1. Japan Regional Standards Committee (JRSC)
Liaison Report
March 2012
Prepared by Junko Collins
Venue, Location, Date

2. Contents JRSC General Information Upcoming Japan TC Meetings
Highlights from the last meeting (JRSC SEMICON Japan 2011)
2011 Standards Awards Recipients
Staff Change & Contact Information

3. JRSC General Information
JRSC Leadership
Masaaki Yamamichi /Chair Person (AIST)
Mitsuhiro Matsuda/Chair Person (Hitachi Kokusai Electric)
Supika Mashiro /Vice Chair Person (Tokyo Electron)
Last Meeting (91st Business Meeting)
December 5, Japan, Tokyo
Next Meeting (92nd Business Meeting)
April 20 (14:00-17:00), Japan, Tokyo
Organization Chart
See next slide

4. JRSC (Japan Regional Standards Committee) Organization Chart
As of Feb. 8, 2012
Coordination Group
JRSC
Co-Chair: Masaaki Yamamichi (AIST)
Co-Chair: Mitsuhiro Matsuda (HKE)
Vice Chair: Supika Mashiro (TEL)
FPD Coordination Group
Yoshitada Nogami (SK Electronics)
Makoto Yamamoto (Muratec Automation)
Standardization Process
Integration (SPI)
Supika Mashiro (TEL)
I&C C
Takayuki Nishimura (DNS)
Mitsutoshi Matsuda
(Hitachi Kokusai)
Silicon Wafer C
Naoyuki Kawai (Tokyo Unv.)
Tetsuya Nakai (SUMCO)
EHS C
Hidetoshi Sakura (Intel)
Supika Mashiro (TEL)
Moray Crawford
(Hatsuta Seisakusho）
PV Automation C
Terry Asakawa (TEL)
Emi Ishikawa （Atelier Ishikawa)
M. Ishikawa (Nisshinbo)
FPD Meteorology C
TBD (Sharp)
Ryoichi Watanabe
(Toshiba Mobile Display)
Yuji Yoda
(Otsuka Electronics)
PI&C C
Shoji Komatsu (Acteon)
Tsuyoshi Nagashima
(Miraial)
Tsutomu Okabe (TDK)
Compound
Semiconductor
Materials C
Masayoshi Obara (SHE)
TBD
Gases & Facilities C
Hiromichi Enami
(Hitachi High-Technologies
Isao Suzuki (MKS Japan)
PV Materials C
Takashi Ishihara
(Mitsubishi Ele.) Masaaki Yamamichi (AIST)
Kazuhiko Kashima
(Covalent Materials)
FPD Factory Automation C
Yasunobu Otogawa (Daihen)
Harumichi Hirose
(Shibaura Mechatronics)
Metrics C
Toshio Murakami ( Murakami Shoji)
TBD
Packaging C
Kazunori Kato (AiT)
Yutaka Koma (Advisor)
M. Tsuriya (Consultant)
Liquid Chemicals C
Hiroshi Tomita (Toshiba)
Kenji Sugimoto (DNS)
FPD Materials & Components C
Hisashi Aruga (Seiko Epson)
Tadahiro Furukawa
(Kyodo Printing)
Yoshihiko Shibahara (FUJIFILM)
PV C
Hiromu Takatsuka
(MITSUBISHI HEAVY
INDUSTORIES)
Kazuhiko Kashima
(Covalent Materials)
Terry Asakawa (TEL)
Masaaki Yamamichi (AIST)
Traceability C
Yoichi Iga (Renesas Ele.)
Tsunobuchi Hirokazu (Keyence)
Test C
Hiroshi Kaga
(Renesas Electronics)
Takashi Umenaga (Teradyne)
Micropatterning C
Iwao Higashikawa
(Toshiba)
FPD Mask C
Atsushi Okazaki
(SK-Electronics)
Kaname Nitobe (HOYA)

