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Többmagos Processzorok (2)
Sima Dezső 2008 tavaszi félév (Ver. 2.1) Dezső Sima, 2008
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10. MC repository 10.1 Intel’s MC processors 10.2 AMD’s MC processors
10.3 IBM’s MC processors 10.4 Sun’s MC processors 10.5 Fujitsu’s MC processors 10.6 HP’s MC processors 10.7 RMI’s MC processors
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10.1 Intel’s MC processors 10.1.1 Dual-core mobile processor lines
Dual/quad-core desktop processor lines Dual/quad-core server processor lines Dual-core Itanium processor lines
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Figure: The move to Intel multi-core
10.1 Overview Figure: The move to Intel multi-core Source: A. Loktu: Itanium 2 for Enterprise Computing
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10.1.1 Dual-core mobile processor lines
10.1 Intel’s MC processors Dual-core mobile processor lines Core Duo (32-bit) Yonah Duo 1/2006 65 nm (Pentium M based, monolithic) Core 2 Duo (64-bit) Merom 7/2006 65 nm (Core based, monolithic)
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Figure: Heritage of Intel’s Yonah Duo [1.1]
Core Duo line (1) Figure: Heritage of Intel’s Yonah Duo [1.1]
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Core Duo line (2) Figure: Block diagram and basic floor plan of Yonah Duo [1.5]
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10.1.1 Core Duo line (3) Figure: Block diagram of the Yonah Duo 10.1
Source: Korner R., IDF, Fall 2005,
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Core Duo line (4) Figure: Core Duo with a unified 2 MB L2, consisting of 151 mtrs on a die area of 90 mm2 Source: - „Intels „Core Solo“ und „Core Duo,“
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Figure: Contrasting the die shots of Dothan and Yonah Duo [1.16]
Core Duo line (5) Dothan 90 mm (L2: 2MB) Yonah Duo 65 nm (L2: 2 MB) (enlarged) Figure: Contrasting the die shots of Dothan and Yonah Duo [1.16] Sorce: - „Intels „Core Solo“ und „Core Duo,“
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Core Duo line (6) Series Core Duo Models T2050 / T2250 / T2300E T2300-T2600 T2700 Microarchitekture Pentium M Core Yonah Intro. 5/2006 1/2006 6/2006 Technology 65 nm Die size 90 mm2 Nr. of transistors 151 mtrs fc [GHz] 1.600/1.733/1.666 2.333 L2 2 MB FSB [MT/s] 667 TDP [W] 31 Socket Socket M EM64T HT ED VT EIST La Grande AMT2 Table: Main features of the dual-core mobile Core Duo (Yonah Duo) line [1.8], [1.9]
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Core 2 Duo line (1) Figure: Block diagram of the Merom, Conroe and Woodcrest processors Source: Inkley B. and Tetrick S., „Intel Multi-core Architecture and implementations,” IDF, March 2006,
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Core 2 Duo line (2) Merom 10.1 Figure: Die shot of the Merom processor (L2: 4 MB) Source: Kubicki K., „Intel 2006 Mobile CPU Roadmap Update,” Mai 2006,
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Core 2 Duo line (3) Merom Conroe Woodcrest Figure: Contrasting the die shots of Merom, Conroe and Woodcrest Sources: Kubicki K., „Intel 2006 Mobile CPU Roadmap Update,” Mai 2006, Hübner, T., „Intel Core 2 Duo E6700 und E6600,” July 2006,
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Core 2 Duo line (4) Series T7000 (Merom) Models T5200 / T5500 / T5600 T7200 / T7400 / T7600 Microarchitecture Core Introduced 1/ / /2006 7/2006 Technology 65 nm Die size 143 mm2 Nr. of transistors 281 mtrs fc [GHz] 1.60/1.66/1.83 2.00/2.16/2.33 L2 2 MB 4 MB FSB [MT/s] 533/667/667 667 TDP [W] 34 Socket Socket M EM64T HT ED VT EIST La Grande AMT2 Table: Main features of the dual-core mobile Core 2 Duo (Merom) line [1.8], [1.9]
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10.1.2 Dual/quad-core desktop processors (monolithic)
