1. North America Physical Interfaces & Carriers Committee
Liaison Report
April 2011

2. Outline Leadership Organization Chart Meeting Information
Ballot Results
New TFOF/SNARF
Upcoming Ballot
Task Force Reports
Tentative schedule for PIC at Spring 2011 Meetings
April 2011
NA PIC Liaison Report

3. Leadership Committee Co-chairs Technical Architect
Mutaz Haddadin / Intel
Matt Fuller / Entegris
Technical Architect
Open
April 2011
NA PIC Liaison Report

4. Organization Chart Physical Interfaces & Carriers Committee New
C: Mutaz Haddadin (Intel)
C: Matt Fuller (Entegris)
New
Global PIC Maintenance TF
L: Larry Hartsough (UA Assoc.)
International Reticle SMIF Pod and LP Reliability TF
L: Astrid Gettel (GLOBALFOUNDRIES)
L: Tom Kielbaso (Entegris)
450mm ATDP TF
L: Stefan Radloff (Intel)
EUV Reticle Handling TF
L: Long He – Sematech / Intel
L: David Halbmaier – Entegris
L: Yoshio Gomei – Canon
L: John Zimmerman – ASML
450 mm IPIC TF
L: Mutaz Haddadin (Intel)
L: Shoji Komatsu (Acteon)
450mm NA Shipping Box TF
L: Tom Quinn / Intel
L: Eric Olson / Entegris
Integrated Measurement
Module - PIC TF
L: Len Kamlet / MKS Instruments
DISBANDED
450mm International Shipping Box TF
L: Yasuhiro Shimizu (Shimizu Consultant)
L: Shoji Komatsu (Acteon)
L: Tom Quinn / Intel
L: Eric Olson / Entegris
Int’l 300 mm Shipping Box TF
L: Louise Courtois / IBM
L: Harry Lawrence / Entegris
RFID Tag Implementation TF
L: Win Baylies / BayTech Group
April 2011
NA PIC Liaison Report

5. Meeting Information Last meeting Next meeting
2010/03/29 at the SEMI NA Spring 2011 Meetings Santa Clara, CA (Intel)
Next meeting
2010/07/13 at SEMICON West 2011 San Francisco, CA (SF Marriott Marquis Hotel)
April 2011
NA PIC Liaison Report

6. Ballot Results
None.
April 2011
NA PIC Liaison Report

7. New TFOFs and SNARFs TFOFs SNARFs None. April 2011
NA PIC Liaison Report

8. Upcoming Ballots (Cycles 1 and 2-11)
None. However, the committee recommended that the Global PIC Maintenance Task Force ballot the following for reapproval:
SEMI E E, Mechanical Specification for Cassettes Used to Transport and Store 300 mm Wafers
SEMI E (R1106), Specification for 150 mm/200 mm Pod Handles
SEMI E , Mechanical Specification for FOUPS Used to Transport and Store 300 mm Wafers
SEMI E , Specification for 300 mm Front-Opening Interface Mechanical Standard (FIMS)
SEMI E , Mechanical Specification for Reduced-Pitch Front-Opening Box for Interfactory Transport of 300 mm Wafers
SEMI E , Provisonal Specification for RF Air Interface Between RFID Tags in Carriers and RFID Readers in Semiconductor Production and Material Handling Equipment
Authorizations for these will be handled by GCS if necessary.
April 2011
NA PIC Liaison Report

9. Task Force Reports [1/3] North America 450mm Shipping Box Task Force
Awaiting closure on LOA’s for E159
Entegris 450 MAC LOA
Two patents dropped (related to cantilever wafer support) and 1 added (cushioned wafer container)
The 2 patents that were dropped were not related to the MAC.
SEMI following up on remaining outstanding LOA
Key discussion topics for future document revision (once published) are:
Clamping conditions during wafer handling
Loadport Frame Pin/Carrier hole tolerance mismatch
Wafer Set Down/Pick Up descriptions/figures
Next meeting not scheduled at this time pending status of LOA closure.
April 2011
NA PIC Liaison Report

10. Task Force Reports [2/3]
Reticle SMIF Pods and Loadport Reliability Task Force
TF will focus first on pod sensing issue
Different opinions exist amongst TF members about appropriate approach
TF will issue a straw poll in the industry to get input on the direction to go
Distribution in March, review results in April
Define first steps for technical work in April/May
Face-to-face meeting at SEMICON West
April 2011
NA PIC Liaison Report

11. Task Force Reports [3/3] EUV Reticle Task Force
Global PIC Maintenance Task Force
Larry Hartsough (UA Associates) has agreed to replace John Davies (T D Systems) as TF co-leader
EUV Reticle Task Force
Plans to submit SNARF for NA PIC approval based on revision plans
TF teleconference every other week
Face-to-face meeting at SEMICON West with focus on automation issues
Yellow ballot submission for Cycle
April 2011
NA PIC Liaison Report

12. SEMICON West 2011 Meeting Schedule for PIC (tentative)
Monday
: Int'l 450mm Shipping Box TF
: NA 450mm Shipping Box TF
: EUV Reticle TF
Tuesday
: Int'l 450mm PIC TF
: Reticle SMIF and LP Reliability TF
: Global PIC Maintenance TF
Wednesday
: NA PIC Committee
April 2011
NA PIC Liaison Report

13. Regional Staff Contact Information
Name
Ian McLeod
Phone
Location
SEMI HQ, San Jose, CA
Committees etc.
Compound Semiconductor Materials
Environmental, Health, and Safety
Flat Panel Display (inactive)
Liquid Chemicals
Metrics
Physical Interfaces and Carriers
Membership
April 2011
NA PIC Liaison Report