5. Upcoming Japan TC Meetings (Mar. – Apr.) As of March 27
Event / Meeting Name
Event Type
Contents
Silicon Wafer C Meeting TC
March 6, 2012
SEMI Japan, Tokyo
Korea FPD Metrology C Meeting
March 7, 2012
Seoul, Korea
Gases and Facilities C Meeting
March 23, 2012
Europe PV Standards Meetings
TF/TC
March 27-28, 2012
Berlin, Germany (PV Fab Forum)
NA Standards Spring 2012 Meetings
April 2 -5, 2012
SEMI Headquarters in San Jose, CA
PV/ PV Materials C Meeting
April 10, 2012
Metrics C Meeting
April 11, 2012
PV Automation C Meeting
Mircopatterning C Meeting
April 12, 2012
Korea I&C C Meeting
April 13, 2012
PI&C C Meeting
Liquid Chemical C Meeting
Information & Control C Meeting
April 19, 2012
EHS C Meeting
Traceability C Meeting
April 26, 2012
FPD Materials & Components C Meeting
April 27, 2012
For more information 
Staff Report - Feb 2012

6. Highlights from the last meeting (JRSC SEMICON Japan 2011)
Membership Change
JRSC：
M. Yamamoto (Muratec Automation) stepped down and M. Matsuda (Hitachi Kokusai Electric) was assigned as new co-chair.
Metrics:
M. Furukawa (ShinEtsu Polymer) stepped down.
Packaging:
H. Tabata (Osaka Univ.) stepped down and M. Tsuriya (Consultant) was assigned as new co-chair.
PV Automation:
M. Ishikawa (Nisshinbo) was assigned as new co-chair.
SPI TF
LOA limbo situation
Proposed to Reg. SC to change the Regulations.
(It is discussed among Reg. SC members.)

7. 2011 Standards Awards Recipients
SEMI Japan Standards Award
JRSC Honor Award
Haruo Tabata Osaka University
Mitsune Sakakoto Tokyo Electron
Mikio Furukawa ShinEtsu Polymer
Makoto Yamamoto Muratec Automation

8. 2011 Standards Awards Recipients
JRSC Special Award
International Collaboration Award
Yuji Yoda Otsuka Electronics
Masataka Uchidoi Panasonic
Minoru　Kagino Toshiba
Takashi Ishihara Mitsubishi Electric
Keizou Ochi Konica Minolta Sensing
Ryoichi Watanabe Toshiba Mobile
Satoshi Nakada Sony

9. Staff Change & Contact Information
A. Yamamoto to transfer to PV Department
N. Tejima to be transferred from Program Department
New Staff responsibilities will be effective in the end of April.
Junko Collins
Sr. Manager, Standards, EHS & Advocacy
Operations General Information Committees: JRSC (including SPI TF), Compound
EHS, SIGs
Naoko Tejima
Manager, Standards
Committees: EHS, Gases & Facilities, Liquid Chemical, Packaging, Micropatterning, FPD FA, FPD M&C, FPD Metrology, FPD Mask
Chie Yanagisawa
Sr. Coordinator, Standards
Committees: I&C, Metrics
BOSS Publication, SEMIViews
Hirofumi Kanno
Sr. Coordinator, Standards
Committees: Silicon Wafer, PI&C, Traceability, PV, PV Automation, PV Materials, Test, SPI TF
STD Membership, Web Contents Manager
Red: responsibility newly assigned

10. Overall TC Updates from SJ2011

11. Org. Name Information Last Meeting: Dec. 9, 2011 (SJ2011)
EHS Committee
Last Meeting: Dec. 9, 2011 (SJ2011)
Next Meeting: SEMI Japan Standards Spring 2012 Meetings
Thursday, April 19, :00-17:00
SEMI Japan, Tokyo, Japan
S19 Revision Task Force: disbanded
Technical Ballot Action:
4976A Revision to SEMI S , Environmental, Health and Safety Guideline for Documents Provided to
the Equipment User for Use with Semiconductor Manufacturing Equipment Failed
4712A New Standard: Guide for F-GHG (Fluorinated Greenhouse Gas) Emission Characterization and
Reduction Failed
5323 Reapproval of SEMI S E, Safety Guideline for Worker Protection Passed as balloted
Technical Ballots Expected for Review near future
4976B: Revision to SEMI S , Environmental, Health and Safety Guideline for Documents Provided to the Equipment User for Use with Semiconductor Manufacturing Equipment
As early cycle as possible, by S13 Revision Task Force
4712B: New Standard: Guide for GHG (Greenhouse Gas) Emission Characterization
As early cycle as possible, by GHG Emission Characterization TF
TBD: Reapproval of SEMI S , Guide for Semiconductor Manufacturing Equipment Design for Reduction of Environmental Impact at End of Life
C1-11, by EHS Committee
NARSC Report - February 2012

