1. Nikhef/Bonn LepCol meeting
- Alignment - Manipulation InGrid chips - Field cage single chip module
Fred Hartjes
NIKHEF
Nikhef/Bonn LepCol meeting
April 10, 2017

2. Alignment tooling mostly completed

3. Vacuum system in preparation
One channel operational
Waiting for vacuum buffers
Leakage problems due to design errors with alignment block
Cannot be easily cured
New pickup block has to be made

4. Picking chips with InGrid from the box
Manual picking hard
Some rubbing of the vacuum tool on the InGrid surface cannot be avoided
=> damage of the InGrid surface
Tool using small XYZ stage in preparation

5. Previous field cage for single chip detector
Made from Semitron ESD 490 HR
Gives field deformations due to inhomogeneity of the material

6. New field cage for single chip detector
Field shaping foil with metal strips to be placed inside
Strip pitch 1 mm
Network from 17 resistors 470 MΩ
=> ~50 nA leakage 200 V/cm
To be mounted in existing Semitron field cage
May be verified with N2 laser