1. IEC TC93 Liaison Report DASC SC Alex Zamfirescu IEC USNC Technical Aadviser TC93 Convener IEC TC93 WG2 September,

2. TC93 meetings took place during the week of September 4 to 9, 2005
News from IEC TC93
TC93 meetings took place during the week of September 4 to 9, 2005
Hosted by Japan NC in Nara
TC93 WG1 and WG2 discussions included
Interoperability of international standards
Maintenance of IEC standards
Future candidates for IS
Analog VHDL (IEEE );
SystemC (IEEE P1666);
SystemVerilog (IEEE P1800);
IEEE 1647; IEEE 1850; IEEE 1500™ (Sponsor CSS); Extend 1603 for Radiation Hardening (RH&R)
Register Description Language; Numerics Ontology as PAS

3. Good progress on IEEE DASC Dual Logo Submissions
All DL Submissions were voted and approved by the P member countries
IEEE Std – IEEE Standard for Standard Delay Format (SDF) for the Electronic Design Process………… IEC
IEEE Std – IEEE Standard VHDL Language Reference Manual ………………………………….. …..IEC
IEEE Std – IEEE Standard Verilog® Hardware Description Language ………………………….. ………..IEC
IEEE Std – IEEE Standard for VITAL ASIC Modeling Specification……………………………….. ...IEC
IEEE Std – IEEE Standard for Advanced Library Format (ALF) Describing Integrated Circuit (IC) Technology, Cells, and Blocks …… IEC Ed. 1.0
IEEE ………………………………......IEC 62050
IEEE …………………………………..IEC 62142

4. IEC TC93 Std Maintenance Extract
IEC Publication Number
Kind
Feeder
Mnemonics
IEC Maint.
IEC ( ) DL
IEEE 1076
VHDL
2007
IEC ( )
IEEE 1149
MVL9
2004
IEC ( )
IEEE
VHDLMATH
IEC ( )
IEEE
VHDLNUM
2000
IEC ( )
IEEE 1364
VERILOG
2006

5. Discussion about VHDL IEEE/IEC DL Maintenance
The first four standards (on previous slide) are in the process of being merged into one LRM with additional VHPI documentation
The group (WG2) agreed that the only alternative left for IEC participation is to wait until IEEE draft comes for ballot, form Accellera now jointly working on the documentation with the IEEE VASG.
Note that IEC was not invited to form a joint working group as required by the DL procedures agreed upon in the IEEE-IEC MOU on DL maintenance (summary of the MOU was circulated twice in DASC SC minutes, and attached again to this report – next 4 slides).
No draft was circulated so far to IEC (possibly in contradiction to DASC SC assigned actions).

6. Maintenance Procedure An IEC-TC/SC needs to revise an
IEC-IEEE standard
IEEE needs to revise an IEC-IEEE standard
MCR
PAR
INFO
IEC and IEEE agree on a common need
IEC disagrees
see note 1
IEEE disagrees see note 2
YES
Dual logo maintenance team (DLMT) set up with members from IEC and IEEE and a convenor jointly accepted
( see note 3 )
Maintenance
Procedure
Dual logo maintenance process see pages 2/3

7. Maintenance Procedure The DLMT prepares a draft for comments (CD)
IEC National Comments
( 3 months )
IEEE experts internal ballot
( electronic )
The DLMT prepares a common compilation of comments with possible proposals for change
IEC-TC/SC takes decision by correspondance or at a TC/SC meeting
CDV OK? See note 4
IEEE takes decision for the next step ( possibly a second internal ballot )
INFO
Ballot OK
See note 4
The DLMT prepares a second draft based on commonly agreed changes
IEC votes on CDV
(5 months)
IEEE sponsor ballot
( days ) NO
YES
See note 5
Maintenance
Procedure

8. Revised IEC-IEEE standard
Positive
results
Positive
results NO NO
INFO
See note 6
YES
See note 6
IEEE final ballot. Once approved IEC submits the FDIS for final vote (2 months)
See note 7
Maintenance
Procedure
Revised IEC-IEEE standard
The DLMT prepares a common compilation of comments on the CDV together with
proposals to solve them
IEC-TC/SC takes final decisions on the comments by or at a meeting
IEEE takes final decisions on the comments received
INFO
The DLMT prepares the FDIS based on commonly agreed modifications.

9. Maintenance Procedure Notes
Note 1 – IEC may decide to continue its own route. If any material is used from the IEC/IEEE standard, a separate license agreement will be required.
Note 2 – IEEE may decide to continue its own route leading to publish a revised single IEEE logo standard replacing the previous one. If so IEC will withdraw the existing IEC-IEEE standard. Then IEEE may submit to IEC this new standard as a candidate for a possible new IEC-IEEE standard according to the agreement.
Note 3 – The organisation which initiates the process, proposes a convenor first. If the proposal is not accepted by the other organisation, another convenor has to be chosen amongst the members of the DLMT by mutual agreement.
Note 4 – At this stage, IEC or IEEE are requested to task the DLMT to provide a new draft for comments
Note 5 – The 2 ballot processes must be carried out in such a way that the deadlines are the same
Note 6 – At this stage, IEC or IEEE may decide either to continue their respective route or to task the DLMT to provide a new draft for vote by both organizations. If IEC decides to continue its own route, then note 1 applies. If IEEE decides to continue its own route then note 2 applies.
Note 7 – The comments made at this stage must be limited to corrections of misspelling or obvious errors which may have been generated during the preparation of the FDIS.

10. Discussion about Verilog® IEEE/IEC DL Maintenance
The Verilog® situation is unfortunately similar.
The IEC was not contacted to form a joint working group. However from the reports of WG1 we (the IEC TC93) know that some unprecedented deprecation took out nearly half of the LRM and the semantic of important functions used to interoperate tools and integrate applications.
Therefore, there is a proposal to re-affirm the IEC Verilog (in 2006) without modifications. That will make sure that a standard including the IEEE version will still be a live standard.
Decision should be reached by end of September (to keep Verilog as is in the IEC, to seek standardizing at the international level the new IEEE version or to do nothing).

11. Future Work Towards clarifying DL Std maintenance issues
Develop roadmap for next generation standards
Language independent numerics, TC93 WG2 will participate in DASC/DATC 2005 Workshop
Analyze EDA relevance of efforts like SPIRIT and SAE Architecture Std.
Standards to support Statistical EDA, 3D, Farming
Plans to simplify standardization by separating PASs from STDs
Involve all available experts from around the globe