12. Org. Name Information Last Meeting: Dec. 6, 2011 (SJ2011)
Facilities & Gases
Last Meeting: Dec. 6, 2011 (SJ2011)
Next Meeting: March 23, 2012 Japan, Tokyo, Japan (SEMI Japan Standards Spring 2012 Meetings)
New SNARF
Reapproval of SEMI F , Specification for Machined Stainless Steel Weld Fittings by the TC
Reapproval of SEMI F , Specification for Machined Stainless Steel Reducing Weld Fittings by the TC
Technical Ballots Expected for Review near future
5026C: Revision to SEMI F1-96, Specification for Leak Integrity of High-Purity Gas Piping Systems and Components
C1-12, by F1 Revision Task Force
TBD: Reapproval of SEMI F , Specification for Machined Stainless Steel Weld Fittings
C1-12, by Gases and Facilities Committee
TBD: Reapproval of SEMI F , Specification for Machined Stainless Steel Reducing Weld Fittings
C1-12 Gases and Facilities Committee
Liquid Chemicals
Last Meeting: Dec. 6, 2011(SJ2011)
Next Meeting: April 13, 2012 SEMI Japan, Tokyo, Japan (SEMI Japan Standards Spring 2012 Meetings)
New Standard: Test Method for Tensile Strength Applied to Welded Connections Made by PFA Weld Fitting by Welding Fitting Task Force
5067A: New Standard, Test method for Particle Removal Performance of Liquid Filter with Mono-dispersed Polystyrene Latex (PSL) Beads
C1-12, by Liquid Filter Task Force
5225: New Standard: Test Method for Counting Efficiency of Liquid-borne Particle Counter for which the Measureable Particle Size is Smaller than 100 nm
C1-12, by Liquid-borne Particle Counter Task Force
NARSC Report - February 2012

13. Org. Name Information Last Meeting: Dec. 9, 2011 (2011)
I&C
Last Meeting: Dec. 9, 2011 (2011)
Next Meeting: April 19, 13:30 to Japan Office, Tokyo (SEMI Japan Standards Spring 2012 Meetings)
Technical Ballot Action:
5194: Revisions to SEMI E5-0611E, SEMI Equipment Communications Standard 2 Message Content (SECS-II). Correcting some errors All 4 line items passed as balloted
5227: Reapproval of SEMI E , Specification for Interbay/Intrabay AMHS SEM (IBSEM) Passed as balloted (Super clean)
5228 Reapproval of SEMI E , Specification for AMHS Storage SEM (Stocker SEM) Passed as balloted (Super clean)
TFOF/SNARF
Equipment Information System Security (EISS) Task Force /Leader: M. Sakamoto (TEL)
5367:Line item revision to E , SPECIFICATION FOR CARRIER MANAGEMENT (CMS). Load Port Transfer Error Indication by GEM300 TF.
5368: Reapproval of SEMI E E, SPECIFICATION FOR WAFER ID READER COMMUNICATION INTERFACE — The WAFER ID READER FUNCTIONAL STANDARD: CONCEPTS, BEHAVIOR AND SERVICE and SEMI E SPECIFICATION FOR SECS-I AND SECS-II PROTOCOL FOR WAFER ID READER COMMUNICATION INTERFACE STANDARDS by I&C Committee
Sensor Bus TF New task force. /Leader H. Ogihara
5369: Sensor Bus TF Revision to SEMI E (Reapproved 1211) SPECIFICATION OF SENSOR/ACTUATOR NETWORK FOR A-LINK by Sensor Bus TF
Technical Ballots Expected for Review near future
5368: Reapproval for SEMI E E, SPECIFICATION FOR WAFER ID READER COMMUNICATION INTERFACE — The WAFER ID READER FUNCTIONAL STANDARD: CONCEPTS, BEHAVIOR AND SERVICE and SEMI E SPECIFICATION FOR SECS-I AND SECS-II PROTOCOL FOR WAFER ID READER COMMUNICATION INTERFACE STANDARDS
Cycle 2-12, by I&C Committee
5369: Revision to SEMI E (Reapproved 1211) SPECIFICATION OF SENSOR/ACTUATOR NETWORK FOR A-LINK
Cycle 2-12, by Sensor Bus TF
NARSC Report - February 2012

