1. 3D silicon package structure
Coupled Electrical-Thermal Co-analysis of Power Delivery Networks in Si3D Structure
Jianyong Xie, Daehyun Chung, Madhavan Swaminathan
Objectives
DC IR drop analysis of power delivery network in Si3D structures
Coupled electro-thermal analysis of PDN
Electro-thermal analysis tool development and tradeoffs design guideline
Accomplishments
Developed the procedure for static coupled electro-thermal analysis
Simulation of electro-thermal problem for power plane
A 3D package
3D silicon package structure
Procedure for electro-thermal analysis
Recent results
IR drop and temperature trends with iterations of stacked chips
Future work
Develop static electro-thermal analysis tool for 3D structure
Transient electro-thermal analysis
Develop or employ new method for coupled electro-thermal analysis
IR drop trend and final voltage distribution
Hot spot trend and final on-chip temperature distribution
IR drop with iterations