuji Takeda (Global Wafers Japan)
Ryo Machida (SCAS)
Int’l ASI TF
Masami Ikota (Hitachi High Technologies)
GOI WG
Tsuyoshi Otsuki (Sinetsu Handotai)
Int’l Annealed Wafers TF
Koji Araki (Global Wafers Japan)
Int’l 450mm
Shipping Box TF
Shoji Komatsu (Acteon NEXT)
BMD DZ WG
Satoshi Akiyama (Raytex Optima)
Kazuo Moriya (Raytex Optima)
Surface Organic
Contaminant
Analysis WG
Mikako Omata (SCAS)
Int’l SOI Wafers TF
Atsushi Ogura (Meiji Univ)
Tetsuya Nakai (SUMCO)
JA Shipping Box TF
Shoji Komatsu (Acteon NEXT)
Tsuyoshi Nagashima (Miraial)
Fiducial Mark
Interoperability TF
Tetsuya Nakai (SUMCO)
Bulk Heavy Metal Analysis By Electrical
Measurement WG
Masaru Akamatsu (KOBELCO)
Shingo Sumie (KOBELCO)
Int’l Terminology TF
Tetsuya Nakai (SUMCO)

4. Meeting Information Past/Last Meeting Next Meeting
December 15, Thursday, 2016 at Conference Tower, Tokyo Big Site, Tokyo, Japan
March 10, Friday, 2017, SEMI Japan Office
Next Meeting
June 16, Friday, 2017, SEMI Japan Office

5. JSNM
Japan Society of Newer Metals (JSNM) takes over the functionality of the Committee, including management related to JIS standards based on JEITA standards
JSNM Material Standards Study Group for Semiconductor Supply- Chain(M4S) is established on April 1, 2016 to take over JETTA Silicon Wafer Technology Committee.
Three standardization activities are on going for
Measurement for Low carbon concentricity upto 5E14atoms/cm3 in silicon mono crystalline by FT-IR. (Starting for RR test)
Measurement for Low Carbon concentricity upto 1E13 atoms/cm3 in silicon mono crystalline by Photo Luminescence Technology.(Discussing test procedures)
Measurement for resistivity in Epi layer with 1% accuracy. (Not yet started)

6. Ballot Review at the meeting on December 15
Ballots passed the TC Chapter Review
6043, Line Item Revision to SEMI MF (Reapproved 0912) Test Methods for Minority Carrier Lifetime in Bulk Germanium and Silicon by Measurement of Photoconductivity Decay –passed as is
6044, Line Item Revision to SEMI MF Test Methods For Measuring Resistivity Of Semiconductor Wafers Or Sheet Resistance Of Semiconductor Films With A Noncontact Eddy-current Gauge –passed as is
6045, Line Item Revision to SEMI MF Test Methods For Edge Contour Of Circular –passed as is
6046, Line Item Revision to SEMI MF Test Methods For Analyzing Organic Contaminants On Silicon Wafer Surfaces By Thermal Desorption Gas Chromatography – passed as is
6047, Reapproval of SEMI MF (Reapproved 1111) Practice for Preparing an Optical Microscope for Dimensional Measurements –passed as is (super clean)
6048, Reapproval of SEMI MF (Reapproved 1111)Test Method for Characterizing Semiconductor Deep Levels by Transient Capacitance Techniques – passed as is (super clean)
Ballot failed the TC Chapter Review
6042, Line Item Revision to SEMI MF (Reapproved 1111)Test Methods for Measuring Contrast of a Linear Polarizer – failed

7. Authorized Activities at the meeting on December 15
Line Item Revision to SEMI M1, MF-1390 and M 59, to be consistency among these three document for Bow Metrics and add illustration of Shape Metrics in M1 (International AWG)
Note that this proposal will be withdrawn and separate proposal for line item revision just for MF1390 will be introduced at the NA TC Chapter meeting in conjunction with NA Spring Standards Meetings.
March 10, 2017
Reapproval of M Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers
Note: Line-item ballot is appropriate for this document with accordance with Table A4-1-5 in the PM. This will be addressed at the next meeting.

8. Five-year Review
Reapproval of M Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers
Note: Line-item ballot is appropriate for this document with accordance with Table A4-1-5 in the PM. This will be addressed at the next meeting.

9. SNARF Project Period Review
Extended a project period
5737: Revision of SEMI MF , Test Method for Substitutional Atomic Carbon Content of Silicon by Infrared Absorption
The following documents will be reviewed at the next TC Chapter meeting
5769: New Standard: Test Method for Nitrogen Content in Silicon by Infrared Absorption
5770: Test Method for Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers
5772: Revision of MF : Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-state Surface photovoltage
5774: Sample Preparation Method for Minority Carrier Diffusion Length Measurement in Silicon Wafers by Surface Photovoltage Method

10. TF/ WG/ SG Reports -1
International 450mm Shipping Box Task Force / JA Shipping Box Task Force
The TF decided not to address on standardization for re-use 300mm shipping.
International Advanced Wafer Geometry Task Force / Japan AWG Task Force
Activity to be consistency of Bow Metrics between M1 and MF1390.
International Test Method Task Force / Japan Test Method Task Force
Doc.5737B :Revision of SEMI MF (Reapproved 0912), Test Method for Substitutional Atomic Carbon Content of Silicon by Infrared Absorption will be submitted to earlier ballot cycle in 2017
International Advanced Surface Inspection Task Force
Drafting Doc. 6096: Line Item Revision to SEMI M Practice for Calibrating Scanning Surface Inspection Systems Using Certified Depositions of Monodispere Reference Spheres on Unpatterned Semiconductor Wafer Surfaces (Addition of a related information section to SEMI M53 regarding the relationship of calibrated sizes assigned to defects by surface inspection systems to their actual physical size )

11. TF/ WG/ SG Reports -2 International Terminology Task Force
No special report from the task force but Japan TC Chapter discussed how to maintain terminology in future and candidate options are:
To maintain as Aux document, this idea was withdrawn
To keep M59 with inactive status and new terminology will be defined in each document
To continue to reapprove and issue the revision ballot when needed
In any cases, there are some issues to be discussed and Silicon Water Global Technical Committee needs to get some consultation from Regulations Subcommittee.
Following the discussion during NA Spring Standards Meetings, the Japan TC Chapter will develop the proposal at the next meeting
Formal discussion will be held at GCS in SEMICON WEST

12. TF/ WG/ SG Reports -2 International SOI Wafers Task Force
No special report
International Polished Wafers Task Force
International Epitaxial Wafers Task Force
International Annealed Wafers Task Force
Fiducial Mark Interoperability Task Force
This task force is under process of disbandment.
Japan Silicon Wafer TC Chapter agreed to disband this task force with all agreement of other Technical Committees in Japan chapter, PI&C, I&C, Packaging and Traceability.

13. Other topics
Proposal of New Standards, Specification for Lamella Carriers Used in Transmission Electron Microscopes
According to the decision at the EU TC Chapter meeting in October during SEMICON Europa 2016, the meeting to introduce proposal was held on December 13 at SEMI Japan Office in conjunction with SEMICON Japan 2016
Back ground of this standardization
Presentation on “Enabling HVM TEM metrology support - standards for TEM lamella carriers”
Proposed drafts of SNARF and TFOF
Conducting Survey has been decided at the Japan PI&C TC Chapter Meeting
Currently contents of survey form is under drafting.

14. Thank you!
Staff Contact
Junko Collins
SEMI Japan