14. Org. Name Information Last Meeting: Dec. 8, 2011 (SJ2011)
Silicon wafer
Last Meeting: Dec. 8, 2011 (SJ2011)
Next Meeting: March 6, 2012 Japan Office, Tokyo (SEMI Japan Standards Spring 2012 Meetings)
Technical Ballot Action:
5034 Revision of SEMI M , Specification for Silicon-on-Insulator (SOI) Wafers for CMOS LSI Failed
4766A Revision to SEMI M with title change to: Guide for Specifying Scanning Surface Inspection Systems for Silicon Wafers for the 130 nm to 11 nm Technology Generations Passed as balloted
4846B New Standard: Test Method for Analyzing Organic Contaminants on Silicon Wafer Surfaces Failed
5253A Revision of SEMI M , Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 22 nm Technology Generation Passed with editorial changes
5321 Revision to SEMI M , Specification for Polished Monocrystalline Silicon Premium Wafers
Line Item 1 Passed with editorial changes
5322 Revision to SEMI M , Specification for Silicon Epitaxial Wafers with Buried Layers
All 3 lineitems passed as balloted
SNARF
Revisions to SEMI M , Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers by Int'l 450mm Shipping Box Task Force
Technical Ballots Expected for Review near future
5251 Revision of SEMI M1, Specifications for Polished Single Crystal Silicon Wafers (Re:Addition of node-specific guides)
C1-12, by Int'l Polished Wafers Task Force
5342 Revision to M Specifications for Silicon Epitaxial Wafers (Addition of 450 mm wafer to Table R2-8 Epi wafer guide for 22nm technology Generation)
C1-12, by Int'l Epitaxial Wafers Task Force
5034A Revision of SEMI M , Specification for Silicon-on-Insulator (SOI) Wafers for CMOS LSI
C1-12, by Int'l SOI Wafers Task Force
5029B Revision to SEMI M , with title change from: Test Method for Characterizing Silicon Wafers by Gate Oxide Integrity to: Test Method for Time Zero Dielectric Breakdown Characteristics of SiO2 Films for Silicon Wafer Evaluation
C1-12, by Test Method Task Force
NARSC Report - February 2012

15. Org. Name Information Last Meeting: Dec. 9, 2011 (SJ2011)
PI&C
Last Meeting: Dec. 9, 2011 (SJ2011)
Next Meeting: April 13, Japan Office, Tokyo (SEMI Japan Standards Spring 2012 Meetings)
Technical Ballot Action:
5205 Revision to SEMI E , Mechanical Interface Specification for 450 mm Load Port Passed with editorial changes
SNARF
5363 Removal of SEMI E : Specification for Electrical Interface, Japan Only by Global PIC Maintenace TF
5364 Revision to SEMI E : Mechanical Interface specification for 450mm Front-Opening Shipping Box Load Port by 450 IPIC TF
Both have been Submitted to Cycle 1, 2012.
NARSC Report - February 2012