Pentium D/EE 800 lines (Netburst-,Prescott-based) Pentium D 8xx Smithfield 5/2005 90 nm Pentium EE 840 Smithfield 5/2005 90 nm Pentium D/EE 900 lines (Netburst-,Cedar Mill-based) Pentium D 9xx Presler 1/2006 65 nm Pentium EE 955/965 Presler 1/2006 65 nm Core 2 Duo lines (Core based) Core 2 Duo E6xxx Core 7/2006 65 nm Core 2 Duo X6xxx Core 7/2006 65 nm Core 2 Extreme line (Core based) QX6700 Core 11/2006 65 nm
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Pentium D/EE 800 (1) Figure: Block diagram of the Pentium D 8xx and Pentium EE 840 processors Sources: Kirsch N., „Intel Dual Core: Pentium EE Arrives,” Legit Reviews, Apr. 2005, Inkley B. and Tetrick S., „Intel Multi-core Architecture and implementations,” IDF, March 2006,
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Pentium D/EE 800 (2) Prescott (original core) Smithfield (two modified Prescott cores on the same die) 2/2004 90 nm 112 mm2 125 mtrs L2: 1 MB Pentium 4 A/E/F series Pentium 4 5xx series 5/2005 90 nm 2 x 103 mm2 2 x 115 mtrs L2: 2 MB Pentium D 8xx Pentium EE 840 Figure: Genealogy of the Smithfield processor
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Pentium D/EE 800 (3) Smithfield die Original Prescott die (Two modified Prescott cores on the same die) 112 mm2/125 mtrs 2x103 mm2/2x115 mtrs Figure: Contrasting the original Prescott and the Smithfield dies Sources: and
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10.1.2 Pentium D/EE 800 (4) Figure: Pentium D 8xx/840 (Smithfield)
(Both cores are modified Prescott cores placed on the same die) Source: Computer Desktop Encyclopedia, 2006
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Pentium D/EE 800 (5) LGA775 130 800 2*1 MB 3.2 Netburst 2*115 mtrs 2*103 mm2 90 nm 5/2005 840 Pentium EE (Smithfield) (except 805/820) 95 (920) 130 (else) 533 (805) 800 (else) 5/20051 Pentium D (Smithfield) Microarchitekture AMT2 La Grande VT EIST ED HT Socket TDP [W] FSB [MT/s] L2 fc [GHz] Nr. of transistors Die size Technology Introduced Models Series 1 The Pentium D 805 was introduced 12/2005 2 The Core 2 Duo 6900 is expected to be released 12/2006 Table: Main features of the dual/quad-core desktop lines [1.8], [1.9]
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Figure: Genealogy of the Presler core
Pentium D/EE 900 (1) Intel’s first 64 –bit x86 desktop processor Prescott (original core) Prescott 2M (L2 enhanced to 2 MB) Cedar Mill (65 nm shrink) Presler (2 x Cedar Mill) 2/20041 90 nm 112 mm2 125 mtrs Pentium 4 A/E/F series Pentium 4 5xx series 2/2005 90 nm 135 mm2 169 mtrs Pentium 4 6x0/6x2 series Pentium 4 EE 3.73 1/2006 65 nm 81 mm2 188 mtrs Pentium 4 6x1 series 1/2006 65 nm 2 x 81 mm2 2 x 188 mtrs Pentium D 9xx Pentium EE 955/965 1 The original Prescott core did not support EM64T and used an mPGA 439 socket.. EM64T support was released later, about 6/2004 while changing the socket to LGA 775. Figure: Genealogy of the Presler core
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Pentium D/EE 900 (2) Figure: Block diagram of the Pentium D 9xx and Pentium EE 955/965 processors (Presler) Source: Inkley B. and Tetrick S., „Intel Multi-core Architecture and implementations,” IDF, March 2006,
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Figure: Contrasting the Prescott and the Prescott 2M cores [1.6]
Pentium D/EE 900 (3) Prescott Prescott 2M 90 nm, 112 mm2, 125 mtrs, L2 : 1 MB 90 nm, 135 mm2, 169 mtrs, L2: 2 MB Figure: Contrasting the Prescott and the Prescott 2M cores [1.6]
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Pentium D/EE 900 (4) Prescott 2M (90 nm/135 mm2/169 mtrs) Cedar Mill (65 nm/81 mm2/188 mtrs) Figure. Contrasting the Prescott and Cedar Mill dies (the latter enlarged to 90 nm) [1.6] Further source: Huynh T., „Pressler: Intel Extreme Edition 955,” Dec. 2005,
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Pentium D/EE 900 (5) Figure: The Pentium D 9xx (Presler) processor package Source: Chainbolt, „Intel Pentium D 920 and 955 Extreme Edition,” Febr. 2006,
