1. NA Silicon Wafer Committee Liaison Report
Updated February 25, 2013

2. Meeting Information Last meeting Next meeting
Tuesday, October 30, 2012, NA Fall Standards Meeting
Intel in Santa Clara, CA
Next meeting
Tuesday, April 2, 2013, NA Spring Standards Meeting
San Jose/Santa Clara, CA
for the latest update

3. NA Silicon Wafer Committee
Committee Chairmen
Noel Poduje /SMS
Dinesh Gupta /STA

4. Silicon Wafer Committee C: Dinesh Gupta - STA C: Noel Poduje – SMS
VC: Mike Goldstein – Intel
TE: Murray Bullis – Materials & Metrology
Specifications
Int’l Annealed Wafers TF
Dinesh Gupta -STA
Int’l 450 mm Wafers TF
Mike Goldstein - Intel
Int’l Epitaxial Wafers TF
Dinesh Gupta - STA
Int’l Polished Wafers TF
Murray Bullis -
Materials & Metrology
Int’l SOI Wafers TF
Mariam Sadaka- SOITEC
Metrology
Int’l Advanced Wafer
Geometry TF
Noel Poduje – SMS
Jaydeep Sinha – KLA-Tencor
John Valley - MEMC
Int’l Advanced Surface
Inspection TF
George Kren - KLA-Tencor
Committee
Int’l Test Methods TF
Int’l Terminology TF

5. 12/9/2018
New SNARFs
Int’l ASI TF
Doc. 5503, Line Item Revision to SEMI M Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 11 nm Technology Generations
To add M80, Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers, in reference

6. 12/9/2018
Ballots for Cycle
5450A - Revision to SEMI M , with Title Change to: Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 16 nm Technology Generations
Ballot issued in cycle for review at NA Spring meeting

7. Metrology Group
Int’l Advanced Wafer Geometry TF/Noel Poduje (SMS) & Jaydeep Sinha (KLA-Tencor) [1]
Activities are well coordinated internationally
EU - Doc. 5430A: Revision to M73, Test Methods for Extracting Relevant Characteristics from Measured Wafer Edge Profiles
Ballot issued in cycle for review at SEMICON West

8. Metrology Group
Int’l Advanced Wafer Geometry TF/Noel Poduje (SMS) & Jaydeep Sinha (KLA-Tencor) [2]
Drafting doc. 5540, New Auxiliary Information, Illustration of Flatness and Shape Metrics for Silicon Wafers
Drafting doc. 5539, Revision of SEMI MF (Reapproved 0512) ,Test Method for Measuring Warp on Silicon Wafers by Automated Non-Contact Scanning

9. Metrology Group
Int’l Advanced Surface Inspection TF/George Kren (KLA-Tencor), John Valley (MEMC)
Drafting doc. 5503, Line Item Revision to M Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 11 nm Technology Generations (add M80 in reference)
To address Shimizu-san’s negative from SEMICON West
Discussed SEMI M53 Model Based Calibration (MBC) - Proof of Concept

10. Specifications Group TF will continue to support the 450 mm program.
12/9/2018
Specifications Group
Int’l 450 mm Wafer TF/Mike Goldstein (Intel)
TF will continue to support the 450 mm program.
Doc. 5442, Reapproval of SEMI M , Specification for 450 mm Diameter Mechanical Handling Polished Wafers
Ballot passed at SEMICON Japan, being processed for publication

11. Specifications Group
Int’l Polished Wafer TF/Murray Bullis (Materials & Metrology)
Drafting Doc. 5543, Line Items Revision of SEMI M1, Specifications for Polished Single Crystal Silicon Wafers
This single line item revision corrects a small error in the nanotopography line of Table R1-1 and clarifies the source of the values included therein.

12. Specifications Group Int’l SOI Wafer TF/Mariam Sadaka (SOITEC)
Drafting doc. 5541, Revision of SEMI M Specification of Silicon-on-Insulator (SOI) for Power Device/ICs
5 year review
Table 1-5 needs to be consolidated
Verifying references and test methods

13. Specifications Group Int’l Epitaxial Wafer TF/Dinesh Gupta (STA)
Drafting doc. 5542, Line Item Revision to SEMI M , Specifications for Silicon Epitaxial Wafers
Line items include:
1. Make Revision of Tables R2-7 & R2-8 - Change ¶3-2.7 Nanotopography value and related Footnote #9.
2. Add diameter information to Item Table R2-7, R2-8
3. Add Some editorial changes

14. Specifications Group Int’l Annealed Wafer TF/Dinesh Gupta (STA)
Doc. 5252A, Revision of SEMI M57 Guide for Specifying Silicon Annealed Wafers (Extension to finer geometries, such as to 65nm, 45nm, 32nm, and 22nm)
Ballot was approved at SEMICON Japan, being processed for publication

15. Committee TF
Int’l Terminology TF/Murray Bullis (Materials & Metrology)
Revision SEMI M , Terminology for Silicon Technology
No revision at the present time
Future terms include:
polysilicon,
wafer packaging,
microscopy and optics terms

16. Committee TF Int’l Test Methods TF/Dinesh Gupta (STA)
Doc. 5313B Line Items Revision of SEMI MF , Test Method for Carrier Recombination Lifetime in Silicon Wafers by Noncontact Measurement of Photoconductivity Decay by Microwave Reflectance
Consensus is lacking. Ballot failed at SEMICON Japan.
Doc. is being circulated for feedback for reballot for review at SEMICON West 2013

17. Contact
For more information, please contact Kevin Nguyen at