1. MVD A SSEMBLY T WO HALF FRAME DONE – D IMENSION T ESTED A NCILLARIES FOR F RAMES DONE – D IMENSION T ESTED F RAME A SSEMBLY & F INAL M ACHINING – MUST BE DONE S PECIAL & P RECISION S CREWS - MUST BE DONE F IXING P OINT OF THE S UB -S TRUCTURES – D EFINED F IXING P OINT FOR S TRIP D ISK MUST BE DEFINED MVD A SSEMBLY S EQUENCE – D EFINED O PEN I TEMS : S ERVICES R OUTING, P ATCH P ANELS

2. MVD I NTEGRATION MVD A LIGNED & F IXED ON C ENTRAL F RAME R EF. B OSSES : TWO OPTIONS GLUING / MACHINING O PEN I TEM : C ENTRAL F RAME D EFINITION C RITICAL P OINT : C ROSS P IPE P OSITION /G EOMETRY MVD F INAL S URVEY P OSITION OF TARGET POINT MUST BE DEFINED MVD S ERVICES R OUTING T ESTS MUST BE DEFINED P ATCH P ANEL P OSITION MUST BE DEFINED O PEN I TEM : S ERVICES R OUTING O UTSIDE THE M AGNET

3. MVD P IXEL -M ECHANICS B ARREL & D ISKS G EOMETRY D EFINED B ARREL & D ISKS A SSEMBLY P ROCEDURE D EFINED BUT NOT TESTED B ARREL & D ISKS C OOLING T UBES A SSEMBLY D EFINED & T ESTED A SSEMBLY T OOLING TO BE DEFINED

4. S ERVICES R OUTING - P ATCH P ANELS V ERY PRELIMINARY PATCH PANELS OUTSIDE STT/TPC VOLUME – PIXEL DISKS PATCH PANELS INSIDE STT/TPC VOLUME – BARREL (PIXEL+STRIP) CRITICITY!!! DIFFERENT PATH FOR CABLES AND TUBES

5. S ERVICES R OUTING - P ATCH P ANELS V ERY PRELIMINARY

8. CENTRAL FRAME DESIGN – TARGET: RIGIDITY TARGET: MAX DEFORMATION < 50μm 1 ST STEP – CURRENT DESIGN 142 μm MVD SUPPORT AREA STATIC LOAD (CROSS PIPE+MVD+STT) M55J/ROHACELL/M55J+TITANIUM (CONNECTING PART ) CENTRAL FRAME DEFINITION

9. CENTRAL FRAME DESIGN – TARGET RIGIDITY TARGET DEFORMATION < 50μm 2 nd STEP – CENTRAL WINDOWS REMOVED 124 μm MVD SUPPORT AREA STATIC LOAD (CROSS PIPE+MVD+STT) M55J/ROHACELL/M55J+TITANIUM (CONNECTING PART )

10. CENTRAL FRAME DESIGN – TARGET RIGIDITY TARGET DEFORMATION < 50μm 3 rd STEP – ALL WINDOWS REMOVED 104 μm MVD SUPPORT AREA STATIC LOAD (CROSS PIPE+MVD+STT) M55J/ROHACELL/M55J+TITANIUM (CONNECTING PART )

11. NEXT STEPS: RIBS EMBEDDED INTO THE STRUCTURE STRESS INDUCED TO THE CROSS-PIPE CONNECTING PARTS MADE BY EPM203 (EPOXY/GLASS) OR CYANATE/CARBON FIBRE CENTRAL FRAME DEFINITION

12. Mechanics TDR DONE & WRITTEN 1)Frame: Geometry, description. Structural constraint. Feasibility. 1)Barrel: Geometry (sensors distribution) Physical constraint. Support and frame connection. 2)Disks: Geometry (sensors distribution) Physical constraint. Frame connection. TO BE DONE A)Assembly sequence. B) Assembly tools. C) End stave electronics boards support definition. D) Mechanical integration with strip parts (barrel & disks)

13. MVD P IXEL - COOLING CARBON FOAM TESTED DISKS COOLING D EFINED & TESTED, SMALL DISKS TO BE OPTIMIZED BARREL COOLING D EFINED & TESTED, TO BE OPTIMIZED O PEN I TEM : TEST WITH MASTER BOND GLUE CFD SIMULATION COOLING PLANT - FIRST DRAFS OF PIXEL PARTS

14. Cooling TDR DONE & WRITTEN 1)Pixel cooling system: Pixel power Thermal request Working condition 2)Test on carbon foam (Young modulus and thermal conductivity at different radiation fields) 3)Disks cooling system: Description Fem analyses and test results on prototype Pressure drop 4)Barrel cooling system: Description Fem analyses and test results on prototype 5)CFD simulation 6)Cooling plant: Description Pixel modularity First drafts TO BE DONE A)Tests with Master Bond glue B)Cooling for the End stave electronics boards C)Strip part integration in the cooling plant D)Final design of the cooling plant