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Pentium D/EE 900 (6) Series Pentium EE (Smithfield) Pentium D (Presler) Pentium EE (Presler) Models 840 915/925/945 955/965 Introduced 5/20051 5/2005 1/2006 7/2006 1/2006; 3/2006 Technology 90 nm 65 nm Die size 2*103 mm2 2*81 mm2 Nr. of transistors 2*115 mtrs 2*188 mtrs Microarchitekture Netburst fc [GHz] 3.2 2.8/3.0/3.4 3.46/3.73 L2 2*1 MB 2*2 MB FSB [MT/s] 533 (805) 800 (else) 800 1066 TDP [W] 95 (920) 130 (else) 130 95 Socket LGA775 HT ED EIST (expert 805/820) (except 960) VT La Grande AMT2 1 The Pentium D 805 was introduced 12/2005 Table: Main features of the dual/quad-core desktop lines [1.8], [1.9]
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Pentium D/EE 900 (7) Pentium D 8xx Pentium EE 840 Pentium Core Duo Pentium D 9xx Pentium EE 955/965 (side by side arrangement) (symmetrical arrangement) (side by side arrangement) Figure: Basic layout of Intel’s first dual core processors [1.8]
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Core 2 Duo (1) 10.1 Figure: Block diagram of the Merom, Conroe and Woodcrest processors Source: Inkley B. and Tetrick S., „Intel Multi-core Architecture and implementations,” IDF, March 2006,
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10.1.2 Core 2 Duo (2) Figure: Core 2 die shot and package (L2: 4 MB)
Source: Hübner T., „Intel Core 2 Duo E6700 und E6600,” 2006 July,
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Core 2 Duo (3) Merom Conroe Woodcrest Figure: Contrasting the die shots of Merom, Conroe and Woodcrest Sources: Kubicki K., „Intel 2006 Mobile CPU Roadmap Update,” Mai 2006, Hübner, T., „Intel Core 2 Duo E6700 und E6600,” July 2006,
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Core 2 Duo (4) Series Pentium EE (Smithfield) Pentium D (Presler) Pentium EE (Presler) Core 2 Duo (Conroe) Core 2 (Conroe) Models 840 915/925/945 955/965 E6300 – E6700 X6800/X69002 Introduced 5/20051 5/2005 1/2006 7/2006 1/2006; 3/2006 Technology 90 nm 65 nm Die size 2*103 mm2 2*81 mm2 143 mm2 Nr. of transistors 2*115 mtrs 2*188 mtrs 167/291 mtrs 291 mtrs Microarchitekture Netburst Core fc [GHz] 3.2 2.8/3.0/3.4 3.46/3.73 2.93/3.2 L2 2*1 MB 2*2 MB 2 MB (E6300/E6400) 4 MB (else) 4 MB FSB [MT/s] 533 (805) 800 (else) 800 1066 TDP [W] 95 (920) 130 (else) 130 95 65 75 Socket LGA775 HT ED EIST (expert 805/820) (expert 960) VT La Grande AMT2 Table: Main features of the dual/quad-core desktop lines [1.8], [1.9] 1 The Pentium D 805 was introduced 12/2005 2 The Core 2 Duo 6900 is expected to be released 12/2006
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Core 2 Extreme (1) Conroe (die) Kentsfield (two Conroe dies in the same package) 7/2006 65 nm 143 mm2 167/291 mtrs Core 2 Duo E 6x00 series Core2 Extrem X6x00 series 11/2006 65 nm 2 x 143 mm2 2 x 167/291 mtrs Core 2 Extrem QX6x00 series Figure: Genealogy of the Kentsfield processor [1.8]
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Core 2 Extreme (2) Integrated Heat Spreader (to spread more heat from the dies) Figure: Intel’s Kentsfield buit up of two Conroe’s in a single package [1.8]
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Core 2 Extreme (3) Series Pentium EE (Smithfield) Pentium D (Presler) Pentium EE (Presler) Core 2 Duo (Conroe) Core 2 (Conroe) Core 2 Extreme (Kentsfield) Models 840 915/925/945 955/965 E6300 – E6700 X6800/X69002 QX6700 Introduced 1/20051 5/2005 1/2006 7/2006 1/2006; 3/2006 11/2006 Technology 90 nm 65 nm Die size 2*103 mm2 2*81 mm2 143 mm2 2*143 mm2 Nr. of transistors 2*115 mtrs 2*188 mtrs 167/291 mtrs 291 mtrs 2*291 mtrs Microarchitekture Netburst Core fc [GHz] 3.2 2.8/3.0/3.4 3.46/3.73 2.93/3.2 2.66 L2 2*1 MB 2*2 MB 2 MB (E6300/E6400) 4 MB (else) 4 MB 2*4 MB FSB [MT/s] 533 (805) 800 (else) 800 1066 TDP [W] 95 (920) 130 (else) 130 95 65 75 Socket LGA775 HT ED EIST (expert 805/820) (expert 960) VT La Grande AMT2 1 The Pentium D 805 was introduced 12/2005 2 The Core 2 Duo X6900 is expected to be released 12/2006 Table: Main features of the dual/quad-core desktop lines [1.8], [1.9]
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Penryn 1.07 mm2
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Wolfsdale 2.14 mm2 (QC: Yorktown)
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