1. North America Metrics Technical Committee
Liaison Report
April 2011

2. Outline Leadership Organization Chart Meeting Information
Ballot Results
New TFOF/SNARF
Upcoming Ballot
Subcommittee/TF/WG reports
April 2011
NA Metrics

3. Leadership Committee Co-chairs: GCS Voters:
David Bouldin (Fab Consulting)
Mark Frankfurth (Cymer)
GCS Voters:
April 2011
NA Metrics

4. Leadership / Task Force Changes Summary
Leadership Changes:
Norrell Rose (Intel) stepped down as Equipment Training TF Leader, replaced by Mark Cohran (Intel)
Brad Van Eck (ISMI) stepped down as PETM TF leader, replacement to be determined
April 2011
NA Metrics

5. Organization Chart NA Metrics Committee EMC TF E10 Revision TF
Legend
C Chair/Co-Chair
TF Task Force
SE Standards Engineer
TA Technical Architect
TE Technical Editor
SC Subcommittee
VC Vice Chair
NA Metrics Committee
C: David Bouldin (Fab Consulting)
C: Mark Frankfurth (Cymer)
TEs: Chona Shumate (Cymer), Carolyn Busing
TA: Greg Francis (Cymer)
Staff: Ian McLeod
EMC TF
L: Vladimir Kraz (BestESD)
L: Mark Frankfurth (Cymer)
E10 Revision TF
L: Michael Werre (Intel)
L: David Busing (KLA-Tencor)
Metrics Education/Adoption SC
C: Open
ESD/ESC TF
L: Arnie Steinman (Electronics Workshop)
Int’l. Environmental Contamination Ctrl. TF
JA L: Mikio Furukawa (SEP)
EU L: Michael Otto (Fraunhofer)
NA L: Open
Equipment Productivity Metrics TF L: Open
Equipment COO TF
L: Daren Dance (WWK)
L: David Bouldin (Fab Consulting)
Product & Equipment Time Metrics TF
L: Open
Equipment Training TF
L: Chona Shumate (Cymer)
L: Mark Cohran (Intel)
Factory Level Productivity Metrics TF
L: Ron Billings (Ga. Tech/FABQ)
L: Jim Irwin (Irwin Consulting)
Eq. Documentation TF
L: David Bouldin (Fab Consulting)
NOTE: Italics means group is currently inactive.
April 2011
NA Metrics

6. Meeting Information Last meeting Next meeting
NA Spring 2011 Meetings SEMI HQ, San Jose, CA
Next meeting
SEMICON West 2011 San Francisco, CA
April 2011
NA Metrics

7. Ballot Results
Passed
Doc. 4730A, New Standard: Guide for Identification and Classification of Training Tiers
April 2011
NA Metrics

8. New TFOF/SNARF TFOFs - None SNARFs
ESD/ESC TF:
5169, Revision to SEMI E , Guide to Assess and Control Electrostatic Discharge (ESD) and Electrostatic Attraction (ESA) for Equipment
Also, the E10 Revision TF updated its TFOF and the SNARF for Document 3846 (Revision to SEMI E E, Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM))
April 2011
NA Metrics

9. Upcoming Ballots Cycle 4-11
3847C, Revision to SEMI E33-94, Specification for Semiconductor Manufacturing Facility Electromagnetic Compatibility
3846, Revision to SEMI E E, Specification for Definition and Measurement of Equipment Reliability, Availability, and Maintainability (RAM)
4783, New Standard: Guide to Handling Extremely Electrostatic Sensitive (EES) Devices
April 2011
NA Metrics

10. Subcommittee & TF Activities [1/2]
EMC TF
TF has completed review of responses to 3847B and has updated the draft document.
Doc. #3847C is planned for ballot in Cycle 4-11.
ESD/ESC TF
Doc. #4783 is planned for ballot in Cycle 4-11.
SNARF for revisions to E78 approved.
Equipment Cost of Ownership TF
Revisions to E35 and E140 are in progress.
April 2011
NA Metrics

11. Subcommittee & TF Activities [2/2]
Equipment Training TF
Doc. #4730A approved at Spring 2011 Meetings.
E10 Revision TF
Information ballot issued in March; very little feedback received
Document 3846 planned for ballot in C4-11.
PETM TF
The search for a replacement TF leader is in progress.
April 2011
NA Metrics

12. Regional Staff Contact Information
Name
Ian McLeod
Phone
Office Address
North America
Committees etc.
Compound Semiconductor Materials Environmental, Health, and Safety Flat Panel Display Liquid Chemicals Metrics Physical Interfaces & Carriers Membership
April 2011
NA Metrics