1. Automotive Development Overview
Automotive Development Overview
We start here, because the automotive industry is the driving force behind OSEK, and it’s informative to see
the special challenges that they are facing, and relate these to more general embedded systems challenges.

2. Current Applications ABS Air bags Intelligent sunroof
Rain-detecting wipers
Electrochromic mirror
Reverse assist
Smart locking
Tire pressure warning …
80 ECUs in high-end cars today

3. Recent/Future Applications
Navigation Control
Driver recognition
Night vision
Collision avoidance
X-by-wire …
Electronics is becoming the differentiator!
Drive-by-wire involves the replacement of mechanic/hydraulic systems for steering, braking, throttle and suspension functions, with electronic controllers, actuators and sensors.

4. Driving Trends Fuel economy (engine control) Safety (ABS)
Assembly costs (multiplex busses)
Connectivity (GPS, internet)
Mechatronics (x-by-wire)
Personalisation (smartcards)
Cars are getting smarter!
“Gas Guzzler” Tax in the US for fuel inefficient cars.
Advertising on “safety” of side-airbags recently

5. Segmentation of Embedded Applications
Future or High end car : Multimedia Bus :
D2B, MOST, Fire Wire, ...
Power Train
CAN Bus
ABS
Gear Box
Suspension
EMS
Keyless
Receiver
Door
Module
Lamp
Control
Radio
GSM
Multimedia
Center
(Video, CD,.)
Dash
board
Navigation
Bridge
Dashboard
ISU...
In-Cockpit
Under the Hood
This slide shows the two segments of the automotive electronics in a car.
OSes like OSEK will dominate “under the hood” while VXWorks type Oses will be used in the cockpit.
OSEK kernels are far smaller than VxWorks and run easily on 16 bit devices.
Smaller devices, lower memory costs means lower cost ECUs.
CIS however need to show features. Feature rich kernel with connectivity to the world!
Body Bus
CAN(VAN)
Comfort Bus
CAN (VAN)

6. Ford Statement
‘The development of automotive control systems is the critical path that determines the time-to-market of new vehicle models’
Bill Powers,
Vice-President Research
Ford Motor Company
Importance of good embedded software development systems!

7. The Design ‘V’ Process Integration & Calibration Specification Design
Product
Verification &
Deployment
System
Requirements
Systems Level Integration,
Test, Calibration
Architectural Design &
System Functional
Design
Design
Verification
Preliminary
Feature Design
Shows the typical design process used.
Longer development schedules and significant verification efforts versus normal embedded systems
Large systems, which need to be formally integrated
Subsystem Level Integration &
Verification
Detailed Feature
Design & Implementation
Component Verification
Realization

8. The V-cycle Functional Blocks
Function Design
Calibration
Rapid Prototyping
Hardware in
the Loop
Simulation
Target Code Generation

9. Automotive Challenges
Increasing Complexity
Emission regulations, market demands contributing
Trend to use commercial RTOS solutions.
Safety-Critical
High cost of failure (e.g. ABS)
Need for reliable solutions, well tested
Longer, Larger Projects
Development typically 2-3 years but reduced in recent years
Production for 5-10 years
Testing/Calibration Critical
Dominate for powertrain development
Typically 1:1:3 (control:software:calibration)
Cost of recalls is huge!
Now here are some of the specific challenges and issues that are faced in this market…
Increasing complexity means they are being forced to use commercial RTOSes more, and
focus on their core competencies.
Cost of failure can mean lives… and this means huge product liability!!

10. Automotive Challenges
Multi-vendor Interoperability
ECUs from multiple vendors need to talk to each other.
Need standard interfaces for communications
High Volume
Single ECU may be in multiple vehicles
Can be > 1 million run-times/project
Component Costs
Emphasis on reducing cost per unit
R&D costs typically less than 5%
Focus on code size and optimization
Royalty schedules may be an issue with some of these customers!

11. Broader Challenges
These challenges are common to many other industries, including:
Safety-Critical – Defence, Aerospace, Medical Instrumentation
Large Volume/Low Cost – Consumer electronics (e.g. handsets), Industrial Automation & Control (IMC)
Increasing Complexity – All of the above!

12. Single-Chip Solution Examples
Internal Devices
Internal RAM
Internal ROM
MPC555
Timer, Dual CAN, Serial, A/D
32 kbytes
448 kbytes
68HC12-BC32
Timer, Dual CAN, Serial (SCI), A/D, PWM
1 kbyte
32 kbytes
68HC12-DG128
Timer, Dual CAN, Serial (2x SCI), A/D, PWM
8 kbytes
128 kbytes
C167-CR
Timer, CAN, Serial, A/D, PWM
4 kbytes
128 kbytes
Here are some example architectures that are popular… and the memory constraints!
TriCore (AUD0)
Timer, Serial(4), Dual CAN, J1850, A/D, I/O
72 kbytes
20 kbytes
Single-chip solutions add strict resource limitations!

13. Translating to RTOS Requirements
Large Volume
Low Unit Cost Goal
Single-Chip Solutions
Minimal footprint
Safety Critical Applications
Fast, deterministic timing
RTOS Requirements
Highly configurable
Optimized Memory Usage
Increasing Complexity
Strong profiling tool support
Reliable,
well tested components
Rigorous Testing Phase
Multi-vendor Interoperability
Standard
APIs
Finally, this slide tries to summarize these challenges, and how they translate into generic OS requirements