1. ECE 442

2. Clip-On Heat Sinks
ECE 442

3. Thermal Resistance for Clip-On
ECE 442

4. Bond-On Extrusions for DIP Packages
ECE 442

5. Thermal Performance
ECE 442

6. Thermal Resistances for Bond-On
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7. Example TO-220 case style dissipating 5 watts
RJC = 3.0 C / Watt (from device spec)
TJmax = 150 C
TAmax = 50 C
Find the proper heat sink to keep the junction temperature from exceeding 150C in natural convection.
ECE 442

8. Need to determine a value for RCS – depends on the mounting technique.
If the device is mounted without an insulator, but only with Thermalcote, (silicone grease), check page 57, Figure 9 for TO -220 case style.
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9. Use Thermalcote
RCS = 1 C/W
No Insulator
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10. ECE 442

11. Thermalloy P/N 6030
Temperature rise above 5 Watts Power Dissipation = 66 C
ECE 442

12. Thermal Resistance RSA
As long as RSA is less than 16 C/W, the requirement is met.
ECE 442

13. Thermalloy P/N 6030
ECE 442