1. Passitivation Location
Location of areas without passitivation darker

2. UCSB Old TOB Signal Bond Damage
Looked for damage on the signal bonds
We found on all signal bonds the area near the very end of the wire was pocked
It is at the same location of the discoloration of the passitivation seen on channels
Approx mm from the wire bond feet

3. Old TEC Ring 5 Modules Built at UCSB
Good News
Bonds Higher
~150 mm Bias, ~350 Signal
Less Damage Seen
Bad News
Discoloration seen of passitivation of DC pads, bias ring, and guard ring on bias and signal bonds
DC Pads
Guard Ring
DC Pads
Bias Ring
Bias Ring

4. Old TEC Ring 7 Modules Built at UCSB
Good News
Bonds Higher
~150 mm Bias, ~350 Signal
Less Damage Seen
Bad News
Discoloration seen of passitivation of DC pads, bias ring, and guard ring on bias and signal bonds
Metal line deposited under bias bonds between bias and guard rings
DC Pads
Guard Ring
DC Pads
Bias Ring
Bias Ring

5. UCSB Modules with New Bond Heights
Bonding clearance over inside n+ metal edge increased for all module types
R5- ~350 mm bias bonds and ~520 mm signal bonds
R7- ~425 mm bias bonds and ~525 mm signal bonds
TOB- ~450 mm bias bonds and ~550 mm signal bonds
No visible damage seen under bias and channel bonds
Plan on running modules for extended periods under voltage in the Vienna box