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Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Temperature Dependence
Some material properties have a linear dependence on temperature while others may have an exponential relationship Figure 13.1 Figure 13.2 Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Viscous Flow and Creep Strain rate in very viscous fluids
from an applied tensile stress Creep – slow, continuous deformation of a material at elevated temperatures, ending in fracture Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Creep Testing Specimen is loaded in tension or compression,
usually at a constant load, inside a furnace that is maintained at a constant temperature Figure 13.3 Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Steady-state creep rate
The constants ε0, σo, n, and Qc are experimentally found and vary from material to material Figure 13.4 Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Stress-Rupture Curve Figure 13.5 Design data based on creep is generally presented in a stress-rupture curve – allows you to identify either the design stress or rupture life at a given temperature Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Melting Point The temperature at which a material starts
to creep depends on its melting point Figure 13.6 Polymers can start to creep at room temperature Metals Tm Ceramics Tm Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Strength – Maximum Service Temperature
Figure 13.7 Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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At room temperature, material selection requires only
Figure 13.8 At room temperature, material selection requires only a single strength-density chart For high-temperature design, charts are needed that account for temperature and an acceptable strain rate Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Diffusion Diffusion is the spontaneous intermixing of
atoms over time – the rate of diffusion is expressed by Fick’s law: D: diffusion constant dc/dx: concentration gradient Figure 13.9 In a crystalline solid, two things are needed for an atom to switch sites: Enough thermal energy An adjacent vacancy Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Interdiffusion Diffusion of chemically different atoms
Figure 13.10 Qd – activation energy per mole Do – constant based on oscillation of atoms and atomic size Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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The mean distance that one type of atom
Figure 13.11 The mean distance that one type of atom travels from diffusion is given by Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Diffusional Flow Diffusion can change the shape
of polycrystalline materials Figure 13.12 Grain boundaries act as sources and sinks for vacancies If a vacancy joins a boundary, an atom must leave it – if a vacancy leaves a boundary, and atom must join it Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Dislocation Climb Diffusion can allow a dislocation to
Figure 13.13 Diffusion can allow a dislocation to move beyond particles in its path The half-plane of atoms is eaten away by diffusion, allowing the dislocation to “climb” over the impeding particle This is the basis of power-law-creep which is defined by: Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Deformation Mechanisms
Materials can deform by dislocation plasticity, or at high temperatures, by diffusional flow or power-law creep Figure 13.14 Deformation mechanism maps show the range of stress and temperature in which we expect to find each sort of deformation and the strain rate that any combination of them produces Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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due to creep by creating voids that nucleate on grain boundaries
Creep Fracture Diffusion can cause creep as well as fracture due to creep by creating voids that nucleate on grain boundaries Figure 13.15 Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Creep and Diffusion of Polymers
As in crystalline solids, polymers creep and the creep is often related to diffusion – diffusion requires free volume (vacancies for metals) which is found dispersed among all atoms in a polymer since there is no lattice structure Figure 13.16 Free volume increases with temperature and does so most rapidly at Tg Polymers behave in a visco-elastic manner around their Tg meaning they act neither as an elastic solid or viscous liquid Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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The visco-elastic nature of polymers reduces the
Figure 13.17 The visco-elastic nature of polymers reduces the rate of creep while being loaded and allows for a small amount of reverse creep upon unloading The creep modulus Ec is used when designing polymers against creep Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Materials to Resist Creep
Figure 13.18 Materials to Resist Creep Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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High-Temperature Pipework
Figure 13.19 Typical operating conditions of 650 °C at a pressure of 15 MPa Figure 13.20 Design For a known design life, use the chart to find the stress below which fracture will not occur – then plug the stress value into the equation to find the minimum pipe thickness Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Turbine Blades At typical stress and temperature levels,
Figure 13.21 At typical stress and temperature levels, pure nickel would deform by power-law creep at an unacceptable level – the impact of strengthening mechanisms on MAR-M200 nickel alloy reduces this rate by a factor of 106 – diffusional creep can then be slowed by increasing the grain size Figure 13.22 Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Thermal Barrier Coatings
Figure 13.23 Design against creep can include the use of thermal barrier coatings For the turbine blade shown in Figure 13.23, a ceramic coating is applied to the metal surface allowing for an increase in gas temperature with no increase in that of the blade itself Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Airframes Aircraft flying above speeds of
Figure 13.24 Aircraft flying above speeds of Mach 1 are subject to creep due to high temperatures and thermal expansion caused by the ΔT of the jet and the atmosphere Material selection for this application has several potential limiting factors – a combination of tensile strength and high temperature performance is required, but weight often forces a material with lower than desired values to achieve optimal speed Figure 13.25 Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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Creep causes pre-tensioned components
Creep Relaxation Creep causes pre-tensioned components to relax over time Figure 13.26 Materials: engineering, science, processing and design, 2nd edition Copyright (c)2010 Michael Ashby, Hugh Shercliff, David Cebon
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