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US Hybrid/Module/Rod Testing Model
Anthony Affolder (for the US module testing group) Module Testing Meeting March 7, 2003 US Hybrid/Module/Rod Testing Model-Anthony Affolder
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M800 Testing Model Assumptions
Hybrids sent with PA bonded and the PA pulsing /thermal cycle tests performed Until module burn-in available, module production will be limited All modules will be burnt-in using Vienna box due to timing of rod delivery Full testing procedures available at hep.ucsb.edu/cmsUCSB/testproc.doc Module Testing Meeting March 7, 2003 US Hybrid/Module/Rod Testing Model-Anthony Affolder
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US Hybrid/Module/Rod Testing Model-Anthony Affolder
M800 Testing Model (1) Hybrids with PA bonded Quick Visual Inspection (on arrival) Hybrid Basic Test Setup self test, pedestal, noise, calibration pulse measurements Test requirements not finalized ~3 minutes per test If pass, begin characterization test Hybrid Characterization Gain scan, pipeline scan New tests (No requirements, study unusual hybrids at first) ~15 minutes per test Database entry of basic and characterization test results If there is a failure, If clear fault, we will repair part Otherwise send to experts for deeper study Visual Inspection Repair Hybrid Basic Test Obvious Repair Failure Visual Inspection Pass Failure Hybrid Characterization Else Send to experts for study Pass Module Assembly Module Testing Meeting March 7, 2003 US Hybrid/Module/Rod Testing Model-Anthony Affolder
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US Hybrid/Module/Rod Testing Model-Anthony Affolder
M800 Testing Model (2) Module Basic Test Setup self test, IV, pedestal, noise, calibration injection, backplane pulsing and LED pinhole test Requirements still in flux Any problem modules quickly put into repair cycle ~15 minutes per module Database entry for test results Storage until Vienna box available Module Burn-in (Vienna cold box) 24 hour “Burn-in” designed to determine failure rates/times Multiple thermal, electrical cycles Module basic tests + pipeline and gain tests Database entry for long term and qualification tests Module Pinhole Test ARC LED pinhole test unless other simpler tests found to be sufficient Bonded Modules Repair Module Basic Test Obvious Repair Failure Pass Visual Inspection Module Burn-in Pass Failure Module Pinhole Test Else Deeper study Pass Module Storage Module Testing Meeting March 7, 2003 US Hybrid/Module/Rod Testing Model-Anthony Affolder
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US Hybrid/Module/Rod Testing Model-Anthony Affolder
Production after M800 Expected through-put matches anticipated peak production rate plus 33% contingency 12 modules/day per site 24 hybrids PA bonded/tested per day at UCSB Allows us to recover from unexpected shut-downs, schedule slippage, etc. Pitch adaptor wire bonding/testing will be done at UCSB Assumes every module is burnt-in using Vienna box Hopefully we will be able to shift to sampling only at some point To be determined using M800 production Rod assembly/burn-in testing model not completely fixed During rod assembly, modules will be tested upon insertion After gaining confidence, we will move to testing once full side is inserted Should be able to match 1.5 rods/day peak assembly rate production schedule Module Testing Meeting March 7, 2003 US Hybrid/Module/Rod Testing Model-Anthony Affolder
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