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Vector Raptor Overlay Analysis for High-Density ASML Data

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Presentation on theme: "Vector Raptor Overlay Analysis for High-Density ASML Data"— Presentation transcript:

1 Vector Raptor Overlay Analysis for High-Density ASML Data
Vector Raptor measured Modeled Rotation showing Full-Field and slit rotation in fields (upper plot) BCD data from scatter Tool (bottom) Vector Raptor Overlay Analysis for High-Density ASML Data ASML measured overlay data 14,900+ data points June 12, 2007

2 Vector Raptor Advanced Overlay Analysis & Modeling
ASML Scanner measured data Model raw data for each structure separately Remove outliers by using the model’s ability for variable-based culling Apply a simple wafer model Remove wafer-model errors Examine IntraField overlay variation error sources

3 ASML Data file 14,918 overlay data points after 20 data points are removed using the X-Reg variable for culling

4 Raw vectored data and sites on field
Field-Site Layout Total of 14,918 sites 20 sites excluded by culling (> 10 nm error) Raw Overlay Data

5 X & Y overlay – Contour Plots of raw data
Xreg data Yreg data Y-reg alignment error Fine-structure rib variation of 3-5 nm due to reticle-scan Process error in both X & Y

6 Wafer Model, magnitude variation
Y-reg alignment error

7 Wafer-modeled X overlay
Full-wafer modeled variation of X-overlay due to process and setup errors.

8 Residuals to wafer model, X-overlay
Xreg Variation along a field vertical axis Note cycle every 4 mm on scan Wafer-modeled errors removed IntraField variation Note graph above showing X-overlay as a function of row-position on field 4 mm cycle due to reticle-stage travel. Approximately 1.5 nm of error Yreg error is greater

9 Residuals to wafer model, X-overlay
5 mm scan-period Row location on field

10 X & Y Vector residuals to wafer registration
Vector plot , Same data as previous slide

11 Variation across wafer diameter
Xreg data Yreg data Residuals to wafer model Plotted X & Y overlay across center row of wafer Note greater variation of Yreg data


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