16. Org. Name Information PV Automation
Last Meeting: Dec. 6, 2011 (SJ2011)
Next Meeting: April 12, Japan, Tokyo, Japan (SEMI Japan Standards Spring 2012 Meetings)
New Co-Chair
Makoto Ishikawa (Nisshinbo Mechatronics)
PV Materials
Next Meeting: April 12, 2012 SEMI Japan, Tokyo, Japan (SEMI Japan Standards Spring 2012 Meetings)
Metrics
Last Meeting: Dec. 8, 2011 (SJ2011)
Next Meeting: April SEMI Japan, Tokyo, Japan (SEMI Japan Standards Spring 2012 Meetings)
Traceability
Last Meeting: Dec. 7, 2011 (SJ2011)
Next Meeting: April SEMI Japan, Tokyo, Japan (SEMI Japan Standards Spring 2012 Meetings)
New Task Force
Japan PV Traceability Task Force
Leaders: Hirokazu Tsunobuchi / Keyence, Yoichi Iga / Renesas Electronics
SNARF
5361 Reapproval of SEMI T , Specification of Substrate Traceability by 5 Year Review TF
5362 Reapproval of SEMI T , Specification of Parts and Components Traceability by 5 Year Review TF
5365 Revision to T , General Specification of Jig ID: Concept by JIG and Unit Package ID TF
TBD Revision of G83: Specification for Bar Code Marking of Product Packages; add 83.1 for Reduce Space Marking of Product Packages by JIG and Unit Package ID TF
All those documents will be submitted for Cycle2, 2012
NARSC Report - February 2012

17. Thank you for your attention!

18. Back-up
Venue, Location, Date

19. PV Japan 2011 Seminar/Workshop
Workshop on SEMI Standards related to Horizontal Communication between PV Equipment － In pursuit of establishment of global standards on communication interface between adjacent equipment and different field buses －
Date: Tue., December 6 13:00–16:00 No Interpretation
Venue: Room 303, 3F, Int'l Conference Hall, Makuhari Messe
Program Co-Chairs: Makoto Ishikawa, Nisshinbo Mechatronics Takashi Murakami, Tokyo Electron FE
Topics
Merits gained from standardization
Overview of SEMI standards on communication between PV equipment, which are under development
Demonstration for communication
The latest developments of SEMI standards activities

20. SEMICON Japan 2011 Seminar/Workshop
Seismic Protection and SEMI Safety Guidelines - Seismic protection in SEMI S2/ S17/ S26 and application of SEMI S12 to decontamination of equipment after earthquake
Date/Time: Wed., December 7 13:00–17:00
Location: Room 302, 3F, Int'l Conference Hall, Makuhari Messe
Program Chair: Hidetoshi Sakura, Intel Supika Mashiro, Tokyo Electron
Topics:
Seismic protection design section in SEMI S2/ S26 and S17
Case study
Application of SEMI S12 to decontamination of equipment after the earthquake

21. SEMICON Japan 2011 Seminar/Workshop
STEP/450: SEMI Standards Technical Education Program on 450 mm Wafer
Date: Fri., December 9 13:00–16:45
Venue: Room 302, 3F, Int'l Conference Hall, Makuhari Messe
Program Chair: Shoji Komatsu, Acteon
Topics
450mm Semiconductor Manufacturing Transition Tom Jefferson, ISMI
Overall Concepts of 450mm SEMI Standards Shoji Komatsu, Acteon Corporation
Basics of SEMI Standards(G88) on 450mm Packaging Process Sumio Masuchi, DISCO CORPARATION
450mm Silicon Wafers Status Update Mike Goldstein, Intel Corporation
Explanations for 450mm FOUP (E158) and MAC (E159), FOSB Tsuyoshi Nagashima, Mirial Co., Ltd.
Explanations for 450mm FOUP/ FOSB Load Port(E154) Tsutomu Okabe, TDK Corporation
450mm Process Module Physical Interface Standard Activity Supika Mashiro, TOKYO ELECTRON LTD.

22. JRSC Planning Meeting 2011 Date: August 26 (Fri.) @ SEMI Japan office
JRSC Business Meeting (10:00-12:00)
Luncheon & Leadership Training (12:15-13:15)
38 attendees
Essential points of Revised Regulations (June, 2011) and Revised PG (July, 2011)
Planning Meeting (13:30-17:00)
Theme: How can SEMI International Standards Program be self-sustainable?
What business model can secure SEMI International Standards Program?
31 participants divided 3 groups for discussion
Lively discussion with many comments