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NA Facilities Committee Liaison Report
SEMICON Japan December 2008
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Leadership Chairman Phil Naughton/Applied Materials
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Design for Facilities TF Equipment Energy Rating TF
Facilities Committee C: Phil Naughton – Applied Materials (AMAT) Design for Facilities TF Al Chasey – Arizona State Univ. E51 Revision TF TBD Adapter Plate TF Kandi Collier – Intel Equipment Energy Rating TF TBD
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Meeting Information Last meeting Next meeting
Tuesday, Nov 4, 2008, NA Fall Meetings, San Jose, CA Next meeting Tuesday, March 31, 2009, NA Spring Meetings, Vancouver, Canada
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Ballot Results Summary
Ballot Passed Technical Committee Review None
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Ballots for Next Meetings
SEMI Draft doc. 4319A, Guide for Interfacing Process Equipment Design and Facility System Design
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TF reports [1/4] Design for Facilities TF/Allan Chasey (Arizona State University) Drafting doc. 4319A, Guide for Interfacing Process Equipment Design and Facility System Design, TF has been utilizing teleconferences If interested, contact SEMI staff or Allan at Ballot is expected for cycle 1 next year.
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TF reports [2/4] Adapter Plate Guidelines TF/Kandi Collier (Intel)
Doc. 4286B, Guide for Process Tool Adapter Plates Design, passed committee review April 2008 Applied Materials submitted an appeal due to lack of major supplier inputs-doc was hold off from publication ISC A&R determined the committee follow procedurals properly and there was a balance of membership in the facilities committee at the time balloted Update from Nov – a patent 6,532,715 B2 (Semiconductor substrate processing tool and fabrications facilities integration plate) was raised, the committee reviewed and voted that the patent is not material to the adapter plate document
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TF reports [3/4] SEMI E51 Revision TF/Phil Naughton (AMAT)
Revising E Guide for Typical Facilities Services and Termination Matrix. TF leader stepped down due to heavy travelling schedule. Committee is seeking for new chairman to lead the task force.
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TF reports [4/4] Equipment Energy Rating TF/Phil Naughton (AMAT)
Planned to work on following areas: A Guide to Equipment Energy Ratings Energy Rating Standard for Recirculating Chiller Equipment Including Vapor Compression and Thermoelectric Devices. Energy Rating Standard for Rotary Dry Vacuum Pumps Energy Rating Standard for HEPA/ULPA Fan Filter Unit TF leader stepped down due to heavy travelling schedule.
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