1. NA Facilities Committee Liaison Report
SEMICON Japan
December 2008

2. Leadership
Chairman
Phil Naughton/Applied Materials

3. Design for Facilities TF Equipment Energy Rating TF
Facilities Committee
C: Phil Naughton – Applied Materials (AMAT)
Design for Facilities TF
Al Chasey – Arizona State Univ.
E51 Revision TF
TBD
Adapter Plate TF
Kandi Collier – Intel
Equipment Energy Rating TF
TBD

4. Meeting Information Last meeting Next meeting
Tuesday, Nov 4, 2008, NA Fall Meetings, San Jose, CA
Next meeting
Tuesday, March 31, 2009, NA Spring Meetings, Vancouver, Canada

5. Ballot Results Summary
Ballot Passed Technical Committee Review
None

6. Ballots for Next Meetings
SEMI Draft doc. 4319A, Guide for Interfacing Process Equipment Design and Facility System Design

7. TF reports [1/4]
Design for Facilities TF/Allan Chasey (Arizona State University)
Drafting doc. 4319A, Guide for Interfacing Process Equipment Design and Facility System Design,
TF has been utilizing teleconferences
If interested, contact SEMI staff or Allan at
Ballot is expected for cycle 1 next year.

8. TF reports [2/4] Adapter Plate Guidelines TF/Kandi Collier (Intel)
Doc. 4286B, Guide for Process Tool Adapter Plates Design, passed committee review April 2008
Applied Materials submitted an appeal due to lack of major supplier inputs-doc was hold off from publication
ISC A&R determined the committee follow procedurals properly and there was a balance of membership in the facilities committee at the time balloted
Update from Nov – a patent 6,532,715 B2 (Semiconductor substrate processing tool and fabrications facilities integration plate) was raised, the committee reviewed and voted that the patent is not material to the adapter plate document

9. TF reports [3/4] SEMI E51 Revision TF/Phil Naughton (AMAT)
Revising E Guide for Typical Facilities Services and Termination Matrix.
TF leader stepped down due to heavy travelling schedule.
Committee is seeking for new chairman to lead the task force.

10. TF reports [4/4] Equipment Energy Rating TF/Phil Naughton (AMAT)
Planned to work on following areas:
A Guide to Equipment Energy Ratings
Energy Rating Standard for Recirculating Chiller Equipment Including Vapor Compression and Thermoelectric Devices.
Energy Rating Standard for Rotary Dry Vacuum Pumps
Energy Rating Standard for HEPA/ULPA Fan Filter Unit
TF leader stepped down due to heavy travelling schedule.