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Sensing of temperature, humidity, and pressure in a MEMS remote aerial payload
Undergraduate student: Matthew Nakamura PI: Assistant Prof. Joseph J. Brown Office: Department Office: Web: Department of Mechanical Engineering, UH Mānoa
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Q: How can we directly sense environmental conditions in air column?
A: MEMS environmental sensor payload with independent power and data transmission. Mobile power: 9V battery Base station Payload
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8-week Design-Build-Test cycle
8/31 project start 10/10 operational electronics 10/18 casing prototyped, operation in lab 10/25 field operation One undergraduate student, <$100
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Bosch BME280 Environmental Sensor $20+shipping 1.8 µW when active
Temp: -40 to + 85 °C Pressure: 30 – 110 kPa Humidity: accuracy to ±3% RH Size: 2.5 x 2.5 x 0.95 mm
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Data Handling and Transmission
Arduino Nano microcontroller 1.4 W at full power $22 + shipping Transceiver NRF24L01, Nordic Semiconductor 37.2 mW when in use 2 MBps data rate Clear line of sight needed 2.4 GHz channel $12 + shipping
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Combined System Total mass incl. battery: 114.53 g
Dimensions 10 x 6.5 x 2 cm Volume: 130 cm3 Combined System Microcontroller Sensor Transceiver
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Unpackaged base station
Transceiver NRF24L01, Nordic Semiconductor Arduino Uno microcontroller Direct connection to computer USB
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Live remote sensing operation
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With 3 toy drones, not quite enough load capacity
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Flight Test 10/25: Enough Capacity, Some Data Hiccups
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Other sensor systems can be similarly implemented or added.
Conclusions In 8 weeks we prototyped and operated a mobile environmental sensing payload. Other sensor systems can be similarly implemented or added. Shrink footprint by consolidating electronics, sensors, and packaging, and by device miniaturization.
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Materials integration from fundamentals to applications
This work brought to you by: UHM Micro/Nano Lab Asst. Prof. Joseph J. Brown, Ph.D. Department of Mechanical Engineering University of Hawai‘i at Mānoa Materials integration from fundamentals to applications Applied Research Themes Freestanding nano-thickness structure. Interfaces: Structural, fluid, electromagnetic Microdevice engineering Nanomaterial-based fabrication Further reading: US Patent , issued March 2018. J.J. Brown et al. Nanotechnology, 2016, 27, N.T. Eigenfeld, et al. Advanced Materials, 2014, 26, 3962. Acknowledgments: Applied Research Lab, UH Mānoa Micro/Nano Group members Mechanical Engineering Department Marvin Young for connection to ARL Thermoacoustic transducer made with 34 nm thick nanobridges.
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