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NEEP 541 – Sputtering Fall 2002 Jake Blanchard
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Outline Sputtering Definitions Models Sample Data Angle of Incidence
Correlations
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Definitions Sputtering=ejection of atoms from solid surface under bombardment by energetic ions Measured as recession rate of surface (m/s)
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Schematic of Process
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Modeling Determine scattering cross section
Determine amount of energy deposited near surface Convert energy to density of recoils near surface Determine number of recoils which reach surface Compare energy to binding energy
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Modeling Use inverse power law potentials
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Modeling
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Sigmund Theory Assume sputtering is proportional to energy deposited (FD) near surface Hence, sputtering is proportional to stopping power near surface Angle of incidence
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Stopping and Sputtering Distributions – Kr on Cu
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Modeling Let G*d3v*dx be the average number of atoms moving at time t with velocity v in the layer between x and x+dx
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Modeling Expand in Legendre polynomials Take moments
Separate elastic and inelastic collisions Neglect Ed Use only leading terms
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Result depends on m, incidence angle, and on mass ratio
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Copper Target E (keV)
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Z1 Dependence
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He on ??
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Tungsten Self-Sputtering
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Mass Ratio Dependence
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Angle of Incidence Empirically, the dependence of sputtering on the angle of incidence is:
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Ar on Copper
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Copper Target
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Empirical Correlation
threshold
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Empirical Correlation
C. Garcia-Rosales, “Revised Formulae for Sputtering Data, J. Nuc. Mat., 218, 1994, p. 8.
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Some Data Incident Target Eth U0 He Pb 40 2 Ar 45 Ag 3 Ne 23 Kr 85 Cu
34 3.5 56
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