1. Condenso Condenso XS / XM / XP / XPHS Condenso XS: New Compact Design
Assembly loading from machine front side. Work piece carrier moves with separate axis towards operator for easier loading and handling
Smaller footprint than Condenso XM
For small / middle sized production, Laboratory / sample production
Condenso XM: - shall be replaced by Condenso XS
Assembly loading from left side of machine. Work piece carrier moves to the machines left side beside the cooling chamber. Easy access for loading / unloading of work piece carriers.
Larger footprint than Condenso XS
For small / middle sized production, Laboratory / sample production
Condenso XP / XPHS
XP: automatic PCB handling (loading / unloading)
1 work piece carrier
1 transport axis
XPHS: automatic PCB handling (loading / unloading)
2 carriers / 2 axis system
shorter cycle times – loading / unloading during processing 2nd carrier in process chamber

2. Condenso XS
Condenso XS VAC
Footprint approx.. 2,50m x 1,95m x 1,59m approx. 4,88m² 27% less than Condenso XM

3. Condenso XM
Footprint approx. 3,42m x 1,95m x 1,59m approx. 6,5m²

4. Condenso XP / XPHS
Footprint approx. 4,15m x 2,66m x 1,69m approx. 8m², conveyor belts ignored

5. Condenso - outlook Condenso XLine:
during the Rehm Technology Days in September 2013 we will show the newly designed
Condenso XLine to our customers
Official presentation will be on the Productronica Show in November in Munich
The system consists of 3 consecutive chambers
The work piece carrier will be transported by a handling system from 1 chamber to the other
Automatic carrier loading / unloading
Empty carriers will be returned on the machines back side
All chambers completely inert
1st chamber with Nitrogen option and formic gases available
2nd chamber for soldering process with vacuum option to avoid voids
3rd chamber for convection cooling process, optional water cooled and under nitrogen condition
1st and 3rd chamber can be disconnected from process chamber for easy maintenance access

6. Condenso XLine Load pcb Unload pcb
Assembly transport via work piece carrier
3 chambers completely inert –
1st chamber (nitrogen / formic acid)
2nd chamber Process Chamber (Vacuum, nitrogen)
3rd chamber cooling (optional water-cooled, nitrogen)
Load
pcb
Unload
pcb
Footprint approx. 5,40m x 2,35m x 2,10m approx. 12,7m²

7. Condenso XLine
open
open
Chambers can be disconnected from process chamber for easier maintenance access