1. Si2 Panel Discussion Design for 3D Standards, Ahead or Behind?
Herb Reiter
eda 2 asic Consulting, Inc
June 2, 2014
1/17/2019

2. Designers of 2.5/3D Solutions Materials- & Equipment Vendors
The Design Ecosystem
Designers of 2.5/3D Solutions
IC INFO
& ORDERS
PKG INFO
& ORDERS
Design Tools
EDA
Vendors
Modeling Tools
PrDK
PaDK
IC FABs
AND
OSATs
Materials- & Equipment Vendors
1/17/2019

3. Design Standards, Ahead or Behind ?
Optimizing Unit Cost, Reliability, Power, Performance and TTM requires tools
There is a BIG difference between 2.5D- and 3D Design Challenges
3D memory- and 2.5D IC designers use proven tools and/or in-house solutions now
Many 2.5D prototypes ongoing now, dozens of production-designs in progress
Heterogeneous 3D designs MUST HAVE powerful STANDARDS-COMPLIANT tools support
Larger portion of value creation shifting to packaging, assembly and test !!!
Major cost reduction efforts in Packaging Materials and Methods ongoing
Major cost increases by following Moore’s Law will accelerate consolidation
Calls to Action:
Educate SYSTEM- and IC designers
Intensify EDA  OSAT dialog to lower cost
Expand on JEDEC, SEMI, SEMATECH, Si2,.. Stds
Review which 2.5D steps need EDA Standards
Analyze value of die-level IP on interposers
Look at 3D-ICs from SYSTEM-level perspective,
then develop top-down FLOWS
Define new business models, cooperate
Source: Amkor POSSUMTM White Paper
1/17/2019

4. Face-to-Face Dice Stacking (1)
1/17/2019
Source: Amkor POSSUMTM White Paper