1. North America Physical Interfaces & Carriers Committee
Liaison Report
September 2011

2. PIC Liaison Report - September 2011
Outline
Leadership
Organization Chart
Meeting Information
Ballot Results
New TFOF/SNARF
Upcoming Ballot
Task Force Reports
Tentative schedule for PIC at Fall 2011 Meetings
PIC Liaison Report - September 2011

3. PIC Liaison Report - September 2011
Leadership
Committee Co-chairs
Mutaz Haddadin / Intel
Matt Fuller / Entegris
Technical Architect
Open
PIC Liaison Report - September 2011

4. Organization Chart Physical Interfaces & Carriers Committee New
C: Mutaz Haddadin (Intel)
C: Matt Fuller (Entegris)
Global PIC Maintenance TF
L: Larry Hartsough (UA Assoc.)
International Reticle SMIF Pod and LP Reliability TF
L: Astrid Gettel (GLOBALFOUNDRIES)
L: Tom Kielbaso (Entegris)
L: Koji Oyama (Dainichi Shoji)
450mm ATDP TF
L: Stefan Radloff (Intel)
New
450 mm IPIC TF
L: Mutaz Haddadin (Intel)
L: Shoji Komatsu (Acteon)
International Process Module Physical Interface (IPPI) TF
L: Supika Mashiro (TEL)
L: Richard Oechsner (Fraunhofer)
450mm NA Shipping Box TF
L: Tom Quinn / Intel
L: Eric Olson / Entegris
EUV Reticle Handling TF
L: Long He – Sematech / Intel
L: David Halbmaier – Entegris
L: John Zimmerman – ASML
450mm International Shipping Box TF
L: Yasuhiro Shimizu (Shimizu Consultant)
L: Shoji Komatsu (Acteon)
L: Tom Quinn / Intel
L: Eric Olson / Entegris
RFID Tag Implementation TF
L: Win Baylies / BayTech Group
PIC Liaison Report - September 2011

5. PIC Liaison Report - September 2011
Meeting Information
Last meeting
July 13 for SEMICON West 2011 Meetings San Francisco, California
Next meeting
October 26 for NA Fall 2011 Meetings San Jose, California
PIC Liaison Report - September 2011

6. PIC Liaison Report - September 2011
Ballot Results
Doc. # New Auxiliary Document: 450mm SEMI Standards Overview
Passed
PIC Liaison Report - September 2011

7. PIC Liaison Report - September 2011
New TFOFs & SNARFs [1/2]
TFOF
International Process Module Physical Interface Task Force
SNARFs
450 mm IPIC TF
5263, Revision to SEMI E158 (450 FOUP) and SEMI E159 (450 MAC)
EUV Reticle Handling TF
5262, Revision to SEMI E152 (EUV Pod for 150 mm EUVL reticles)
International Reticle SMIF Pod / Load Port
5261, Revisions to SEMI E111 (RSP150), E112 (MRSP150), E19 (SMIF), E19.4 (200 mm SMIF)
PIC Liaison Report - September 2011

8. PIC Liaison Report - September 2011
New TFOFs & SNARFs [2/2]
New SNARFs
Global PIC Maintenance TF
5254, Reapproval for E1.9
5255, Withdrawal of E7 (electrical interfaces, U.S.)
5256, Reapproval for E47
5257, Reapproval for E47.1
5258, Reapproval for E62
5259, Reapproval for E64
5260, Reapproval for 119
5264, Revision to E144 (RFID)
PIC Liaison Report - September 2011

9. PIC Liaison Report - September 2011
Upcoming Ballots
Technical Ballots to be reviewed at the NA Fall 2011 Meetings
Voting Period: Cycle 6
5262, Revision to SEMI E152 (EUV Pod for 150 mm EUVL reticles)
5263, Revision to SEMI E158 (450 FOUP) / SEMI E159 (450 MAC)
5254, Reapproval for E1.9
5255, Withdrawal of E7 (electrical interfaces, U.S.)
5256, Reapproval for E47
5257, Reapproval for E47.1
5258, Reapproval for E62
5259, Reapproval for E64
5260, Reapproval for 119
5264, Revision to E144 (RFID)
PIC Liaison Report - September 2011

