1. Japan Packaging Committee Liaison Report
May, 2011
SEMI Japan
Venue, Location, Date

2. Contents Committee Meeting Information Committee Structure
Publications
Ballot Result
Ballots for Cycle 4
Task Force Reports

3. Committee Meeting Information
Previous Committee Meeting
20 April, 2011 at SEMI Japan Office
Next Committee Meeting
5 August, 2011 at SEMI Japan Office

4. Committee Structure
Disbanded

5. Publications Published Standards
SEMI G , New Standard: Specification for Tape Frame for 450 mm Wafer
Developed by Japan 450mm Assembly Test Die Preparation TF
SEMI G , New Standard: Specification for Leadframe Strip Size
Developed by Leadframe Strip Size Stds TF

6. Ballot Results 5 years review New Standard
37 Reapproval ballots passed
For more information, please see the minutes or the Committee Express Report (CER) on the website.
New Standard
Doc.4563A, New Standard: Specification for 300mm Wafer Coin-Stack Type Shipping Container used for Test and Packaging Processes passed.

7. Ballots in Cycle 4
Doc.4814, New Standard: Specification for Tape Frame Cassette for 450 mm Wafer
Doc.4965, New Standard: Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in Backend Process
The two ballots will be adjudicated at the next committee meeting.

8. TF Reports: Japan 450mm Assembly Test Die Preparation Task Force
The TF developed the following ballots.
Doc.4814, New Standard: Specification for Tape Frame Cassette for 450 mm Wafer
Doc.4965, New Standard: Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in Backend Process

9. TF Reports: Wafer Shipping Container for Assembly &Packaging Task Force
Doc4563A, Specification for 300 mm Wafer Coin-stack Type Shipping Container Used for Test and Packaging Processes
was balloted in Cycle 2 and passed at the previous committee meeting.
will be published soon.

10. TF Report: Leadframe Strip Size Stds Task Force
SEMI G , New Standard: Specification for Leadframe Strip Size
was published.
The TF was disbanded at the previous committee meeting.

11. TF Report: Pd PPF Solder Wettability Measurement Task Force
The TF meets once every two months. A SNARF will be submitted in the near future.

12. TF Report: Solder Sphere Size Measurement Task Force
New SNARF for Measurement Method for Solder Sphere Size for Ball Grid Array Package
Will be submitted at the next committee meeting.

13. TF Report: Other Task Forces
DFM Study Group
did not meet.
Electromagnetic Characterization Study Group
Mikio Kiyono (ATE), who is the Study Group leader, decided to be TF member of 3DIC and HBLED committees.
Handling & Packaging Materials for Assembling Advanced Electronic Device under Clean Environment Task Force
Packages & Packaging Materials Eco-efficiency Task Force

14. SEMI Japan, Standards coordinator
Question?
Thank you.
SEMI Japan, Standards coordinator
Hirofumi Kanno