1. Allegro ECAD-MCAD Co-design using EDMD (IDX) Format
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2. ECAD-MCAD Design Challenges
Problems faced in the design of products which have both Mechanical and Electrical Components:
Small enclosures require accurate
placement, keepins, keepouts.
Thermal analysis of singular or multiple boards within their enclosures
ODM’s face menu different design challenges in today's market to create a product used in a wide range of environments. Miniaturization of devices for more and more hand-held applications, Complex server and telecommunication center equipment where thermal issues must be resolved. Complex measurement systems requiring near perfect alignment. The requirements to meet the challenges is raising the need of better communication between the electrical and mechanical.
Connectors and mounting holes for the connector must move as one
Alignment of optical sensing devices.
Assembly screw shorting electrical connection on PCB.

3. ECAD-MCAD Design Challenges
A complex milled shield must align exactly with the PCB.
Detailed electrical and mechanical data is required for accurate thermal or EMI analysis.
Various design and analysis tools are used to ensure a good design that will give the consumer a reliable product.
RF shielding design, thermal characteristics, form/fit, and more factors are evaluated based on the exchange of data from on system to another.
Complete product modelling and some way of managing the process for traceability to reduce development time and prototyping costs.

4. EDMD – The Next Generation of ECAD/MCAD Collaboration
Advantages that EDMD brings over the current methodologies:
Incremental design allowing closer collaboration between the MCAD and ECAD engineer.
Ability to send notes/messages between MCAD and ECAD so they are aware of why changes are made.
Traceability of what was changed, by who, and why the change was made.
Developed by the ProSTEP IVIP organization and is an active format.
More detail (such as copper and trace information) can be sent in the latest version of the format.
The most common used formats today are DXF and IDF. Both have been the main method of data exchange between ECAD and MCAD tools for many years. The formats have changed little over the years. The formats have also have a “All or nothing” exchange process. The EDMD Schema or IDX, offers more of a collaborations where not only are changes incremental, but accept/reject/re-propose capabilities are part of the process.

5. EDMD – Cadence® Allegro®
EDMD schema based ECAD-MCAD co-design
Incremental design data exchange
Ability to accept/reject
Supported by PTC®, Siemens, SolidWorks®.

6. EDMD – Baseline Process Flow MCAD Based
MCAD Designer creates initial board data.
MCAD Designer exports baseline file.
Board Outline
Restrict Areas
Components
Allegro Designer imports baseline file.
MCAD and ECAD databases are in sync.
Allegro PCB Editor
MCAD Tool
baseline.idx
Import IDX
Export IDX

7. EDMD – Change Process Flow MCAD Based
MCAD Designer modifies baselined design
MCAD Designer exports incremental .idx file.
All changes are proposals
Allegro Designer imports incremental file.
Allegro Designer Accepts/rejects proposals file.
Allegro Design exports transaction file.
MCAD Imports transaction file.
MCAD and ECAD databases are in sync.
transaction.idx
Allegro PCB Editor
Import IDX
MCAD Tool
Export IDX
Incremental.idx
Export IDX
Import IDX

8. EDMD – Allegro User Interface Proposed Change Preview
Selected object
Object Highlighted with window zoom
The Allegro User Interface will zoom and fit the window around the selected object that is to be modified displaying its modified state. Unselecting the object return the display and the object back to its previous state.

9. EDMD – Allegro User Interface Import Actions
Accepted Items
Rejected Items
Comments added for Rejection
The Allegro IDX user interface allows comments to be added to assist in the communication of changes, accept and reject states for feedback to the tool that proposed the original change. Allegro also allows the addition of comment when proposing modifications as well.