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Introducing Chulsoon Hwang
Presentation to the Academy of Electrical and Computer Engineering, April 20, 2017
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Professional Background
BS, KAIST, `07 MS, KAIST, `09 Ph.D, KAIST, `12 KAIST: Korea Advanced Institute of Science and Technology, Korea Samsung Electronics, `12-15 Designed mobile phones (desens) Missouri S&T, `15-present Visiting Research Professor, `15-16 Assistant Professor, `16-present
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Signal / Power Integrity
Research Interests Signal / Power Integrity Signal propagation Power delivery (noise) IC / Package / PCB Electromagnetic Interference (EMI) Intra-EMI Inter-EMI Cell phones / vehicles
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Center for EMC (Electromagnetic Compatibility)
S&T heads an NSF I/UCRC on Electromagnetic Compatibility with more than 20 Industry partners 6 tenured/tenure track faculty 7 research faculty >40 students
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Project #1 Intra EMI Funded by Samsung, Sony, and ASUS
An Early Warning System for RF Sensitivity Design Pre-Design Assessment Hardware Debugging performance = target ? no yes Release Noise Radiation and Coupling Physics
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Project #2 Inter EMI Funded by John Deere Full Vehicle EMI Estimation
Cable bundle test Equivalent Source Model Radiation Physics Full vehicle EMI
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Project #3 Silicon-Level Signal/Power Integrity
Seeking Funds from NSF, etc Electrical Performance of 3D-IC/TSV Power Noise Impact on Signal Propagation Through Silicon Via (TSV) 3D-IC Silicon Metal SiO2
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Future Research Directions
Vehicle EMI SI/PI in 3D-ICs / Silicon Interposers
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Instructional Focus EE2200: Introduction to Electronic Devices
Fundamentals on devices (Diode, BJT, and FET) CpE5210: Introduction to VLSI Physical layer design for VLSI Emphasis on design practice using CAD tools Future Plan Advanced Signal/Power Integrity focused on circuit analysis
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