1. Typical Al to gold pin solder joint before and after 6 weeks in a 97% R.H. at 50 C. The test is inconclusive as
the deposit is probably not a as result of corrosion. On one of the assemblies there was a noticeable change in
the mechanical strength of the joints. This needs to be quantified and the resistance of the assemblies measured.
Further tests in a 43% R.H. environment are ongoing.

3. If the layout is redone and optimised for shortest tape lengths, savings of between 20 and 30% on the tape length
will reduce the all copper powertape radiation length to that of the original with a lower voltage drop across the
tape.