1. Hybrid Testing Status 10 new hybrids brought by Lenny all tested
9 tested with no flaws
1 had 1 chip + 1 wirebond smashed
Looks like finger (most likely FNAL)
FNAL agreed to change packing technique
10 new hybrids just arrived from FNAL
Plan to visual inspect first
Test to keep up with production

2. Ladder Testing Status 8 modules bonded so far
1st module had 3 opens between PA-sensor and 2 opens between sensor-sensor for testing
Gluing at edge of PA
Removed all bonds from problems found in sensor probing
Two channels found to have high noise which increase with voltage
Damage found on sensor
2nd-4th module had bias return bonds missing
Damage to bulk unrepairable
Draw ~80 mA, ~600 mA, ~800 mA
2 opens between APV-PA found in one module, otherwise no other bonding problems
Will turn into x-calibration pieces with shorts and pinholes added on purpose
5th and 6th modules perfect
Three channels have high noise which increases with voltage
Damage found on sensor
7th module had wirebond damage on ~40 channels between APV and PA
Not clear how or when
8th module had no bonding problems
Channels found bad in sensor probing pulled
2 channels has increasing noise vs. voltage
Neighbors of pinhole found in probing

3. Ladder Testing Summary
Bias Current
Sensor Bad Channels
Bonding Bad Channels
Testing
Bad Channels
Total % Bad Channels
Grade
Comments
876
1090 nA
1.5+2 3 1
1.4% B
2 channels with high noise not in sensor probing
0018-P1
613 mA
1.5
Bulk damage
5.5 F
Missing bias bonds, turn into x-calibration piece
0019-P1
758 mA
9.5
2.1%
0024-P1
89 mA
4.5
Bulk damage+2
1.2%
Missing bias bonds, turn into x-calibration piece; 2 opens during APV-PA bonding
877
930 nA
0 (1??)
0.0% A
One channel has increasing noise with voltage; sensor damage seen
878
1100 nA
0 (2??)
Two channels have increasing noise with voltage; sensor damage seen
879
~ 40 smashed wirebonds APV-PA, reconverable
880
720 nA
2(+2??)
0.3%
Neighbors of pinhole 550 V

4. Summary 4 of 8 bonded modules good Of 4 good modules
3 had bias return bonds missing
1 has ~40 APV-PA bonds smashed
Can be repaired
Of 4 good modules
All have channels with increasing noise vs. voltage
2 channels on 1 ladder due to inherit pinhole
5 channels total on 3 ladders due to lithographic errors in sensor production
Not seen in wafer probing