1. Liaison Report February 2011
North America 3DS-IC Committee (Three-dimensional Stacked Integrated Circuits)
Liaison Report
February 2011

2. Outline Leadership Organization Chart Meeting Information
New TFOF/SNARF
Task Force Updates
February 2011
NA 3DS-IC Committee

3. Leadership Committee Co-chairs Urmi Ray (Qualcomm)
Andy Rudack (SEMATECH)
Chris Moore (Semilab)
February 2011
NA 3DS-IC Committee

4. Organization Chart NA 3DS-IC Committee Wafer Bonded Stacks TF
C: Urmi Ray (Qualcomm)
C: Andy Rudack (SEMATECH)
C: Chris Moore (Semilab)
Wafer Bonded Stacks TF
L: Andy Rudack (SEMATECH)
Inspection & Metrology TF
L: Chris Moore (Semilab)
Thin Wafer Handling TF
L: Urmi Ray (Qualcomm)
February 2011
NA 3DS-IC Committee

5. Meeting Information Last meeting Next meeting
January 12, 2011 (kick-off meeting) Via teleconference/web meeting
Next meeting
March 29 for NA Spring 2011 Meetings San Jose, California
February 2011
NA 3DS-IC Committee

6. NA 3DS-IC Committee Kick-off Meeting Held Jan 12 via teleconference/web meeting
Attendance
37 participants
Companies represented include:
Amkor, Applied Materials, ASE, Brooks Automation, Corning, DISCO, eda 2 asic, Entegris, eSilicon, EVG, ITRI, KLA-Tencor, Lasertec, Miraial, Nitto Denko, Olympus, Qualcomm, SEMATECH, Semilab, Sharp, SUMCO, TI
Discussed formation of three (3) proposed task forces
Wafer Bonded Stacks TF
Inspection & Metrology TF
Thin Wafer Handling TF
February 2011
NA 3DS-IC Committee

7. Task Force Updates 3DS-IC Wafer Bonded Stacks TF
Approved late January 2011
Charter:
The BWS Task Force will actively create and/or modify specifications that reflect bonded wafer stacks parameters and the wafer bonding process.
Scope:
Identify new wafer parameters that reflect adequate ranges for bonded wafer stacks
Modify/create document to reflect adequate ranges for bonded wafer stacks
Identify other SEMI standards that are adversely affected by BWS parameters
Update referenced standards: create/modify standards to reflect BWS parameters
Next Meeting:
February 23 (5:00 PM to 7:00 PM, Pacific) via teleconference/web meeting
February 2011
NA 3DS-IC Committee

8. Task Force Updates 3DS-IC Inspection & Metrology TF
Approved late January 2011
Charter:
Develop standards for metrology and inspection methods to be used in measuring the properties of TSV’s, bonded wafer stacks, and dies used in the 3DS-IC manufacturing process.
Scope:
Examples of needed standards include (but are not limited to):
TSV physical properties i.e. depth, top, bottom CD, side wall….
Bonded wafer stack properties i.e. overlay, bond inspection
Defect metrology
Dies ???
Next Meeting:
TBD
February 2011
NA 3DS-IC Committee

9. Task Force Updates 3DS-IC Thin Wafer Handling TF
Approved late January 2011
Charter:
Develop standards for reliable handling and shipping of thin wafers, dies (e.g., Micro-pillar Grid array -MPGA) used in 3DS-IC high volume manufacturing (HVM)
Define thin wafer handling requirements including physical interfaces used in 3DS-IC manufacturing.
Define shipping requirements, including packaging, reliability, and other relevant criteria. This will also include MPGA ship/handle requirements
Next Meeting:
February 16 (5:00 PM to 6:00 PM Pacific) via teleconference/web meeting
February 2011
NA 3DS-IC Committee

10. Task Force Updates 3DS-IC Thin Wafer Handling TF (cont’d) Scope:
Formulate a common set of requirements and prioritize critical areas for standardization, resulting in a short-list of required standards (inspection, shipping etc) in the topics listed below. Other topics may be added based on additional inputs
Thin wafer and Die Shipping related activities:
Examples: Shipping carriers for thin wafer (wafer cassette, box or frame), Shipping carrier for dies (MPGA), Reliability Test methods
Transportation vibration testing
Drop-shock
Other – new tests?
Thin wafer handling-related activities:
Examples: Process and Metrology Tools and Test methods
Whole wafer inspection for damage (crack, break etc)Macro level
Damage to features – microbump, pad etc micro level
Universal carrier concept
Automation
February 2011
NA 3DS-IC Committee

11. NA 3DS-IC Spring Meeting Schedule [DRAFT]
Tuesday, March 29
Wafer Bonded Stacks TF (8:00 AM to 12:00 noon)
Inspection & Metrology TF (8:00 AM to 12:00 noon)
Thin Wafer Handling TF (8:00 AM to 12:00 noon)
NA 3DS-IC Committee (1:00 PM to 5:00 PM)
SEMI Headquarters San Jose, CA
February 2011
NA 3DS-IC Committee

12. Thank You!
For more information or participate in any NA 3DS-IC activities, please contact Paul Trio at SEMI
February 2011
NA 3DS-IC Committee