10. PIC Liaison Report - September 2011
Task Force Reports [1/3]
New Task Force:
International Process Module Physical Interface (IPPI) TF
Charter
The TF is formed to discuss standardization of physical interface and other interoperability related specification for the 450mm (vacuum) process modules and transfer module of the cluster tool.
Scope:
The TF will assess the industry needs and necessary extent for standardization of physical interface and other interoperability related specification for the 450mm (vacuum) process modules and transfer module of the cluster tool.
For the area that are agreed upon a need for standardization, the TF is expected to develop Standards that define physical interface and other interoperability related specification between the process chamber and the different modules (e.g. transfer module) of a cluster tool, which may be 450mm equivalent of or similar to E21.1 and E22.1 (So-called 300mm MESC Standards).
PIC Liaison Report - September 2011

11. PIC Liaison Report - September 2011
Task Force Reports [2/3]
North America 450mm Shipping Box Task Force / 450 mm IPIC Task Force
Submitted E158 (450 FOUP) and E159 (450 MAC) revision ballot for Cycle 6
Reticle SMIF Pods and Loadport Reliability Task Force
Continuing development of E111, E112, E19, and E19.4 revision ballot (#5261)
Improving RSP sensing on RSP load ports
PIC Liaison Report - September 2011

12. PIC Liaison Report - September 2011
Task Force Reports [2/3]
Global PIC Maintenance Task Force
Submitted 5-year review ballots for Cycle 6
EUV Reticle Task Force
Submitted E152 (EUV Pod) revision ballot (5262) for Cycle 6
PIC Liaison Report - September 2011

13. NA Standards Fall 2011 Meetings
October 24-28
SEMI Headquarters in San Jose, California
Inviting local companies willing and able to host some of the meetings to maintain one-week format
PIC/SiW meetings at Intel (Santa Clara)
EHS meetings at Applied Materials (Santa Clara)
Final schedule to be announced soon
PIC Liaison Report - September 2011

14. NA Standards Fall 2011 Meetings October 24-27
Sunday
Monday
Tuesday
Wednesday
Thursday
Friday
Saturday 23 24 25 26 27 28 29
NARSC
EH&S
Facilities & Gases
HB-LED
Information & Control
MEMS/NEMS
Metrics
Photovoltaic
Physical Interfaces & Carriers
Silicon Wafer
Traceability
3DS-IC
Locations
- SEMI
- AMAT
- Intel
- Hynix
PIC Liaison Report - September 2011

15. NA Standards Fall 2011 Meetings Meeting Schedule for PIC (tentative)
Monday, October 24
: Int'l 450mm Shipping Box TF
: NA 450mm Shipping Box TF
: Int’l Process Module Physical Interface TF
Tuesday, October 25
: Int'l 450mm PIC TF
: Global PIC Maintenance TF
: Reticle SMIF and LP Reliability TF
: EUV Reticle TF
Wednesday, October 26
: NA PIC Committee
PIC Liaison Report - September 2011

16. NA Standards Staff Changes
Paul Trio
Sr. Manager, NA Standards Operations
Operations
Committees: NARSC / I&C / ATE / MEMS / Microlithography, HB-LED / 3DS-IC
Meetings & Events Planning
General Information
STEPS/Workshops and Sponsorships
Kevin Nguyen
Manager, NA Standards Committees
Committees: Facilities / Gases / PV / PV Automation / PV Materials / Silicon Wafer / Traceability
Standards Website
Provisional: Contact Paul Trio or Kevin Nguyen
Committees: Compounds Semiconductor Materials / EHS / FPD / Liquid Chemicals / Metrics / PIC
Ian McLeod has moved to a new company. New hire for Standards Engineer in progress.
PIC Liaison Report - September 2011

17. PIC Liaison Report - September 2011
Thank You!
For more information or participate in any NA I&C activities, please contact Paul Trio at SEMI
PIC Liaison Report - September 2011