1. Physical Interfaces & Carriers Japan TC Chapter Liaison Report
March 30, 2017
Ver. 0.1

2. Outline Leadership Current Structure of PI&C Japan TC Chapter
Meeting Information
Document Review Summary
Approved SNARFs
Ballots to be reviewed
Task Force Updates
Other topic

3. Leadership Committee Co-chairs Technical Architect
Tsuyoshi Nagashima (Miraial)
Kenji Yamagata (DAIFUKU)
Tsutomu Okabe (TDK)
Step down as a co-chair at the last PIC Japan TC Chapter meeting in December 2016.
Noriyoshi Toyoda (Hirata Corporation)
Newly appointed by JRSC at the JRSC meeting on August 26, 2016.
Technical Architect
Shoji Komatsu (Acteon NEXT)

4. Current Structure of Japan TC Chapter
Physical Interfaces & Carriers Japan TC Chapter
Tsuyoshi Nagashima (Miraial)
Kenji Yamagata (Daifuku)
Noriyoshi Toyoda (Hirata Corporation)
Technical Architect
Shoji Komatsu / Acteon NEXT
Tsutomu Okabe (TDK)
stepped down from co-chair.
Newly appointed
Fiducial Mark Interoperability TF
I&C Committee: M. Matsuda (Hitachi Kokusai Electric)
PI&C Committee: S. Mashiro (Tokyo Electron)
Silicon Wafer Committee: T. Nakai (SUMCO) Packaging Committee: S. Masuchi (DISCO)
Traceability Committee: H. Tsunobuchi (KEYENCE)
Global PIC Maintenance TF
Larry Hartsough (U.A. Associates)
Shoji Komatsu (Acteon NEXT)
International 450 mm PI&C TF
Melvin Jung (Intel)
Shoji Komatsu (Acteon NEXT)
JA Shipping Box TF
Tsuyoshi Nagashima (Mirial)
Shoji Komatsu (Acteon NEXT)
International Reticle SMIF Pod and Lord Port Interoperability TF
Jan Rothe (GLOBALFOUNDRIES)
International 450mm Shipping Box TF
Tom Quinn (Intel)
Shoji Komatsu (Acteon NEXT)
Under Silicon Wafer Japan TC Chapter
TF under PIC Japan TC Chapter was discharged
International Activities

5. Meeting Information Last meeting Next meeting
Japan Winter 2016 Meetings in conjunction with SEMICON Japan 2016
Wednesday, December 14, :00-17:00
@Tokyo Big Sight Conference Tower, Tokyo
Next meeting
Japan Spring 2017 Meetings
Wednesday, April 19, :30-17:00
@SEMI Japan office, Tokyo

6. Document Review Summary at Japan Winter 2016 Meetings in conjunction with SEMICON Japan 2016
None

7. Approved SNARF at Japan Winter 2016 Meetings in conjunction with SEMICON Japan 2016
Doc #
Description TF
6130
Reapproval of SEMI E , “SPECIFICATION FOR ENHANCED CARRIER HANDOFF PARALLEL I/O INTERFACE”
Global PIC Maintenance TF

8. Ballots to be reviewed at Japan Spring 2017 Meetings
Cycle
Doc #
Description TF
6130
Reapproval of SEMI E , “SPECIFICATION FOR ENHANCED CARRIER HANDOFF PARALLEL I/O INTERFACE”
Global PIC Maintenance TF 8

9. Task Force Updates [1/3] Fiducial Mark Interoperability TF
Last TF meeting was held on November 18, 2015
T7 issues
#5890
Delete all position specifications from SEMI T7 because position specifications are also described on SEMI M1 and other related Silicon Standard.
The ballot passed with editorial changes at the Traceability Japan TC Chapter meeting on Dec. 18, 2015 and published as T
Disbandment of this TF
TF leaders decided to propose disbanding this TF to each technical committee
If this proposal is agreed by all Japan TC Chapters of Assembly & Packaging, I&C, PIC, Silicon Wafers and Traceability, then the TF will be discharged.
Silicon Wafers Japan TC Chapter and Assembly & Packaging Japan TC Chapter agreed in March 2017 respectively.
To be proposed at the next Japan TC Chapter meeting of PIC, I&C and Traceability TCs respectively.
Backend alignment issues with introducing fiducial mark wafer is left.
Would be discussed in Assembly & Packaging Japan TC Chapter after its disbandment.

10. Task Force Updates [2/3]
Global PIC Standards Maintenance Task Force (JA Side)
#6130, Reapproval of SEMI E , “SPECIFICATION FOR ENHANCED CARRIER HANDOFF PARALLEL I/O INTERFACE”
SNARF was approved at the PIC Japan TC Chapter meeting on December 14, 2016
Ballot was submitted for Cycle
Rejects and comments to be reviewed at the TF meeting during NA Standards Spring Meetings
Ballot results to be reviewed at the PIC Japan TC Chapter meeting on April 19, 2017.

11. Task Force Updates [3/3]
International 450 mm Physical Interfaces & Carriers Task Force (JA Side)
#5974: New Auxiliary Information: “450mm PIC INTEROPERABILITY”
SNARF was approved at the Japan TC Chapter meeting on December 16 in conjunction with 2015
The publication for this AUX was approved by the PIC Japan TC Chapter at the TC Chapter meeting on December 14, 2016 and would be forwarded to GCS and A&R for subsequent approval.
However, Safety Check and IP Check were not done at this TC Chapter meeting on this approval procedure, so these checks to be done at the next PIC Japan TC Chapter meeting on April 19,  

12. Other topic
Proposal of New Standards, Specification for Lamella Carriers Used in Transmission Electron Microscopes
According to the decision at the EU TC Chapter meeting in October during SEMICON Europa 2016, the meeting to introduce proposal was held on December 13 at SEMI Japan Office in conjunction with SEMICON Japan 2016
Back ground of this standardization
Presentation on “Enabling HVM TEM metrology support - standards for TEM lamella carriers”
Proposed drafts of SNARF and TFOF
The Japan TC Chapter agreed to support for conducting a survey regarding standardization of TEM and potential further standardization of TEM grid carrier.
SEMI HQ will conduct this survey.
Currently contents of survey form is under drafting.

13. Thank You!
For more information or participate in any Japan PI&C activities, please contact Chie Yanagisawa at SEMI Japan

14. Backup

15. 5 Year Review SEMI E84-1109 SEMI E23-1104 (Reapproved 0710)
The Global PIC Standards Maintenance TF will discuss what to do for SEMI E and then propose any action at the next Japan TC Chapter meeting in conjunction with SEMICON Japan 2016.
SEMI E (Reapproved 0710)
The TC Chapter did not decide any further support action to this standard and let it go inactive.

16. Task Force Updates [4/4]
International Process Module Physical Interface (IPPI) TF
The document worked by this task force was published.
The disbandment of IPPI TF was approved, with pending the EU TC Chapter’s agreement, at the Japan TC Chapter meeting on April 15,
NA TC Chapter approved the disbandment of IPPI TF at the NA PIC TC Chapter meeting in conjunction with NA Standards Spring Meetings, so that the disbandment of this TF was completed.