1. Japan Environmental, Health and Safety Committee Liaison Report
NA Spring Meetings 2012
April 5, 2012
SEMI, San Jose, CA., U.S.A.

2. Leadership Committee Co-chairs Supika Mashiro/ Tokyo Electron
Hidetoshi Sakura/ Intel
GCS voting member
EHS Committee representative to the JRSC
Moray Crawford/ Hatsuta Seisakusho

3. Committee Organization
EHS Committee
Supika Mashiro/ TEL
Hidetoshi Sakura/ Intel
Moray Crawford/ Hatsuta
Disbanded
FPD System Safety TF
Ikuo Goto/ Murata Machinary
Naokatsu Nishiguchi/ DNS
S13 Revision TF
Shigehito Ibuka/ TEL
S19 Revision TF
Shigehito Ibuka/ TEL
Takao Nojima/ Intel
S17 Revision TF
Norio Nakashima/ Murata Machinery Shigehito Ibuka/ TEL
STEP Planning WG
Kenji Sugihara/ Panasonic
S23 Revision TF
Shigehito Ibuka/ TEL
Lauren Crane/ KLA-Tencor
Seismic Protection WG
Shigehito Ibuka/ Tokyo Electron
GHG Emission
Characterization TF Shigehito Ibuka/ TEL
Minoru Kagino/ Toshiba
S18 Revision TF
Supika Mashiro/ TEL
Moray Crawford/ Hatsuta

4. Meeting Information Last Meeting Next Meeting
December 9, 2011 in conjunction with SEMICON Japan at Makuhari Messe, Chiba, Japan
Next Meeting
April 19, 2012 at SEMI Japan, Tokyo, Japan

5. Recently Published Standards
SEMI S
Environmental, Health, and Safety Guideline for Silane Flammable Silicon Compounds

6. Ballot Results Passed Committee Review as balloted
Doc.#5323, Reapproval of SEMI S E, Safety Guideline for Worker Protection
Will be forwarded to the ISC A&R SC for procedural review.
Failed Committee Review
Doc.#4976A, Revision to SEMI S , Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for Use with Semiconductor Manufacturing Equipment
Doc.#4712A, New Standard: Guide for F-GHG (Fluorinated Greenhouse Gas) Emission Characterization and Reduction

7. Recent and Upcoming Ballots
Cycle 1 – to be reviewed in April
Doc.#5374, Reapproval of SEMI S , Guide for Semiconductor Manufacturing Equipment Design for Reduction of Environmental Impact at End of Life
Cycle 2 – to be reviewed in April
Doc.#4976B, Revision to SEMI S , Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for Use with Semiconductor Manufacturing Equipment
Doc.#4712B, New Standard: Guide for F-GHG (Fluorinated Greenhouse Gas) Emission Characterization and Reduction

8. TF/ WG/ SG Reports (1/5) S13 Revision Task Force Background:
Appendix and Related Information sections were deleted from Doc.#4976 submitted for Cycle 5, 2010, but there was a reject vote saying those sections should not be deleted.
With support from the NA MESCC last spring, TF decided to retain most of Appendix and Related Information sections as they are in the current published version with as many updates as possible and Doc.#4976A was submitted for Cycle 6, 2011.
There was a reject vote saying those sections add no value, and the NA EHS Committee supported this position last fall.
Doc.#4976A failed committee review at SEMICON Japan.
Doc.#4976B was submitted for Cycle 2, 2012 to see whether or not SEMI S13 should keep Appendix and Related Information sections.
To be reviewed in April.

9. TF/ WG/ SG Reports (2/5) S17 Revision Task Force
SNARF (#5353) to revise SEMI S was approved in September.
No progress has been made yet.
S18 Revision Task Force
Doc.#4400C, Revision to SEMI S : Environmental, Health and Safety Guideline for Silane Family Gases Handling with title change to “Environmental, Health and Safety Guideline for Flammable Silicon Compounds” was submitted for Cycle 5, 2011, and passed the committee and subsequent procedural review by the ISC A&R SC.
Published as SEMI S , Environmental, Health, and Safety Guideline for Silane Flammable Silicon Compounds.
Will work on Japanese translation.

10. TF/ WG/ SG Reports (3/5) S19 Revision Task Force
Worked on Japanese translated version of SEMI S
Disbanded as all the missions were completed.
S23 Revision Task Force
Worked on Japanese translated version of SEMI S
Concluded to give up inclusion of hibernation mode in SEMI S23.
Committee approved to discontinue remaining activities based on SNARF #4977.
Intends to include other components such as refrigerated chillers to Related Information 2.
Started discussion with chiller makers.
As proposal related to equipment idle mode have been brought up to the NA I&C Committee, coordination efforts has been made between the S23 Revision TF and the NA I&C Committee.

11. TF/ WG/ SG Reports (4/5) FPD System Safety Task Force
Worked on Japanese translated version of SEMI S
No other particular activities.
Greenhouse Gas (GHG) Emission Characterization Task Force
Doc.#4712A, New Standard: Guide for GHG (Greenhouse Gas) Emission Characterization was submitted for Cycle 47, but failed committee review.
Doc.#4712B was submitted for Cycle 2, To be adjudicated in April.

12. TF/ WG/ SG Reports (5/5) STEP Planning Working Group
Successfully conducted STEP/SEMI S2 in November, 2011 at SEMI Japan, Tokyo with 70 attendees.
Seismic Protection Working Group
Kick-off meeting was held in March, 2012.
Reviewed the results of Workshop “Seismic Protection and SEMI Safety Guidelines” held at SEMICON Japan 2011.
Started discussion on what are necessary for SEMI Safety Guidelines.

13. Topics
The workshop titled “Seismic Protection and SEMI Safety Guidelines – Seismic protection in SEMI S2/ S17/ S26 and application of SEMI S12 to decontamination of equipment after earthquake –” was held during SEMICON Japan.
The workshop was quite successful, approximately 70 people attended.
It included introduction of SEMI Safety Guidelines applicable to seismic protection and damages after earthquakes, case studies from users (TSMC, Fujitsu), equipment suppliers (TEL), a clean room construction company (Takenaka), damage recovery specialist (Belfore), and panel discussion involving all the speakers.
In the panel discussion, it was pointed out that certain parts of SEMI S2 may not be sufficient for necessary seismic protection, especially HPM tools, and that discussion may be necessary on the value provided by current SEMI S2 as guidance.
Also, there was a discussion that a separate facility safety guideline may be necessary for seismic protection, which covers issues such as bracing of piping system.
Check for the details.

14. Thank you! For more information, please contact:
Akiko Yamamoto, SEMI Japan
Naoko Tejima, SEMI Japan